• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.710-713
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• 2005

In this study, waffle type barrier ribs for counter electrode discharge cells were prepared via micro-molding process. The master mold was prepared by UV lithography and working mold was manufactured by replicating the master mold. The UV paste used in this study consisted of ceramic powders for the barrier ribs, binder, hardener, and dispersant was filled into cavities of a polymeric mold by action of capillary pressure developed between mold and paste. The results demonstrated a possibility of one-step process for the manufacturing of waffle type barrier ribs embedded with sustaining electrodes.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.571-574
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• 2004

Symmetric closed-cell type barrier ribs of PDP were formed by capillary molding process using molds prepared by inclined UV lithography process. The effects of inclining angle of barrier ribs on the sintering shrinkage and luminance of panel were examined. The results indicate that the barrier ribs of inclined morphology affect the sintering shrinkage and luminance efficiency significantly.

• Journal of the Korean institute of surface engineering
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• v.42 no.2
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• pp.59-62
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• 2009

Antireflection pattern, moth-eye structure, was fabricated on lens using Ultra Violet nanoimprint lithography and flexible template. Ni template with conical shaped structure was used as a master template to molding. The flexible poly vinyl alcohol template was fabricated by molding. This poly vinyl alcohol template was used as an imprint template of imprint at lens. Using Ultra Violet nanoimprint lithography and poly vinyl alcohol template, polymer based moth-eye structure was formed on lens and its transmittance was increased up to 94% from 92% at 550 nm wavelength.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.100-103
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• 2007

A microlens array has been required to improve light conversion efficiency in image sensors. A microlens array can be usually fabricated by photoresist reflow, hot-embossing, micro injection molding, and UV-imprinting. Among these processes, a UV-imprinting, which is operated at room temperature with relatively low applied pressure, can be a desirable process to integrate microlens array on image sensors, because this process provides the components with low thermal expansion, enhanced stability, and low birefringence, furthermore, it is more suitable for mass production of high quality microlens array. In this study, to analyze the optical properties of the wafer scale microlens array integrated image sensor, another wafer scale simulated image sensor chip array was designed and fabricated. An aspherical square microlens was designed and integrated on a simulated image sensor chip array using a UV-imprinting process. Finally, the optical performances were measured and analyzed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.35-40
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• 2005

The demand for small and high-capacity optical data storage devices has rapidly increased. The areal density of optical disk is increased using higher numerical aperture objective lens and shorter wavelength source. A wafer-scale stacked micro objective lens with a numerical aperture of 0.85 and a focal length of 0.467mm for the 405nm blue- violet laser was designed and fabricated. A diffractive optical element (DOE) was used to compensate the spherical aberration of the objective lens. Among the various fabrication methods for micro DOE, the UV-replication process is more suitable for mass-production. In this study, an 8-stepped DOE pattern as a master was fabricated by photolithography and reactive ion etching process. A flexible mold was fabricated for improving the releasing properties and shape accuracy in UV-molding process. In the replication process, the effects of exposing time and applied pressure on the replication quality were analyzed. Finally, the shapes of master, mold and molded pattern were measured by optical scanning profiler. The deviation between the master and the molded DOE was less than 0.1um. The efficiency of the molded DOE was measured by DOE efficiency measurement system which consists of laser source, sample holder, aperture and optical power meter, and the measured value was $84.5\%$.

• Transactions of Materials Processing
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• v.20 no.1
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• pp.11-16
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• 2011

Recently, according to the rapid development of display, many display applications, such as, cellular phone, navigation, monitor and LCD TV have been changed from CRT type to LCD type. BLU(Back Light Unit) is one of main parts in LCD unit and generally, it consists of a light source, a reflective sheet, a LGP(Light Guide Plate), a diffuser sheet, and two prism sheets. The most important component of BLU is a light guide plate, which diffuses the input light to the TFT-LCD module uniformly. The LGP is usually made by injection molding process, and it has numerous optical micro patterns on the surface. In the present study the micro-patterned stamper which has cylindrical shape was fabricated by using the UV-LiGA process. And the replication characteristics have been compared among three different kinds of injection molding process; general injection molding, injection/compression molding and RHCM(Rapid Heating and Cooling Molding). Average replication ratios of CIM and ICM were 19.1% and 64.6%, respectively. On the other hand, the average replication ratio of RHCM process showed the higher value of 98.4% among these. It show that maintaining the mold surface above $T_g$ could increase the replication ratio of micro patterns substantially.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.329-329
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• 2006

