• Electrical & Electronic Materials
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• v.7 no.1
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• pp.64-72
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• 1994

본 고는 현재 전기적 응용을 위한 수지 절연물의 진공/가압 수지-주형처리 분야에서 가장 앞선 기술과 연구개발력을 보유하고 있는 스위스의 Ciba-Geigy사와 최신의 진공성형 시스템을 개발, 생산하고 있는 독일의 Hedrich사 및 진공주형/자동가압 성형장비를 생산하는 스위스의 Vogel사 등을 최근에 방문하여 Epoxy, Polyurethane, Polyester 및 Silicone 수지 등의 수지절연시스템을 가지고 구조적으로 기포가 없으며 전기적, 기계적, 열적특성이 매우 우수하고 매끄러운 표면이 요구되는 수지 mold제품을 생산하는데 적용되고 있는 진공 수지-주형처리기술의 현황과 아울러 경화시간을 크게 단축시켜 생산자동화가 가능한 최신의 자동가압겔화(Automatic pressure gelation)/주입몰드공정(Injection molding process)의 특징 및 기술개발현황에 대해 파악한 내용을 소개하고자 한다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.284-284
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• 2010

We report a fabrication of 6, 13-bis(triisopropylsilylethynyl) (TIPS) pentacene nanowires that made on Si substrates by liquid bridge-nanotransfer molding (LB-nTM) with polyurethane acrylate (PUA) mold. LB-nTM is based on the direct transfer of various materials from a stamp to a substrate via a liquid bridge between them. In liquid bridge-transfer process, the liquid layer serves as an adhesion layer to provide good conformal contact and form covalent bonding between the TIPS-pentacene nanowire and the Si substrate. The patterned TIPS-Pentacene nanowires have been investigated by Atomic force microscopy (AFM), Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM) and electrical properties.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.282-282
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• 2010

We report a new method of fabrication of polydiacetylene nanowire using liquid bridge-mediated nanotransfer molding (LB-nTM), a direct patterning method for the formation of two- or three-dimensional structures with feature sizes between tens of nanometers and tens of micron over large areas with various materials from a molder to a substrate via a liquid bridge between them. First, we fabricate assembled diacetylene monomer nanowire on the substrate then make it polymerize using 254nm UV-light irradiation. The Polydiacetylene nanowires have been investigated by UV-visible absorption spectroscopy, atomic force microscopy (AFM), and scanning electron microscopy (SEM).

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.464-464
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• 2011

We report a method to fabricate a large-area metal nanowire-grid polarizer. Liquid-bridge-mediated nanotransfer molding (LB-nTM) is based on the direct transfer of metal nanowires from a mold to a transparent substrate via liquid layer. A metal particle solution is used as an ink in the LB-nTM, which can be used for the formation of metal nanowires. The nanowires have higher depth are preferred for high transmittance. The height of nanowires that we made is about 140 nm. Large-area WGP is fabricated with good average transmittance of 74.89% in our measuring range.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.537-537
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• 2012

We have studied a fabrication of vapor phase polymerized Poly(3,4-ethylenedioxythiophene) (PEDOT) nanowire arrays for the first time. The vapor-phase polymerization (VPP) technique is a bottom-up processing method that utilizes the organic arrangement of macromolecules to easily produce ordered aggregates, including on the nanoscale, or prepare thin films of self-assembled molecules, micropatterns, or modified microstructures of pure conducting polymers. Also, liquid-bridge-mediated nanotransfer molding (LB-nTM), which was reported as a new direct patterning method recently, is for the arrayed formation of two- or three-dimensional structures with feature sizes as small as tens of nanometers over large areas up to 4 inches across and is based on the direct transfer of various materials from a mould to a substrate through a liquid bridge between them. The PEDOT nanowires grown by VPP method and transferred on a substrate to use LB-nTM method have been fabricated to single crystal PEDOT nanowires investigated Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Selected Area Electron Diffraction (SAED), X-Ray Diffraction (XRD), X-ray Photoelectron Spectroscopy (XPS), and electrical properties.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.69-73
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• 2008

