• Korean Chemical Engineering Research
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• v.56 no.2
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• pp.162-168
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• 2018

UV-curable hard coating solutions were prepared by mixing organic or inorganic polysilazane with urethane acrylate. UV-cured hard coating films were also obtained by flow coating, subsequently UV-curing on polymethylmethacrylate (PMMA) sheets. The effect of types and amounts of polysilazane was investigated on properties of obtained coating films. As a result, the coatings obtained by using organic polysilazane showed a high hydrophobic property with water contact angle of $95^{\circ}$, pencil hardness of 7H and high transparency of 92% in the visible wavelength range. On the other hand, the PMMA sheets made by using inorganic polysilazane exhibited a pencil hardness of as high as 8H, good adhesion to the substrate and water contact angle of $82^{\circ}$.

• Polymer(Korea)
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• v.27 no.3
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• pp.189-194
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• 2003

Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermo setting composite with different curing processes were investigated using electro-micromechanical test. After curing, the residual stress was monitored by measurement of electrical resistance and then compared to various curing processes. In thermal curing case, matrix tensile strength, modulus and interfacial shear strength were higher than those of ultraviolet curing case. The shrinkage measured during thermal curing occurred significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient. The apparent modulus measured in the thermal curing indicated that mechanical and interfacial properties were highly improved. The reaching time to the same stress of thermal curing was faster than that of UV curing case.

• Polymer(Korea)
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• v.39 no.2
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• pp.256-260
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• 2015

The addition of montmorillonite (MMT) in the UV curable polyurethane diacrylate based resins was investigated to fabricate nanocomposites with improved mechanical properties and water sorption behavior using different photoinitiator systems. As a result, it was observed that 1 wt% of clay loading fairly improved tensile resistance and water uptake behavior. It can be also confirmed that dual photoinitiator system consisted of benzyldimethyl ketal and bisacyl phosphine oxide exhibited enhanced energy absorption band 340~450 nm even with 3 wt% of MMT concentration, which may affect the curing behavior of nanocomposite especially in our UV lamp system.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.217.1-217.1
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• 2013

서브파장 나노구조는 점진적으로 변화하는 굴절률을 이용하여 반사율을 줄이고 투과율을 증가시킴으로써 광전자소자 분야에서 많이 응용되고 있다. 최근에는 서브파장 나노구조 제작의 용이함을 위하여 polydimethylsiloxan (PDMS) 스탬프와 UV 경화폴리머를 사용하여 반사방지막을 제작하는 연구가 활발히 진행되고 있다. PDMS는 높은 내구성, 낮은 표면 에너지 등의 특성을 가지고 있으며, UV 경화폴리머는 저온에서 빠른 경화, 높은 투과성 등의 장점을 가진다. 본 연구에서는 서로 다른 주기의 서브파장 구조를 갖는 PDMS 스탬프를 제작하였고, 이를 이용한 반사방지 구조 응용을 통해 제작된 나노구조의 구조적, 광학적 특성을 분석하였다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.6
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• pp.88-95
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• 2020

Currently, Fiber-Reinforced Plastic (FRP) composite materials are used in many industrial fields, owing to their superior stiffness and specific strength compared to metals. However, there are issues with FRP inefficiency, due to low productivity of such materials, environmental problems they pose and long curing times needed. Trying to address these issues, research was conducted towards the development of a FRP composite material with excellent properties and short production time, introducing a curing method using a UV lamp. Four types of composite materials were prepared, cured with catalyst or UV (CZ: Catalyst + ZNT 6345, CR: Catalyst + RF 1001 MV, UVZ: Photoinitiator + ZNT 6345, and UVR: Photoinitiator + RF 1001 MV). Examination of the chemical and mechanical properties of these composites showed that UV-cured materials performed better than the catalyst-cured ones. These results indicate that the production process of FRP composite materials can be simplified by using a UV lamp for curing, resulting in composite materials with the same quality, but reduced production time by about 70% compared to currently used practices. This advancement will contribute greatly to the composite material industry.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.53-58
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• 2018

Since the scaling-down of IC devices has been reached to their physical limitations, several innovative packaging technologies such as 3D packaging, embedded packaging, and fan-out wafer level packaging (FOWLP) are actively studied. In this study the fabrication of organic-inorganic dielectric material was evaluated for the use of multi-structured redistribution layers (RDL) in FOWLP. Compared to current organic dielectrics such as PI or PBO an organic-inorganic hybrid dielectric called polysilsesquioxane (PSSQ) can improve mechanical, thermal, and electrical stabilities. polysilsesquioxane has also an excellent advantage of simultaneous curing and patterning through UV exposure. The polysilsesquioxane samples were fabricated by spin-coating on 6-inch Si wafer followed by pre-baking and UV exposure. With the 10 minutes of UV exposure polysilsesquioxane was fully cured and showed $2{\mu}m$ line-pattern formation. And the dielectric constant of cured polysilsesquioxane dielectrics was ranged from 2.0 to 2.4. It has been demonstrated that polysilsesquioxane dielectric can be patterned and cured by UV exposure alone without a high temperature curing process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.525-526
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• 2006

• Polymer(Korea)
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• v.25 no.3
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• pp.327-333
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• 2001

Acetylene substituted fluorenes such as 2-ethynylfluorene and 2,7-diethynyl-fluorene were synthesized and thin films were prepared by the vacuum deposition. Curing of these fluorene derivatives could be achieved by heat treatment and UV irradiation. The curing temperature of 2-ethynylfluorene and 2,7-diethynylfluorene were found to be 231 and $198^{\circ}C$, respectively. The cured poly(2-ethynylfluorene) and poly(2,7-diethynylfluorene) started to decompose at 280 and $ 385^{\circ}C$, respectively. Fluorescent characteristics of the cured films were similar to those of monomers, but fluorescent efficiency of the film was decreased about 3 to 10 fold.

• Polymer(Korea)
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• v.39 no.2
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• pp.281-286
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• 2015

UV-cured acrylic copolymer pressure sensitive adhesive (PSA) having different amounts of crosslinking agents were prepared and adhesion properties were investigated. 0.01 wt% of MMT clay was dispersed in 2-ethylhexyl acrylate (2-EHA)/acrylic acid (AA) monomer mixture containing 0, 0.05, 0.1 and 0.3 wt% 1,6-hexandiol diacrylate (HDDA) for crosslinking. It was investigated that the curing behavior and surface chemistry of PSAs were merely affected by the presence of MMT clays. On the other hand, adhesive properties were influenced by the MMT addition; a cohesive failure was restrained due to improved molecular elasticity even in uncrosslinked acrylic PSAs. However, it was also appeared that combination of 0.3 wt% crosslinking agent and MMT loading might result in the damage of adhesion properties of PSAs possibly due to the lack of chain flexibility. In our studies, it is suggested that the 2-EHA/AA PSAs incorporating 0.01 wt% of MMT and crosslinked with 0.05 wt% of HDDA exhibited the balanced adhesion properties without severe cohesive failure during strip.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.127-128
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• 2005

UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate (BA), acrylic acid (AA) and vinyl acetate (VAc) by solution polymerization, triethyl amine (TEA) and trimethylolpropane triacrylate (TMPTA). The PSAs were evaluated by peel strength with varying contents of TMPTA and UV dose, and also glass transition temperature($T_g$) of PSAs were measured. When exposed on UV irradiation, the PSAs showed the decreased peel strength and increased $T_g$. And following UV irradiation, the PSAs did not leave any residue on wafer after peel off PSA.