• 한국레이저가공학회지
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• 제16권3호
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• pp.27-31
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• 2013

To engrave high-density circuit-line patterns in IC substrates, we applied a projection ablation technique in which a dielectric ($ZrO_2/SiO_2$) mask, a DPSS UV laser instead of an excimer laser, a refractive beam shaping optics and a galvo scanner are used. The line/space dimension of line patterns of the dielectric mask is $10{\mu}m/10{\mu}m$. Using a ${\pi}$ -shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam; and a telecentric f-${\theta}$ lens focuses it to a $115{\mu}m{\times}105{\mu}m$ flat-top beam on the mask. The galvo scanner before the f-${\theta}$ lens moves the beam across the scan area of $40mm{\times}40mm$. An 1:1 projection lens was used. Experiments showed that the widths of the engraved patterns in a buildup film ranges from $8.1{\mu}m$ to $10.2{\mu}m$ and the depths from $8.8{\mu}m$ to $11.7{\mu}m$. Results indicates that it is required to increase the projection ratio to enhance profiles of the engraved patterns.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.101-105
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• 2016

최근 자연모방을 이용한 소수성 표면 가공이 많은 관심을 끌고 있다. 대표적인 가공 방법으로 기계적 가공, 포토리소그래피 가공, 레이저를 이용한 공정이 있다. 본 논문에서는 구리필름에 UV 펄스 레이저를 직접 조사해 마이크로 그루브를 형성하고 상온에서의 산화를 통해 표면의 거칠기를 증가시켜 소수성 표면을 제작하였다. 패턴 생성 뒤 일정 시간 산화를 시킨 후에 측정된 접촉각은 산화를 시키기 전보다 약 $30{\sim}70^{\circ}$까지 증가함을 보인다. 본 연구 결과를 통해서 화학적인 처리과정 없이 보다 안정한 소수성 표면을 제조할 수 있음을 확인하였다.

• 한국레이저가공학회지
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• 제14권1호
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• pp.25-29
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• 2011

Micromachining of photosensitive glass by UV exposure, heat treatment, and etching processes is reported. Like photoresist, the photosensitive glass is also classified into positive and negative types by development characteristics. For the positive type, the exposed area is crystallized and etched away during the etching process in HF solution, whereas the unexposed area is crystallized and etched away for the negative type. The crystallized area of the photosensitive glass has an etch rate approximately 30~100 times faster than that of the amorphous area so that it becomes possible to fabricate microstructures in the glass. Based on the unique properties of glass such as high optical transparency, electrical insulation, and chemical/thermal stability, the glass micromachining technique introduced in this work could be widely applied to various devices in the fields of electronics, bio engineering, nanoelectonics and so on.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.493-494
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• 2007

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 춘계학술대회 논문집
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• pp.237-240
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• 2004

In this study, we have developed a new $UV(\lambda=355nm)$ laser micromachining technology by direct ablation method without masks. This technology allows that 3D micro parts can be fabricated rapidly and efficiently with a low price. And it has a benefit of reducing fabricating process simply. Due to micro parts' fabrication, such technologies need the control of XYZ stages with high precision, the design of optical devices to maintain micron spot sizes of laser beam and the control technology of laser focus. Also, we have fabricated a micro-channel through the developed laser micromachining technology and verified it through the results.

• 한국레이저가공학회지
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• 제15권3호
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• pp.1-6
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• 2012

The friction force of patterned needle in elastomer have been investigated to verify the application for bio and plastic industry. The micro pattern on the needle surface were prepared by 266 nm, 20 ns laser and 800 nm, 220 fs laser, which were able to generate the different surface roughness. The friction force was measured by the load cell of 10 N capacity. As the results, the friction force of no patterned needle is almost constant during the needle penetrates the silicone rubber sample. However, the needle having asperities shows the variation of the friction force. The higher the surface roughness is, the smaller the friction force is until the surface roughness is very high. In our experiment conditions, the reduction of the friction force by 20 % compared to no pattern needle was achieved with straight and $50{\mu}m$ discrete line generated by 266 nm, 20 ns laser.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.887-890
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• 1997

Recently micromachining using DPSSL(Diode Pumped Solid State Laser) with 3rd harmonic wavelength is actively studied in laser machining area. Micromachining using DPSSL have outstanding advantages as UV source comparing with excimer laser in various aspect such a maintenance cost, maskless machining, high repetition rate and so on. In this study micro-drilling of PCB type substrate which consists of Cu-PI-Cu layer was performed using DPSS Nd:YAG laser(355nm, wavelength) in vector scanning method. Experimental and numerical method(Matlab simulation, FEM) are used to optimize process parameter and control machining depth. The man mechanism of this process is laser ablation. It is known that there is large gap between energy threshold of copper and that of PI. Matlab simulation considering energy threshold of material is performed to effect of duplication of pulse and FEM thermal analysis is used to predict the ablation depth of copper. This study could be widely used in various laser micromachining including via hole microdrilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzle and so on.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.258-258
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• 2011

최근 유연 기판을 이용한 태양전지 및 TFT 등 전자소자 개발에 관한 연구가 주목받고 있다. 본 연구에서는 공정 시 유리한 유리기판상 전자소자 제작 후 폴리이미드막 박리를 통한 유연전자 소자 구현을 목적으로 한다. 폴리이미드막 박리를 목적으로 희생층으로서 a-Si:H을 사용하였다. 유리기판상에 60 nm 두께의 a-Si : H을 ICP (Induced coupled plasma) 공정으로 증착한 후 a-Si : H층 상부에 30 ${\mu}m$ 두께로 폴리이미드를 코팅하여 Hot plate와 furnace에서 열처리를 거쳤다. 이후 각기 다른 파장을 갖는 레이저의 파워를 가변하며 유리 기판 후면에 조사하였다. 실험 결과 355 nm UV 레이저로 가공한 경우 희생층으로 사용 된 a-Si : H층 내에 존재하는 수소가 레이저 빛 에너지에 의해 결합이 끊어지면서 유리기판과 폴리이미드막이 분리됨을 확인하였다.

• 한국생산제조학회지
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• 제21권5호
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• pp.773-777
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• 2012

Recently UV laser micromachining processes is widely introduced to meet the needs of advanced components of IT, BT and ET industries. Due to the characteristics of non-contact and high-speed laser processing, UV laser micromachining is applied to manufacture very thin substrate such as polymer, metals and composite. These minimum line width obtained by UV laser micromachining is generally determined from laser wavelength, optical lens and its numerical aperture. In this paper we will show the lens effect of water droplet on the surface of workpiece to reduce the line width when UV laser light is irradiated and focused through the water droplet. Because of the refraction effect generated by the semi-spherical or spherical shape of water droplet, we can find smaller line width. And water droplet could not only protect thermal deformation, but also carry away burr around micro dent. Firstly fundamental theory of minimum line width was derived from relationship between the geometry of water droplet and laser light trace, and then experimental and simulation results will be finally compared to verify the effectiveness of water droplet lens effect of UV laser micromachining process.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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• pp.103-107
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• 2006

Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It if confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.