• Korean Journal of Materials Research
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• v.27 no.7
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• pp.381-385
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• 2017

In order to replace 14K white gold alloys, the properties of 5K white gold alloys (Au20-Ag80) were investigated by changing the contents of In (0.0-10.0 wt%). Energy dispersive X-ray spectroscopy (EDS) was used to determine the precise content of alloys. Properties of the alloys such as hardness, melting point, color difference, and corrosion resistance were determined using Vickers Hardness test, TGA-DTA, UV-VIS-NIR-colorimetry, and salt-spray tests, respectively. Wetting angle analysis was performed to determine the wettability of the alloys on plaster. The results of the EDS analysis confirmed that the Au-Ag-In alloys had been fabricated with the intended composition. The results of the Vickers hardness test revealed that each Au-Ag-In alloy had higher mechanical hardness than that of 14K white gold. TGA-DTA analysis showed that the melting point decreased with an increase in the In content. In particular, the alloy containing 10.0 wt% In showed a lower melting temperature (> $70^{\circ}C$) than the other alloys, which implied that alloys containing 10.0 wt% In can be used as soldering materials for Au-Ag-In alloys. Color difference analysis also revealed that all the Au-Ag-In alloys showed a color difference of less than 6.51 with respect to 14K white gold, which implied a white metallic color. A 72-h salt-spray test confirmed that the Au-AgIn alloys showed better corrosion resistance than 14K white gold alloys. All Au-Ag-In alloys showed wetting angle similar to that of 14K white gold alloys. It was observed that the 10.0 wt% In alloy had a very small wetting angle, further confirming it as a good soldering material for white metals. Our results show that white 5K Au-Ag-In alloys with appropriate properties might be successful substitutes for 14K white gold alloys.

• Korean Journal of Materials Research
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• v.28 no.2
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• pp.89-94
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• 2018

The properties of 18 K red gold solder alloys were investigated by changing the content of In up to 10.0 wt% in order to replace the hazardous Cd element. Cupellation and energy dispersive X-ray spectroscopy (EDS) were used to check the composition of each alloy, and FE-SEM and UV-VIS-NIR-Colormeter were employed for microstructure and color characterization. The melting temperature, hardness, and wetting angle of the samples were determined by TGA-DTA, the Vickers hardness tester, and the Wetting angle tester. The cupellation result confirmed that all the samples had 18K above 75.0wt%-Au. EDS results showed that Cu and In elements were alloyed with the intended composition without segregation. The microstructure results showed that the amount of In increased, and the grain size became smaller. The color analysis revealed that the proposed solders up to 10.0 wt% In showed a color similar to the reference 18 K substrate like the 10.0 wt% Cd solder with a color difference of less than 7.50. TGA-DTA results confirmed that when more than 5.0 wt% of In was added, the melting temperature decreased enough for the soldering process. The Vickers hardness result revealed that more than 5.0 wt% In solder alloys had greater hardness than 10.0 wt% Cd solder, which suggested that it was more favorable in making a wire type solder. Moreover, all the In solders showed a lower wetting angle than the 10.0 wt% Cd solder. Our results suggested that the In alloyed 18 K red gold solders might replace the conventional 10.0 wt% Cd solder with appropriate properties for red gold jewelry soldering.

• Journal of Adhesion and Interface
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• v.12 no.2
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• pp.47-55
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• 2011

UV-curable coatings have been used in various industries due to their advantages such as high mechanical property, good solvent resistance, fast curing process and low volatile organic compounds. However, a lack of flexibility of UV-cured films is a weak point for the pre-coated system of roll-to-roll process. In this study, UV-curable polycarbonate-based methacrylates were synthesized with polycarbonate diol, isophorone diisocyanate and 2-hydroxyethylmethacrylate to improve flexibility of the UC-cured films. The effects of polyol molecular weight, content of photoinitiator and monomers on the UV-curing behavior, flexibility and properties were investigated. The UV-curing behavior was measured by a photo-DSC, the pendulum hardness, tensile strength, viscoelastic properties were also evaluated.

• Journal of Life Science
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• v.31 no.5
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• pp.481-487
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• 2021

The purpose of this study was to identify fungi that degrade product value during the storage and distribution of confectionery products, and to investigate the antifungal effect of organic acid and UV-C treatments on high carbohydrate products. Fungi isolated from spoiled high carbohydrate confectionery were identified as Wallemia sp., Aspergillus sp-1 and Aspergillus sp-2 depending on homologies with ITS1 and ITS4 sequences. The isolated fungi were assayed for antifungal activity by treatment with acetic acid, citric acid, lactic acid or maleic acid. As a result, it was confirmed that the growth of Wallemia sp. and Aspergillus sp-2 was suppressed by treatment with 0.2 M and 0.35 M acetic acid, respectively. In addition, as a result of confirming the antifungal effect according to the UV-C irradiation time, the growth inhibitory effects of Wallemia sp. and Aspergillus sp-2 were shown in irradiation for 30 min and the growth inhibitory effect of Aspergillus sp-1 was shown in irradiation for 40 min. The result of the sensory evaluation of the untreated and 0.35 M acetic acid-treated high carbohydrate confectionery, there were not significant changes in taste, color, abnormal taste, hardness and texture, but there were significant differences in sour taste and smell. As a result of the above study, the effect of inhibiting fungi growth on the product by treatment with organic acid and UV-C irradiation was confirmed, and it is expected to be used in confectionery that were concerned about the occurrence of fungi in the distribution process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.199-199
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• 2009

