• 제목/요약/키워드: Ultrafine Grained Microstructures

검색결과 12건 처리시간 0.015초

등통로각압축공정을 이용하여 제조된 Cu-15 wt%Ag 복합재의 미세구조 (Microstructural Evolution of Cu-15 wt%Ag Composites Processed by Equal Channel Angular Pressing)

  • 이인호;홍순익;이갑호
    • 대한금속재료학회지
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    • 제50권12호
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    • pp.931-937
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    • 2012
  • The microstructure of Cu-15 wt%Ag composites fabricated by equal channel angular pressing (ECAP) with intermediate heat treatment at $320^{\circ}C$ was investigated by transmission electron microscopy (TEM) observations. Ag precipitates with a thickness of 20-40 nm were observed in the eutectic region of the Cu-15 wt%Ag composite solution treated at $700^{\circ}C$ before ECAP. The Cu matrix and Ag precipitates had a cube on cube orientation relationship. ECAPed composites exhibited ultrafine-grained microstructures with the shape and distribution dependent on the processing routes. For route A in which the sample was pressed without rotation between each pass, the Cu and Ag grains were elongated along the shear direction and many micro-twins were observed in elongated Cu grains as well as in Ag filaments. The steps were observed on coherent twin boundaries in Cu grains. For route Bc in which the sample was rotated by 90 degrees after each pass, a subgrain structure with misorientation of 2-4 degree by fragmentation of the large Cu grains were observed. For route C in which the sample was rotated by 180 degrees after each pass, the microstructure was similar to that of the route A sample. However, the thickness of the elongated grains along the shear direction was wider than that of the route A sample and the twin density was lower than the route A sample. It was found that more microtwins were formed in ECAPed Cu-15 wt%Ag than in the drawn sample. Grain boundaries were observed in relatively thick and long Ag filaments in Cu-15 wt%Ag ECAPed by route C, indicating the multi-crystalline nature of Ag filaments.

스파크 플라즈마 소결에 의한 초미세 결정립 탄화규소의 개발 (Development of ultrafine grained silicon carbide by spark plasma sintering)

  • 조경식;이광순;백성호;이상진
    • 한국결정성장학회지
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    • 제13권4호
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    • pp.176-181
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    • 2003
  • 0.5wt% $B_4$C를 첨가한 SiC분말로부터 스파크 플라즈마 소결(SPS)로 급속 치밀화 하였다. 이 공정의 독특한 특징은 매우 빠른 승온 속도와 짧은 시간에 완전 치밀한 시편을 얻을 수 있는 가능성이다. 승온 속도와 가압력은 $100^{\circ}C$/min 과 40MPa으로 유지시켰는데, 소결 온도와 유지 시간은 각각 1800, 1850, 1900과 $1950^{\circ}C$ 그리고 10, 20과 30min으로 하였다. $1950^{\circ}C$에서 SPS 소결한 시편은 거의 이론밀도에 이르렀다. $1850^{\circ}C$에서 3C로부터 6H로 상전이 되는 것이 XRD에서 나타났다. 급속 소결한 SiC 세라믹스는 2$\mu\textrm{m}$ 이하 크기의 초미세 등축 입자와 폭 0.5∼2$\mu\textrm{m}$, 길이 3∼10$\mu\textrm{m}$의 길게 자란 입자의 이중 미세구조로 구성되었다. 이축강도는 소결 유지 시간이 증가할수록 증가하였다. $1950^{\circ}C$에서 30min 유지하면 392.7 MPa의 강도에 도달하였는데. 기공이 줄어들면 강도가 상승하는 일반적인 경향과 일치한다. 한편, 소결 유지시간이 증가할수록 파괴 인성은 증가하고 있지만. 2.17∼2.34MPa$.$$m^{1/2}$의 낮은 값을 유지하고 있는데, 파단면이 거의 입내 파괴 모드에 기인하는 것으로 생각된다.