• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.371-375
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• 2003

In recent years, as the semiconductor and the optical industry grows, the necessity of the transporting system for semiconductor and precision optical lens without damage increases. The transport system using ultrasonic wave is very suitable for this area. In this paper the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phase-difference between two ultrasonic wave generators are performed. The effect of transporting speed according to the change of weight and amplification voltage are verified. In addition, the system performance for actual use is evaluated.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2003.05a
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• pp.956-959
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• 2003

In the semiconductor and the optical industry a new transport system which can replace the common system is required. The common systems are driven by magnetic field and conveyer belt. The magnetic field damages semiconductor and contact force scratches the optical lens. The ultrasonic wave driven system solve these problem. In this paper the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phase-difference between two ultrasonic wave get orators are performed. The effect of transporting speed according to the change of weight and amplification voltage are verified. In addition, the system performance for actual use is evaluated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1170-1173
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• 2003

In the semiconductor and the optical industry a new transport system which can replace the common system is required. The common systems are driven by magnetic field and conveyer belt. The magnetic field damages semiconductor and contact force scratches, the optical lens. The ultrasonic wave driven system solve these problem. In this paper the object transport system using the excitation of ultrasonic wave is proposed. the experiments for finding the optimal excitation frequency, finding phase-difference between two ultrasonic wave generators are performed. The effect of transporting speed according to the change of amplification voltage is verified. In addition, the system performance for actual use is evaluated

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2003.11a
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• pp.696-699
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• 2003

In the semiconductor and the optical industry a new transport system which can replace the conventional sliding system is required. There systems are driven by magnetic field and conveyer belt. The magnetic field damages semiconductor and contact force scratches the optical lens. The ultrasonic wave driven system can solve these problem. In this paper, the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phase-difference between two ultrasonic wave generators are performed. The relationship of transporting speed according to the change of flexural beam shape is verified and the system performance for practical use is evaluated.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.25-29
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• 2003

In the semiconductor and the optical industry a new transport system which can replace the conventional sliding system is required. These systems are driven by magnetic field and conveyer belt. The magnetic field damages semiconductor and contact force scratches the optical lens. The ultrasonic wave driven system can solve these problem. In this paper, the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phase-difference between two ultrasonic wave generators are performed. The relationship of transporting speed according to the change of flexural beam shape is verified and the system performance for practical use is evaluated.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.8 s.173
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• pp.151-158
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• 2005

In the semiconductor and the optical industry, a new transport system which can replace the conventional sliding systems is required. The sliding systems are driven by the magnetic field and conveyer belts. The magnetic field nay damage semiconductor and the contact force may scratch the optical lens. The ultrasonic wave driven system can solve these problems. In this paper, an object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal progressive frequency and the phase-differences between two ultrasonic wave generators are performed. The relationships between transportation speed and the excitation frequency, flexural beam shapes and amplification voltage are investigated.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1608-1613
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• 2003

In the semiconductor and the optical industry, a new transport system which can replace the conventional sliding system is required. These systems are driven by the magnetic field and the conveyer belt. The magnetic field damages semiconductor and contact force scratches the optical lens. The ultrasonic wave driven system can solve these problems. In this paper, the object transport system using the excitation of ultrasonic wave is proposed. The experiments for finding the optimal excitation frequency, finding phasedifference between two ultrasonic wave generators are performed. The relationship of transporting speed according to the change of flexural beam shape is verified. In addition, the system performance for practical use is evaluated.

• Water for future
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• v.26 no.1
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• pp.63-69
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• 1993

Remediation technology becomes an issue in environmental engineering. The vibro-recovery technique is one of popular means to remove pollutants from contaminated soils and groundwater. Using Ultrasonic excitation in soil-fluid medium, it was found that removal efficiency in a mechanical effects was significant. In this paper, therefore, laboratory experiments were conducted on clayey sand soil columns using a probe-type ultrasonic processor. Ultrasonic treatment with simultaneous pumping enhances dislodgement of clay particles, and ultrasonic excitation reduced the proportions of finer particles and thus result in increased hydraulic conductivity significantly. Also, the results provided the changes in grain size distribution curve of the soil due to ultrasonic excitation. The results indicated that the maximum size of particles mobilized by Ultrasonic is about 0.004mm and particles in the size range from 0.04mm to 1.0mm were subjected to fracturing. The economic feasibility of Ultrasonic implementation is considered in power requirement of the generator and maintenance of the horn. At a specified amplitude of vibrations, the power requirement of the generator depends on overburden pressure of the horn, temperature and viscosity of fluid in the soil medium. For comparisons, the requirement of a one inch and two inch diameter horn sonicators are compared with the power required for pumping water from different depths.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.256-256
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• 2003

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.