• Composites Research
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• v.30 no.6
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• pp.356-364
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• 2017

Composite lattice structures are tried to be used in various fields because of its benefit in physical properties. With increase of demand of the composite lattice structure, nondestructive testing technology is also required to certificate the quality of the manufactured structures. Recently, research on the development of the composite lattice structure in Republic of Korea was started and accordingly, fast and accurate non-destructive evaluation technology was needed to finalize the manufacturing process. This paper studied non-destructive testing methods for composite lattice structure using laser ultrasonic propagation imaging systems. Pulse-echo ultrasonic propagation imaging system was able to inspect a rib structure wrapped with a skin structure. To reduce the time of inspection, a band divider, which can get signal in different frequency bands at once, was developed. Its performance was proved in an aluminum sandwich panel. In addition, to increase a quality of results, curvature compensating algorithm was developed. On the other hand, guided wave ultrasonic propagation imaging system was applied to inspect delamination in a rib structure. To increase an area of inspection, multi-source ultrasonic wave propagation image was applied, and defects were successfully highlighted with variable time window amplitude mapping algorithm. These imply that ultrasonic propagation imaging systems provides fast and accurate non-destructive testing results for composite lattice structure in a stage of the manufacturing process.

• Journal of Sensor Science and Technology
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• v.9 no.6
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• pp.404-415
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• 2000

This paper describes several performances and nondestructive inspection for deterioration due to forest fires in overhead transmission lines. After discussing corrosion mechanism such as atmospheric and galvanic corrosion for aged ACSR conductors and its detection for them are presented. Through impedance analysis of a solenoid coil, it is shown that the eddy current sensor may be available to inspect severe fault or local corrosion. As the solenoid coil changes its impedance when the test conductor is inserted into the coil, it can be possible to measure deterioration degree caused by forest fires. Tensile strength, extension rate and sensor impedance are tested for some samples degraded by artificial fire. As increasing blazed period to some extent, the strength of aluminum strand begins to be reduced remarkably, while galvanized steel strand holds the similar strength to the initial value, despite of appearing a little loss of zinc layer. In general, it is shown that the sensor impedance would be increased while the tension load of conductor is reduced and the extension rate is contrarily increased. Therefore, the sensor output could exhibit the changes of mechanical performances, and would be used to detect such deterioration caused by forest fire in ACSR conductors built on the ridge of mountains. Finally, it was verified that the solenoid coil could be applicable to obtain any crucial inform for serious deterioration due to forest fires.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.10
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• pp.1189-1193
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• 2012

The Miniaturized Fingerprint Imager (MFI) is a slim optical mouse that can be used as an input device for application to wireless portable personnel communication devices such as smartphones. In this study, we have fabricated key optical components of an MFI, including the illumination optical components and imaging lens. An LED beam-shaping lens consisting of an aspheric lens and a Fresnel facet was successfully machined using a diamond turning machine (DTM). A customized V-shaped groove for beam path banding was fabricated by the bulk micromachining of silicon that was coated with aluminum using the shadow effect in thermal evaporation. The imaging lens and arrayed multilevel Fresnel lenses were fabricated by electron beam lithography and FAB etching, respectively. The proposed optical components are extremely compact and have high optical efficiency; therefore, they are applicable to ultraslim optical systems.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Microbiology and Biotechnology Letters
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• v.26 no.3
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• pp.206-212
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• 1998

The effects of the pretreatment with coagulants on the recovery efficiency of poly (3-hydroxybutyrate, PHB) synthesized in Alcaligenes eutrophus were investigated. Al-base or Fe-base coagulants, and the dispersion method of 30% hypochlorite solution and chloroform were used as coagulants and PHB recovery method, respectively The recovery efficiency of PHB from the cells harvested with Al-base coagulants at the range from 0 to 1000 mg-Al/L was similar to that from cells harvested without the coagulants. At these conditions, the concentrations of residual aluminium in the purified PHB were below 250 mg-Al/kg-PHB, indicating the effect of residual aluminum on the characteristics of the purified PHB can be insignificant. When the dosage of coagulants was over 1000 mg-Al/L, the PHB recovery remarkably decreased with increasing the coagulant dosage. However, the PHB recovery could be enhanced by the use of 50% hypochlorite solution instead of 30% hypochlorite solution. Even though the reduction of PHB recovery efficiency was not found by using Fe-base coagulants, the purified PHB was stained pale red due to residual iron, These results suggest that the use of Al-base coagulants did not exert bad influence on neither PHB recovery efficiency and PHB purity.