본 연구에서는 고분자 플라스틱 부품의 친환경 외장성형공법인 Insert Film 사출성형공법중 첫 번째 공정인 진공성형공정에서 진공금형의 표면온도 균일화 기술에 대해 연구를 수행하였다. 진공금형의 온도분포 균일화를 위한 금형설계 및 설계된 금형에 대한 온도분포 평가를 위한 ANSYS를 이용한 유한요소열해석을 수행하였으며, 이때 정상상태 및 과도상태를 함께 평가하였다. 설계 결과를 바탕으로 금형을 제작하였으며, 생산성을 고려하여 4캐비티로 제작된 금형에 대해 금형표면의 온도분포 평가실험을 수행하였다. 또한 금형내 캐비티 온도센서 및 제어시스템을 설치하여 진공금형표면 온도분포가 항상 일정하게 유지될 수 있도록 금형시스템을 개발하였다. 결과적으로 일정한 온도범위의 금형표면온도제어가 가능하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.83-83
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• 2010

We report a new direct printing method, called liquid-mediated nanotransfer molding (LB-nTM), that uses a polar liquid-mediated transfer process. LB-nTM is based on the direct transfer of various materials from a stamp to a substrate via a liquid- bridge between the stamp and the substrate. This procedure can be adopted in automated printing machines that generate various material patterns with a wide range of feature sizes (as small as 60 nm) on diverse substrates. To demonstrate its usefulness, the LB-nTM method was applied to prepare ZnO-nanowire and TIPS-pentacene transistors.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.85-85
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• 2010

We report a new direct printing method, called liquid-mediated nanotransfer molding (LB-nTM), that uses a polar liquid-mediated transfer process. LB-nTM is based on the direct transfer of various materials from a stamp to a substrate via a liquid- bridge between the stamp and the substrate. This procedure can be adopted in automated printing machines that generate various material patterns with a wide range of feature sizes (as small as 60 nm) on diverse substrates. The patterns have been investigated by scanning electron microscopy(SEM).

• Journal of Institute of Convergence Technology
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• v.5 no.1
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• pp.13-17
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• 2015

In wafer level molding progress, the thermal releasing failure phenomenon is shown up as the important problem. This phenomenon can cause the problem including the warpage, crack of the molded wafer. The thermal releasing failure is due to the insufficiency of adhesion strength degradation of the molding tape. To solve this problem, we studied experimental method increasing the release property of the molding tape through the plasma surface treatment on the wafer substrate. In this research, the vacuum plasma treatment system is used for release property improvement of the molding tape and controls the operating condition of the hydrophilic($O_2$, 100kW, 10min) and hydrophobic($C_2F_6$, 200kW, 10min). In order to perform the peeling test for measuring the releasing force precisely, we remodel the micro scale material property evaluation system developed by Korea institute of industrial technology. In case of hydrophilic surface treatment on the wafer substrate, we can figure out the releasing property of molding tape increase. In order to grasp the effect that it reaches to the release property increase when repeating the hydrophilic treatment, we make an experiment with twice treatment and get the result to increase about 12%. We find out the hydrophilic surface treatment method using plasma can improve releasing property of molding tape in the wafer level molding process.

• Composites Research
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• v.28 no.5
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• pp.291-296
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• 2015

In this study, structural design and analysis of the automobile bonnet is performed. The flax/vinly ester composite material is applied for structural design. The Vacuum Assisted Resin Transfer Molding-Light (VARTML) manufacturing method is adopted for manufacturing the flax fiber composite bonnet. The VARTML is a manufacturing process that the resin is injected into the fly layered-up fibers enclosed by a rigid mold tool under vacuum. A series of flax/vinyl ester composite panels are manufactured, and several kinds of specimens cut out from the panels are tested to obtain mechanical performance data. Based on this, structural design of the automobile bonnet is performed.