Recently, polymeric microlens arrays have become important elements in many applications. Microlens arrays have been used to enhance luminance efficiency and luminance power efficiency of light-emitting diodes (LEDs) and organic LEDs. Many processes for fabrication of microlens array are studied. Though the MLA has been fabricated by electroformed mold, LIGA process and reflow method, these methods were required masks, multiple process steps and post processing. In this paper, we proposed rapid and direct UV laser direct fabrication process using colorless liquid photopolymer, NOA60 for polarization activated microlens. The microlens arrays are formed on the NOA60 on glass, after the focused laser energy was irradiated to the material. The diameter of MLA was varied from 42 to 88 ${\mu}m$, and the height from 0.9 to 1.6 ${\mu}m$. The MLA fabricated using NOA60 shows more then 85% transmittance as well as good hardness for optical module.

• Korean Chemical Engineering Research
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• v.46 no.2
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• pp.310-315
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• 2008

Organic-inorganic hybrid solutions were made using glycidoxypropyl trimethoxysilane (GPTMS) and vinyltriethoxysilane (VTES) as starting materials by sol-gel method. Photochromic coating solutions were prepared by mixing the solution of photochromic dye (spiropyran) dissolved in ethylacetate with the organic-inorganic hybrid solutions. Photochromic films were prepared on polycarbonate sheets by spin coating and cured for 2 h at $100^{\circ}C$. The resulting films exhibited a reversible color change upon irradiation with UV light from transparent to blue. The color-fading speed and pencil hardness of the coating films increased with increasing the GPTMS content in the coating solutions.

• Polymer(Korea)
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• v.35 no.2
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• pp.141-145
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• 2011

The electron beam (EB) induced curing of a typical resin designed for the hard coating layer of in-mold decoration foils was investigated. The samples were irradiated with different doses of EB and the curing reaction was monitored by Fourier transform infrared (FTIR) spectroscopy. The change in coating properties such as surface hardness and anti-abrasion property was studied as a function of increasing dose. The effect of the addition of nano-particles on the improvement of coating properties was also examined. It was expected that the experimental results could be used for the commercial exploitation of the EB curing system comparable to the ultraviolet (UV) curing system.

• Korean Journal of Materials Research
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• v.27 no.4
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• pp.199-205
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• 2017

In this study, (3,4-epoxycyclohexane)methyl 3,4-epoxycyclohexylcarboxylate acrylate was synthesized by reacting (3,4-epoxycyclohexane)methyl 3,4-epoxycyclohexylcarboxylate with acrylic acid to minimize hardening shrinkage and to improve heat resistance, which are known as disadvantages of photopolymers for 3D printing application. Urethane acrylate was synthesized by reacting 1,3,5-triazine-2,4,6-triamino alcohol, 2-hexylethyl acrylate, and isophorone diisocyanate in order to improve the mechanical properties without deteriorating the heat resistance. The physical properties before and after the synthesis of the acrylate and the mechanical properties when the urethane acrylate was applied were investigated. The reaction progress of the composite was examined by FTIR and $^{13}C$ NMR. The heat deflection temperature, flexural strength, and surface hardness of the molding were measured. The curing behavior by Photo-DSC ultraviolet irradiation was also examined.

• Journal of the Korean Graphic Arts Communication Society
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• v.26 no.2
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• pp.55-64
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• 2008

We designed a UV-LED exposure system which has 365nm dominant wavelength due to the environment-friendly and economical maskless screen plate making. And the photoresist applied on the screen stretched was exposed without mask by beam projector with UV-LED light source. Then it was developed by air spray with $1.7\;kgf/cm^2$ of injection pressure. The pencil hardness and solvent resistance of curing photoresist film were excellent as those of conventional photoresist film and the maximum resolution of line image formed by maskless screen plate making. was $100{\mu}m$, so we could establish the possibility of environment-friendly maskless screen plate making technology. But the sharpness of the patterns were ${\pm}40{\mu}m$ since the exposure system for maskless plate making has weak light intensity and the diffusion of light.

• Tribology and Lubricants
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• v.37 no.6
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• pp.208-212
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• 2021

Chemical mechanical polishing (CMP) is a key technology used for the global planarization of thin films in semiconductor production and smoothing the surface of substrate materials. CMP is a type of hybrid process using a material removal mechanism that forms a chemically reacted layer on the surface of a material owing to chemical elements included in a slurry and mechanically removes the chemically reacted layer using abrasive particles. Sapphire is known as a material that requires considerable time to remove materials through CMP owing to its high hardness and chemical stability. This study introduces a technology using electrolytic ionization and ultraviolet (UV) light in sapphire CMP and compares it with the existing CMP method from the perspective of the material removal rate (MRR). The technology proposed in the study experimentally confirms that the MRR of sapphire CMP can be increased by approximately 29.9, which is judged as a result of the generation of hydroxyl radicals (·OH) in the slurry. In the future, studies from various perspectives, such as the material removal mechanism and surface chemical reaction analysis of CMP technology using electrolytic ionization and UV, are required, and a tribological approach is also required to understand the mechanical removal of chemically reacted layers.