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.978-982
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• 2004

We present high aspect ratio 100nm-scale nickel stamper using e-beam lithography process and Cr/Qz mask for the injection molding process of nano grating patterns. Conventional photolithography blank mask (CrON/Cr/Qz) consists of quartz substrate, Cr layer of UV protection and CrON of anti-reflection layer. We have used Cr/Qz blank mask without anti-reflection layer of CrON which is non-conductive material and ebeam lithography process in order to simplify the nickel electroplating process. In nickel electroplating process, we have used Cr layer of UV protection as seed layer of nickel electroplating. Fabrication conditions of photolithography mask using e-beam lithography are optimized with respect to CrON/Cr/Qz blank mask. In this paper, we have optimized e-beam lithography process using Cr/Qz blank mask and fabricated nickel stamper using Cr seed layer. CrON/Cr/Qz blank mask and Cr/Qz blank mask require optimal e-beam dosage of $10.0{\mu}C/cm^2$ and $8.5{\mu}C/cm^2$, respectively. Finally, we have fabricated $116nm{\pm}6nm-width$ and $240nm{\pm}20nm-height$ nickel grating stamper for the injection molding pattern.

• Laser Solutions
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• v.11 no.1
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• pp.7-11
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• 2008

Decapsulation technology is useful to inspect EMC of package device and the etching technology enable to check inside of device by removing plastic molding. Chemical etching method is used widely to fabricate a lot of semiconductor. But the method has some disadvantage due to wet process. Proposed method in this paper shows the application possibility such as fast processing time, processing accuracy and dry process. These result was obtained by directly removing of packed EMC using UV laser.

• Journal of the Korean Ceramic Society
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• v.56 no.2
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• pp.178-183
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• 2019

A process of fabricating the foamed glass that has closed pores with 8 ~ 580 ㎛ sizes without a blowing agent by sintering 10 ㎛ boron-free glass powder composed of CaO, MgO, SO₃, Al₂O₃-83 wt% SiO₂ at a molding pressure of 0 ~ 120 MPa and a sintering temperature of 750 ~ 1000℃ was investigated. To analyze the glass transition temperature of glass powder, thermogravimetric analysis-differential thermal analysis (TGA-DTA) method were used. The microstructure and pore size of foamed glass were examined using the optical microscopy and field emission scanning electron microscopy (FE-SEM). For the thermal diffusivity and color of the fabricated samples, a heat flow meter and ultraviolet-visible-near-infrared (UV-VIS-NIR)-colormetry were used, respectively. In the TGA-DTA result, the glass transition temperature of glass powder was confirmed to be 626℃. In the microstructure result, closed pores of 7 ~ 20 ㎛ were formed at 750 ~ 900℃, and they were not affected by the molding pressure and sintering temperature. However, at 1,000℃, when there was 0 MPa molding pressure, closed pores of 580 ㎛ were confirmed, and the pore size decreased as the molding pressure increased. Moreover, at a molding pressure of 30 MPa or higher, closed pores of approximately 400 ㎛ were formed. The porosity showed an increasing trend of smaller molding pressure and larger sintering temperature, and it was controllable in the range of 5.69 ~ 68.45%. In the thermal diffusivity result, there was no change according to the molding pressure, and, by increasing the sintering temperature, up to 0.115 W/m·K could be obtained. The Lab color index (CIE-Lab) results all showed a similar translucent white color regardless of molding pressure and sintering temperature. Therefore, based on the foamed glass without boron and blowing agent, it was confirmed that white foamed glass, which has closed pores of 8 ~ 580 ㎛ and a thermal diffusivity characteristic of 0.115 W/m·K, can be fabricated by changing the molding pressure and sintering temperature.