• Title/Summary/Keyword: Ultrasonic Excitation

검색결과 81건 처리시간 0.033초

초음파 여기를 이용한 물체 이송 시스템 개발에 관한 연구 (Development of the Object Transport System using Ultrasonic Wave Excitation)

  • 정상화;신병수;차경래;송석;이경형
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2003년도 춘계학술대회 논문집
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    • pp.371-375
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    • 2003
  • In recent years, as the semiconductor and the optical industry grows, the necessity of the transporting system for semiconductor and precision optical lens without damage increases. The transport system using ultrasonic wave is very suitable for this area. In this paper the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phase-difference between two ultrasonic wave generators are performed. The effect of transporting speed according to the change of weight and amplification voltage are verified. In addition, the system performance for actual use is evaluated.

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2-Mode초음파 여기 물체 이송 시스템 개발에 관한 연구 (Development of the object transport system using 2-Mode ultrasonic wave excitation)

  • 정상화;신병수;차경래
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2003년도 춘계학술대회논문집
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    • pp.956-959
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    • 2003
  • In the semiconductor and the optical industry a new transport system which can replace the common system is required. The common systems are driven by magnetic field and conveyer belt. The magnetic field damages semiconductor and contact force scratches the optical lens. The ultrasonic wave driven system solve these problem. In this paper the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phase-difference between two ultrasonic wave get orators are performed. The effect of transporting speed according to the change of weight and amplification voltage are verified. In addition, the system performance for actual use is evaluated.

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2-Mode 초음파를 이용한 물체 이송에 관한 연구 (A Study on Object Transport System Using 2-Mode Ultrasonic Wave)

  • 정상화;김택현;신병수;차경래
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.1170-1173
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    • 2003
  • In the semiconductor and the optical industry a new transport system which can replace the common system is required. The common systems are driven by magnetic field and conveyer belt. The magnetic field damages semiconductor and contact force scratches, the optical lens. The ultrasonic wave driven system solve these problem. In this paper the object transport system using the excitation of ultrasonic wave is proposed. the experiments for finding the optimal excitation frequency, finding phase-difference between two ultrasonic wave generators are performed. The effect of transporting speed according to the change of amplification voltage is verified. In addition, the system performance for actual use is evaluated

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Flexural Beam의 형태 변화에 따른 초음파 이송시스템의 동작특성에 관한 연구 (A Study on Motion Characteristics of the Ultrasonic Transporting System according to the change of Flexural Beam Shape)

  • 정상화;신병수;차경래
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2003년도 추계학술대회논문집
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    • pp.696-699
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    • 2003
  • In the semiconductor and the optical industry a new transport system which can replace the conventional sliding system is required. There systems are driven by magnetic field and conveyer belt. The magnetic field damages semiconductor and contact force scratches the optical lens. The ultrasonic wave driven system can solve these problem. In this paper, the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phase-difference between two ultrasonic wave generators are performed. The relationship of transporting speed according to the change of flexural beam shape is verified and the system performance for practical use is evaluated.

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초음파 이송 시스템에서 Flexural Beam의 형태 변화와 물체 이송과의 관계에 대한 연구 (A Study on the Relationship between Flexural Beam Shape and Transport Characteristics for the Ultrasonic Transport Systems)

  • 정상화;신병수
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2003년도 추계학술대회
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    • pp.25-29
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    • 2003
  • In the semiconductor and the optical industry a new transport system which can replace the conventional sliding system is required. These systems are driven by magnetic field and conveyer belt. The magnetic field damages semiconductor and contact force scratches the optical lens. The ultrasonic wave driven system can solve these problem. In this paper, the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phase-difference between two ultrasonic wave generators are performed. The relationship of transporting speed according to the change of flexural beam shape is verified and the system performance for practical use is evaluated.

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초음파를 이용한 물체 이송시스템의 동작특성 연구 (A Study on the Dynamic Characteristics of Object Transport System using Ultrasonic Wave)

  • 정상화;김현욱;차경래;최석봉;송석
    • 한국정밀공학회지
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    • 제22권8호
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    • pp.151-158
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    • 2005
  • In the semiconductor and the optical industry, a new transport system which can replace the conventional sliding systems is required. The sliding systems are driven by the magnetic field and conveyer belts. The magnetic field nay damage semiconductor and the contact force may scratch the optical lens. The ultrasonic wave driven system can solve these problems. In this paper, an object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal progressive frequency and the phase-differences between two ultrasonic wave generators are performed. The relationships between transportation speed and the excitation frequency, flexural beam shapes and amplification voltage are investigated.

초음파 물체 이송시스템에서 Flexural Beam 의 형태 변화에 따른 이송특성에 관한 연구 (Transport Characteristics according to Flexural Beam Shape for the Ultrasonic Transport Systems)

  • 신병수;정상화;차경래
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 추계학술대회
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    • pp.1608-1613
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    • 2003
  • In the semiconductor and the optical industry, a new transport system which can replace the conventional sliding system is required. These systems are driven by the magnetic field and the conveyer belt. The magnetic field damages semiconductor and contact force scratches the optical lens. The ultrasonic wave driven system can solve these problems. In this paper, the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phasedifference between two ultrasonic wave generators are performed. The relationship of transporting speed according to the change of flexural beam shape is verified. In addition, the system performance for practical use is evaluated.

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점토질 모래에서의 Ultrasonic을 이용한 투수성의 증진 (Ultrasonic Engancement of Flow in Clayey Sands)

  • 이광열
    • 물과 미래
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    • 제26권1호
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    • pp.63-69
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    • 1993
  • 매립이 완료된 Landfills이나 오염된 지하수의 오염물질을 제거하여 다른 용도로 재사용하는 기술이 오늘날 중요한 문제로 대두되고 있다. 진동을 이용하여 제가효율을 높히는 방법은 요즘 흔히 사용되고 있는 방법중의 하나이다. Ultrasonic의 효과를 사용함으로써, 기계적인 제거효과가 대단하다는 것은 이미 몇몇 연구자들에 의해 확인된바 있다. 이 연구에서는 Probe-Type Lutrasonic Processor를 사용하여 Clayey-Sand Chamber를 가지고 실험을 해보았다. 실험중 계속적인 Pumping과 함께 Ultrasonic을 작동시킨 결과, Clayey 입자들의 분리 및 제거에 큰 효과를 얻었으며, 그로 인하여 투수계수가 크게 증가하는 효과를 보았다. 또한, 실험 전과 후의 입자크기의 분포도가 크게 변했는데, 그 이유는 Ultrasonic의 진동효과 때문이다. 실험결과, 0.004mm 이하의 입자들은 Ultrasonic의 효과에 의해 Mobilize되었으며, 0.04-1.0mm의 입자는 부서져서 작은 입자로 되었다. 이 기구를 사용하기 위한 유지비와 전력비등을 고려하여 이 기구의 실용성을 검토해 보았다. 필요한 Power를 위해 요구되는 전력의 양은 깊이에 의한 대상 site의 응력, 온도, 그리고 Fuid의 Viscosity에 의해 좌우되며, 그중 가장 큰 영향을 미치는 요소는 흙의 깊이이다. 여러 가지의 다른 깊이에서의 경제적인 실용성을 1.0, 2.0in 직경의 Horn Sonicator를 사용했을 경우에 대하여 비교와 분석을 하였다.

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LCD 구동 IC의 실장을 위한 초음파 ACF접합 기술 (Ultrasonic ACF Bonding Technique for Mounting LCD Driver ICs)

  • 정상원;윤원수;김경수
    • 제어로봇시스템학회논문지
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    • 제14권6호
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    • pp.543-547
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    • 2008
  • In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.