• Journal of Welding and Joining
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• v.19 no.1
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• pp.65-74
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• 2001

A study on the corrosion behavior in case of As-welded and PWHT temperature 55$0^{\circ}C$ of welding part of RE36 steel for marine structure was investigated with parameters such as micro-Vickers hardness, corrosion potential measurement of weld metal(WM), base metal(BM) and heat affected zone(HAZ), both Al anode generating current and Al anode weight loss quantity under sacrificial anode cathodic protection conditions. And also we carried out slow strain rate test(SSRT) in order to research both limiting cathodic polarization potential for hydrogen embrittlement and optimum cathodic protection potential as well as mechanical properties by post-weld heat treatment(PWHT) effect. Hardness of HAZ was the highest among three parts(WM, BM and HAZ) and the highest galvanic corrosion susceptibility was HAZ. And the optimum cathodic polarization potential showing the best mechanical properties by SSRT method was from -770mV to -875mV(SCE). In analysis of SEM fractography, applied cathodic potential from -770mV to -875mV(SCE) it appeared dimple pattern with ductile fracture while it showed transgranular pattern (Q. C : quasicleavage) under -900mV(SCE). However it is suggested that limiting cathodic polarization potential indicating hydrogen embrittlement was under -900mV(SCE).

• Proceedings of the IEEK Conference
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• 2004.08c
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• pp.717-722
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• 2004

A design was done, and all characteristic of photodetectr of the web pattern type which a standard process of the Bipolar which Si PIN structure was used in this paper, and was used for the current amplifier design was used, and high-speed, was used as receiving optcal area of high altitude, and the module which had a low dark current characteristic was implemented with one chip with a base. Important area decreases an area of Ie at the time of this in order to consider an electrical characteristic and economy than the existing receiving IC, and performance of a product and confidence are got done in incense. First of all, the receiving IC which a spec, pattern of a wafer to he satisfied with the following electrical optical characteristic that produced receiving IC of 5V and structure are determined, and did one-chip is made. On the other hand, the time when AR layer of double is $Si_{3}N_{4}/SiO_{2}=1500/1800$ has an optical reflectivity of less than $10{\%}$ on an incidence optical wavelength of 660 ,and, in case of photo detector which reverse voltage made with 1.8V runs in 1.65V, an error about a change of thickness is very the thickness that can be improved surely. And, as for the optical current characteristic, about 5 times increases had the optical current with 274nA in 55nA when Pc was -27dBm. A BJT process is used, and receiving IC running electricity suitable for low voltage and an optical characteristic in minimum 1.8V with a base with two phases is made with one chip. IC of low voltage operates in 1.8V and 3.0V at the same time, and optical link receiving IC is going to be implemented

• Polymer(Korea)
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• v.27 no.4
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• pp.313-322
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• 2003

The morphology of poly(ethylene terephthalate) (PET)/poly(m-xylene adipamide) (MXD-6) blends, which was prepared by adding compatibilizer and interchange reaction agent, was investigated. The morphological change in the stretched blend films was also studied. The stretched film showed a dispersed MXD-6 fibril. This fibril became finer with increasing draw ratio (DR). The addition of compatibilizer and interchange reaction agent had no effect on the improvement of interfacial adhesion but caused a defect between the continuous phase and the dispersed phase, leading to the formation of irregular fibril. The change in the superstructure of blends with composition and draw ratio was examined with light scattering (LS). The H$\sub$v/ LS patterns showed a double-cross type pattern consisting of a broad rod-like pattern and a sharp cross streak. On the basis of the model calculation of the H$\sub$v/ pattern, it was found that the appearance of the double-cross type pattern was attributed to the stacking of crystals oriented along the draw direction. The crystals were gradually oriented to the stretching direction with draw ratio. As a result, the high level of orientation was obtained fur the sample of draw ratio is 6.0.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.590-595
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• 2004

The shape and size variations of the nanopatterns produced on a positive photoresist using a near-field scanning optical microscope(NSOM) are investigated with respect to the process variables. A cantilever type nanoprobe having a 100nm aperture at the apex of the pyramidal tip is used with the NSOM and a He-Cd laser at a wavelength of 442nm as the illumination source. Patterning characteristics are examined for different laser beam power at the entrance side of the aperture( $P_{in}$ ), scan speed of the piezo stage(V), repeated scanning over the same pattern, and operation modes of the NSOM(DC and AC modes). The pattern size remained almost the same for equal linear energy density. Pattern size decreased for lower laser beam power and greater scan speed, leading to a minimum pattern width of around 50nm at $P_{in}$ =1.2$\mu$W and V=12$\mu$m/. Direct writing of an arbitrary pattern with a line width of about 150nm was demonstrated to verify the feasibility of this technique for nanomask fabrication. Application on high-density data storage using azopolymer is discussed at the end.

