• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.601-602
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.633-636
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• 2005

Imprint lithography is a promising method for high-resolution and high-throughput lithography using low-cost equipment. As with other nanoimprint methods, ultraviolet-nanoimprint lithography (UV-NIL) resolution appears to be limited only by template resolution, and offers a significant cost of ownership reduction when compared to other next generation lithography (NGL) methods such as EUVL and 157 nm lithography. The purpose of this paper is to suggest optimum values of control parameters of Imprio 100 manufactured by Molecular Imprint, Inc., which is the first commercially available UV-NIL tool, for sound nanoimprint. UV-NIL experiments were performed on Imprio 100 to find dispensing recipe for avoiding air entrapment. Dispensing recipe related to residual layer thickness and uniformity was optimized and 40 nm thick residual layer was achieved.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.155-156
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• 2006

UV-NIL is a promising technology for the fabrication of sub-100 nm features. Due to non-uniformity of the residual layer thickness (RLT) and a strong possibility of defects, many UV-NIL processes have been developed and some are commercially available at present, most are based on the 'step-and-repeat' nanoimprint technique, which employs a small-area stamp, much smaller than the substrate. This is mainly because, when a large-area stamp is used, it is difficult to obtain acceptable uniform residual layer thickness and/or to avoid defects such as air entrapment. As an attempt to enable UV_NIL with a large-area stamp for high throughput, we propose a new UV-NIL tool that is able to imprint 4 inch wafer in a low vacuum environment at a single step.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.2
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• pp.20-25
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• 2007

This paper describes a second-generation dual sine-grid surface encoder for 2-D position measurements. The surface encoder consisted of a 2-D grid with a 2-D sinusoidal pattern on its surface, and a 2-D angle sensor that detected the 2-D profile of the surface grid The 2-D angle sensor design of previously developed first-generation surface encoders was based on geometric optics. To improve the resolution of the surface encoder, we fabricated a 2-D sine-grid with a pitch of $10{\mu}m$. We also established a new optical model for the second-generation surface encoder that utilizes diffraction and interference to generate its measured values. The 2-D sine-grid was fabricated on a workpiece by an ultra precision lathe with the assistance of a fast tool servo. We then performed a UV-casting process to imprint the sine-grid on a transparent plastic film and constructed an experimental setup to realize the second-generation surface encoder. We conducted tests that demonstrated the feasibility of the proposed surface encoder model.