• Journal of Technologic Dentistry
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• v.46 no.1
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• pp.8-14
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• 2024

Purpose: This study compares the deformation of traditional resin dentures to resin dentures printed with digital light processing (DLP). Methods: Eleven edentulous research models were developed. Ten of them were made with traditional resin dentures. The remaining one was prepared for scanning and 3D (three-dimensional) printing. Ten traditional resin dentures were made, with the remaining artificial teeth created using 3D software and a DLP printer. Traditional resin dentures, 3D printed resin denture artificial teeth, and a denture base with artificial teeth were all cleaned simultaneously in an ultrasonic cleaner for 3 minutes. Three groups were assigned four artificial tooth measurement points, which were then measured with digital calipers. The measured data was analyzed using descriptive statistics. The significance test was conducted using a nonparametric test Kruskal-Wallis test due to the small number of specimens (α=0.05). Results: The traditional resin dentures had the lowest strain rate at -0.04%, while the group that manufactured only artificial teeth had the highest strain rate at -0.09%. However, no statistically significant difference was observed between the 3 groups (p>0.05). Conclusion: During ultraviolet-type ultrasonic cleaning, traditional resin dentures (TD group) and denture base with artificial teeth made of DLP (DD group) demonstrated stable durability, whereas the artificial teeth made of DLP (AD group) with only artificial teeth did not show a good deformation rate.

• Journal of the Korean Society of Industry Convergence
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• v.27 no.2_2
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• pp.389-395
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• 2024

The purpose of this study was to evaluate the effect of different washing solvents and washing methods on the flexural strength of 3D printed temporary resin. A bar(25 × 2 × 2 mm) was produced with a layer thickness of 50 ㎛ using an LCD-type 3D printer and divided into 15 groups(n = 10, each) according to washing solution(IPA; 99% isopropyl alcohol, TPM; 93% Tripropylene glycol monomethylether, ETL; Ethanol, TWC; Twin 3D Cleaner, and DNC; DIO navi Cleaner) and washing method(Dip; Dip washing, Ultra; Ultrasonic washing, and Auto; Automated washing). All groups were washed for 5 minutes, and post-cured for 5 minutes using a UV LED light curing machine. The Flexural strength was measured using a three-point bending test using a universal testing machine. For statistical analysis, one-way ANOVA, Tukey HSD post hoc test, Kruskal-Wallis test and post-hoc by Bonferroni-Dunn test(𝛼=.05) were performed depending on whether the normality test was satisfied. In all washing solvents except TPM and DNC, the Dip group showed the lowest flexural strength values, while the Auto group showed the highest flexural strength values except for DNC. Additionally, the washing solution showed completely different flexural strength values depending on the washing method.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.