• 제목/요약/키워드: Ultrasonic-Assisted Chemical Machining

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불산대체용액을 이용한 유리의 초음파 가공 (Chemical-assisted Ultrasonic Machining of Glass by Using HF Substitute Solution)

  • 전성건;남권선;김병희;김헌영;전병희
    • 소성∙가공
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    • 제13권3호
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    • pp.262-267
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    • 2004
  • Ultrasonic machining has been known as one of the conventional machining methods in the glass fabrication processes. In ultrasonic machining, typically, glass is removed by the impulse energy of the abrasive generated by the ultrasonic power. However, when the machining feature decrease under hundreds of micrometers, as conventional ultrasonic machining uses only the impulse energy of the abrasive, the speed of ultrasonic machining decreases significantly and the surface roughness becomes deteriorated. To overcome this size effect, the chemicals which can erode glasses, such as HF, XF, etc, are added to the slurry. The chemical-assisted ultrasonic machining method, so called, is another alternating effective way for micro machining of glasses. In previous work, we used the hydrofluoric acid (HF) as an additive chemical. But, as the HF solution is too poisonous to be used as a ultrasonic process additive, it is needed to be substituted by other safe chemicals. As results of the machinability comparison of several chemicals, the GST-500F was selected to replace the HF. The GST-500F (pH $4.0{\pm}1.0$) is non-volatile, odorless. During experimental works, it was shown that the machining rate increases 1.5 times faster than the conventional ultrasonic machining. The machining load also decreases. However, the enlargement of the hole diameter and significant tool wear are still the problems to be solved.

화학적기법을 이용한 유리의 초음파가공 특성 (Characteristics of Chemical-assisted Ultrasonic Machining of Glass)

  • 김병희;전성건;김헌영;전병희
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1349-1354
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    • 2003
  • Ultrasonic Machining process is an efficient and economical means of precision machining on glass and ceramic materials. However, the mechanics of the process with respect to crack initiation and propagation, and stress development in the ceramic workpiece subsurface are still not well understood. In this research, we investigate the basic mechanism of chemical assisted ultrasonic machining(CUSM) of glass through the experimental approach. For the purpose of this study, we designed and fabricated the desktop micro ultrasonic machine. The feed is controlled precisely by using the constant load control system. During the machining experiment, the effects of HF(hydrofluoric acid) characteristics and machining condition on the surface roughness and the material removal rate are measured and compared.

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화학적 초음파가공을 이용한 유리의 미세가공 (Micro-machining of Glasses using Chemical-assisted Ultrasonic Machining)

  • 전성건;신용주;김병희;김헌영;전병희
    • 대한기계학회논문집A
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    • 제27권12호
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    • pp.2085-2091
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    • 2003
  • An ultrasonic machining process has been known as efficient and economical means fer precision machining of glass or ceramic materials. However, because of its complexity, the mechanism of the machining process is still not well understood. Therefore, it is hard to optimize the process parameters effectively. The conventional ultrasonic machining which uses the abrasive slurry only, furthermore, is time-consuming and gives the relatively rough surface. In order to increase the material removal rate and improve the integrity of the machined surface, we have introduced the novel ultrasonic machining technique, Chemical-assisted UltraSonic Machining(CUSM). The desktop-style micro ultrasonic machine has been developed and the z-axis feed is controlled by the constant load control algorithm. To obtain the chemical effects, the low concentration HF(hydrofluoric acid) solution, which erodes glass, added to alumina slurry. Through various experiments and comparison with conventional results, the superiority of CUSM is verified. MRR increases over 200%, the surface roughness is improved and the machining load decreases dramatically.

미세구멍의 방전가공에 관한 연구 (A Study on Micro-Hole Drilling by EDM)

  • 윤재웅;양민양
    • 대한기계학회논문집
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    • 제14권5호
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    • pp.1147-1154
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    • 1990
  • 본 연구에서는 초음파 화학 가공(ultrasonicassisted chemical mahining)을 이용하여 100$\mu\textrm{m}$이하의 전극봉을 제작하였고 제작한 전극을 이용하여 미세구멍을 방전 가공함으로써 가공특성을 파악하고, 방전액을 각각 등유(kerosene)와 물로하여 구멍의 표면을 비교, 분석하였으며 전극의 지름, 가공물의 두께에 대한 오버컷과 경사도(tap- er) 그리고 전극의 마멸을 조사하였다.