• 한국정밀공학회지
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• 제17권6호
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• pp.185-191
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• 2000

Recently, a slightest influence to the circuit can be a great damage because the size of semiconductor smaller. It must be controlled the chippingless dicing process and the precision dicing without any damage to tile circuit. In this study, the relationship between chipping effect and the force of dicing was analysed. The rate of chipping was decreased as the farce of dicing decreased. It was also examined that the farce of dicing decreased according to the lower feed rate and higher blade speed. The lower feed rate and the higher blade speed must be controlled to achieve the chippingless process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.175-178
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• 2000

An aerostatic stage has frictionless behavior, so it has a advantage of investigation into positioning characteristics. A one-dimensional aemstatic ceramic stage with ballscrew driven and laser scale feedback system is manufactured. aiming at investigating positioning characteristic of aerostatic stage, especially position error and repeatability, we analyze positioning behavior with other factors such as angular error, temperature. Experimemal results show that the aerostatic stage has a l0nm micro step response. Comparing experimental results and calculated abbe's error, we confirm that mean of position error is owing to angular error. And, also we confirm the temperature is dominant factor of repeatability in ten nm order.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.951-954
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• 2000

This paper presents a new cutting method, i.e. diamond cutting, aided by electrolysis, in order to cut ferrous materials with diamond tools. Diamond cutting is widely applied in manufacturing ultraprecision parts such as magnetic disk, polygon mirror, spherical/non-spherical mirror and copier drum, etc. because of the diamond tool edge sharpness. In general, however, diamond cutting cannot be applied to cutting steels, because diamond tools wear excessively in cutting iron based materials like steel due to their high chemical interaction with iron in high temperature. In order to suppress the diffusion of carbon from the diamond tool and to reduce increase of cutting force due to size effect, we attempt to change chemically the compositions of iron based materials using electrolysis in a limited part which will be soon cut. Through experiments under several micro-machining and electrolysis conditions, cutting using electrolysis, compared to conventional cutting, was found to result in a great decrease of the cutting force, a better surface and much less wear tool.

• 한국기계가공학회지
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• 제11권3호
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• pp.41-47
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• 2012

Surface roughness is widely used as an index for processing degree of accuracy. Recently, regression analysis to predict the machining results are actively used to characterize a cutting operations. In the past, diamond machining had been used for ultra precision cutting operation, but now industrial diamond tools like PCD(Polycrystaline Diamond) has been widely used in ultraprecision machining of nonferrous metals. In this study, the authors focus on the effect of PCD tool property on the surface roughness of different types of aluminum alloy after cutting process by CNC operated lathe. Based on the regression analysis approach on a surface roughness data obtained by experiment, predictive analysis of surface roughness is effective to achieve better surface quality.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.977-980
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• 1997

Ultraprecision machining process and MEMS technology have been taken more and more important position in machining of micro parts such as PDP and IT components, as the application field of micro parts increases. A micro machining center is very effective equipment for the fabrication of micro parts, because of its benefits such as lower power consumption, high precision and lower machining cost. Therefore, we study the possibility of application to the micro machining of barrier ribs used in PDP and also analyse the machining characteristics. The fabricated barrier rib has 30~$200\mu\textrm{m}$ pitch and was made by the flat endmill with the diameter of 0.2mm, 40, 000rpm condition.

• 한국정밀공학회지
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• 제26권11호
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• pp.35-40
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• 2009

This paper presents the geometrical analysis of an inclined ultra-precision grinding technology using simulations about grinding point locus for micro lens manufacturing. Simulation results show the relationship between radius ratios ($R_1/R_2$) and wheel center locus. Furthermore, the critical grinding wheel radius ($R_1$) can be calculated from work-piece radius ($R_2$) and inclined angle ($\theta=-45^{\circ}$). These achievements could be applied to calculate CNC data in ultra-precision grinding and give insight for wheel wear and compensation grinding.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 추계학술대회 논문집
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• pp.198-203
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• 1998

To acquire the high precision of profile for standard electrode of loss angle, it is needed ultraprecision machining technology like MEAP(Magnetic Electronic Abrasive Polishing) and the very high profile measurement technology which can measure a micro unit about the workpiece. So, in this paper, it was developed the measurement system of precision of profile using non-contactable sensor that was approximate sensor of capacitance type, because that is better than others in the electrical characteristics. And standard electrode of loss angle was machined by the MEAP machining technology. In this study, it was development of precision measurement system. This system could be used measure the workpiece of roundness and straightness much more precise and faster than general mechanical measurement system done before. And it could be helped to minimize machining time and planning by very fast and precise measurement about the workpiece.

• International Journal of Precision Engineering and Manufacturing
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• 제5권2호
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• pp.32-38
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• 2004

The electrorheological(ER) fluid has been used to the ultraprecision polishing of single crystal silicon as new polishing slurry whose properties such as yield stress and particle structure changed with the application of an electric field. In this work, it is aimed to find the effective parameters in the ER fluid on material removal in the polishing system whose structure is similar to that of the simple hydrodynamic bearing. The generated pressure in the gap between a moving wall and a workpiece, as well as the electric field-induced stress of the mixture of ER fluid-abrasives, is evaluated experimentally, and their influence on the polishing of single crystal silicon is analyzed. Moreover, the behavior of abrasive and ER particles is described.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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• pp.502-506
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• 1999

Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, so it is important to control the chipping generation in the process of dicing. This paper deals with chipping of the silicon wafer dicing. The relationships between the dicing force and the wafer chipping are investigated. It is confirmed that the wafer chipping increases as the dicing force increases.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 추계학술대회 논문집
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• pp.334-339
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• 2004

Ultraprecision machining and MEMS technology have been taken more and more important position in machining of microparts. Micro endmilling is one of the prominent technology that has wide spectrum of application field ranging from macro parts to micro products. Also, the method of micro-grooving using micro endmilling is used widely owing to many merit, but has problems of precision and quality of products due to tool wear and tool fracture. This investigation deals with state monitoring using acoustic emission(AE) signal in the micro-grooving. Characteristic evaluation of AE raw signal, AE hit and frequency analysis for state monitoring is also presented in the paper.