• Journal of Powder Materials
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• v.22 no.3
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• pp.169-174
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• 2015

The optical film for light luminance improvement of BLU that is used in LCD/LED and retro-reflective film is used as luminous sign consist of square and triangular pyramid structure pattern based on V-shape micro prism pattern. In this study, we analyzed machining characteristics of Cu-plated flat mold by shaping with diamond tool. First, cutting conditions were optimizing as V-groove machining for the experiment of micro prism structure mold machining with prism pattern shape, cutting force and roughness. Second, the micro prism structure such as square and triangular pyramid pattern were machined by cross machining method with optimizing cutting conditions. Burr and chip shape were discussed with material properties and machining method.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.659-661
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• 1988

SPM is MDC Processor for string pattern expressed in directional chain code. In this paper we consider the string pattern matching algorithm (Leve-nstein Algorithm) whitch is portion of Dynamic Programing, and propose architecture of SPM and simulate it on the R-T level to evaluate its architecture. We used the C language as the hardware description language, and developed it on the IBM PC/AT Zenix system V OS environment.

• The Journal of the Acoustical Society of Korea
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• v.28 no.4
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• pp.299-307
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• 2009

In this study, the acoustical properties of micro-speaker had been studied as a function of diaphragm patterns. The diaphragm was divided into two sections, such as edge and dome sides. The pattern change at each side affected the tensile strength of diaphragm. As a result, the resonance frequency was varied with the change. With increasing the number of pattern at the edge side, it was increased at the first, but it reversed to the exponential decrease of that. It increased due to the increase of tensile strength to be caused by using "U" type of drill and whirlwind pattern, and decreasing of drill angle at the edge side. However, it was decreased due to the decrease of tensile strength to be by increasing the number of radiation pattern and dome hight, and decreasing the dome radius at the dome side.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.3
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• pp.407-412
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• 2012

This study investigated the process of thermal-induced growth of micro-crack developed at the crystalline solar cell using EL image, determined the output characteristic according to the pattern of micro-crack, analyzed the I-V characteristic according to the pattern of crack growth, and predicted the output value using simulation. The purpose of this study was, therefore, to investigate the process of thermal-induced growth of micro-crack developed at the early stage of PV module completion using EL image, to analyze the resulting decrement of output and predict the output value using simulation. It was observed that the crack grew increasingly by the thermal condition, and accordingly the lowering of output was accelerated. The output values of crack patterns with various direction were predicted using simulation, resulting in close I-V curve with only around 4% of error rate. It is considered that it is possible to predict the electric characteristic of solar cell module using only pattern of micro-crack occurred at solar cell based on our results.

• Journal of the Korean Society of Safety
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• v.25 no.6
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• pp.86-91
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• 2010

The purpose of this study is to analyze the damage patterns and metal structure of 3 phase mold transformers collected from places where accidents have occurred. Compared to an oil-immersed transformer, a mold transformer has the advantage of requiring a smaller installation area and can be kept clean, while its disadvantages include the fact that abnormal symptoms of an accident are difficult to discover and its repair is impossible. The capacity of the mold transformers collected from places where accidents have occurred was 200kVA with primary voltages being F23,900V, R22,900V, 21,900V, 20,900V, 19,900V, etc., as well as secondary voltages being 380V, 220V, etc. It was found from the analysis on the diffusion of combustion in the damaged mold transformers that fire occurred first inside the U-phase primary winding and that carbonization and heat were diffused to V-phase and W-phase in V-pattern. In addition, from the analysis on the cross-sectional structure of the metal of the melted high voltage winding using a metallurgical microscope, it was found that the boundary surface, voids, and columnar structure were formed when an interlayer short-circuit had occurred Therefore, even though it is not possible to find the cause for the occurrence of an interlayer short-circuit at the inner side of the primary winding, it is thought that, due to the thermal energy generated when the short-circuit occurred, the heat source was diffused to the upper side and outside, causing a secondary accident.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.759-762
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• 2005

The LGP(Light Guide Panel) for the back light unit that is used to the 2.2" TFT LCD was designed and fabricated. The method of the pattern design which is the most important in the design of the LGP was converted the V-cutting method into the Dot method. This newly developed Dot method provided a good uniformity in the brightness at the LGP, which was a very difficult problem to solove in the V-cutting method. The experiment result of the newly designed LGP shows the brightness uniformity 90% and the brightness 3656 $cd/\;m^2$ which is 20% higher than the commercial products.