• Corrosion Science and Technology
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• v.9 no.6
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• pp.276-280
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• 2010

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.6 s.121
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• pp.591-601
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• 2007

In this paper, the miniaturized radio frequency identification(RFID) tag antennas used in UHF band$(908.5{\sim}914MHz)$ are designed and fabricated by using the circular loop antenna(CLA). Miniaturization of CLA was possible to transform the structure of circular loop into the structure of meander line. In the case of double meander line CLA is reduced up to 83% compared with the general type CLA. The $S_{11}$, -10 dB bandwidth, and gain of double meander line CLA were -11.9 dB, 12 MHz(1.3%), and -1.18 dBd. Also, a small half-wavelength CLA using double meander line is designed and fabricated for flat snack bag coated aluminum. The antenna is reduced up to 92.1% except ground. It shows the $S_{11}$ of -16.5 dB, -10 dB bandwidth of 48 MHz(5%) and gain of -0.58 dBd. The radiation pattern shows omni-directional pattern in z-y plane(x-axis pol.). Through this result, we can confirm that miniaturized type CLAs using meander lines are suitable for miniaturized RFIB tag antennas with the UHF band.

• Journal of Korean Society of Environmental Engineers
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• v.22 no.1
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• pp.159-167
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• 2000

In recent years, combined and separated sewer overflows (CSOs, SSOs) have been recognized as a significant pollution problem. To solve this problem a series of experiments were performed in a small scale Rapid Floc Settler (RFS) device to determine its ability in removing micro particles and dissolved materials from polluted waters. The RFS device is a compact physico-chemical wasterwater treatment system. Polyacrylamide (PAM) is used as a coagulant for treating stormwater in the RFS. The results of Jar test showed that PAM could be an excellent coagulant as compared with aluminum sulfate. and ferric chloride. In several experimental conditions, the influence of different variation parameters was tested to measure the efficiency of the RFS. Tests have been carried out with typical CSOs concentrations (50~1.000mg SS/L). The treatment efficiency with regard to SS and COD, which can be obtained at an overflow rate of $130m^3/m^2/day$, are 90% and 80%, respectively. Comparing other sedimentation technologies with RFS, the overflows rate of RFS is ten times faster. The distribution of particle size and number were analyzed. The RFS is suitable for the treatment of CSOs and also the removal of settleable and dissolved materials in urban stormwater runoff.

• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.4
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• pp.299-304
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• 2007

There are to be some cracks on the material degradation part or the stress concentration parts of the main members, which carry on over-loads, of structures. Because these cracks can be used to evaluate the structural health status, it is important to monitor the crack growth for maintaining the structural safety. In this study, the fiber Bragg grating sensor with a drop ball was developed as a sensor for crack growth detection of an existing crack. The crack growth detection sensor was constructed with three parts: a probe part, a wavelength controling light source and receiver part, and an impact part. The probe part was just formed with a fiber Bragg grating optical fiber The wavelength controling light source part was composed of a current supplying circuit, a DFB laser diode, and a TEC controling circuit for wavelength control. Also, the impact part was just implemented by dropping a steel ball. The performance of this sensor was confirmed by the experiments of the crack detection with an aluminum plate having one existing crack. According to these experiments, the difference of the sensor signal outputs was correlated with the crack length. So, it was confirmed that this sensor could be applied to monitor the crack growth.

• Clean Technology
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• v.27 no.2
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• pp.139-145
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• 2021

The purpose of this study is to recover valuable metals from spent batteries using a dry process. We focused on the effect of the smelting temperature on the composition of recovered solid and liquid products and collected gaseous products. After removal of the cover, the spent battery was left in NaCl solution and discharged. Then, the spent battery was made into a powder form through a crushing process. The smelting of the spent battery was performed in a tubular electric furnace in an oxygen atmosphere. For spent lithium-ion batteries, the recovery yield of the solid product was 80.1 wt% at a reaction temperature of 850 ℃, and the final product had 27.2 wt% of cobalt as well as other metals such as lithium, copper, and aluminum. Spent nickel-hydrogen batteries had a recovery yield of 99.2 wt% at a reaction temperature of 850 ℃ with about 37.6 wt% of nickel and other metals including iron. For spent nickel-cadmium batteries, the yield decreased to 65.4 wt% because of evaporation with increasing temperature. At 1050 ℃, the recovered metals were nickel (41 wt%) and cadmium (12.9 wt%). Benzene and toluene, which were not detected with the other secondary waste batteries, were detected in the gaseous product. The results of this study can be used as basic data for future research on the dry recycling process of spent secondary batteries.