• 전기의세계
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• v.51 no.5
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• pp.44-49
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• 2002

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.478-480
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• 2004

다이아몬드 톱날을 이용한 얇은 Si 웨이퍼의 기계적인 다이싱은 chipping, crack 등의 문제점을 발생시킨다. 또한 stacked die 나 multi-chip등과 같은 3D-WLP(wafer level package)에서 via를 생성하기 위해 현재 사용되는 화학적 etching은 공정속도가 느리고 제어가 힘들며, 공정이 복잡하다는 문제점을 가지고 있다. 이러한 문제점을 해결하기 위해 현재 연구되고 있는 분야가 레이저를 이용한 웨이퍼 다이싱 및 드릴링이다. 본 논문에서는 UV 레이저를 이용한 얇은 Si 웨이퍼 다이싱 및 드릴링 시스템에 대해 소개하고, 웨이퍼 다이싱 및 드릴링 실험결과를 바탕으로 적절한 레이저 및 공정 매개변수에 대해 설명한다.

• 기계와재료
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• v.22 no.1
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• pp.22-29
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• 2010

최근 휴대폰 등 모방일 전자기기 산업에서 차세대 고부가 PCB(MLB, HDI, FPC, 등) 및 고기능 PCB(COF, MOF, SOF)의 급속한 적용 확대로 직경$20{\mu}m$급의 비아홀(viahole) 및 interconnection 홀 가공을 위한 초정밀/초고속 레이저 드릴링 공정 및 장비기술 개발에 대한 시장의 요구가 급증하고 있다. 이에 반해 기존의 CO2 레이저 드릴링은 기술적 한계에 도달하여 시장의 요구에 대응이 불가하며, 선진업체에서는 최근 UV 레이저 드릴링 장비에 대한 시장 점유율을 높여가고 있다. 특히 국내시장은 미국의 ESI사가 독점하고 있어 기술개발 투자를 통한 국산화가 절실한 상황이다. 이에 당사에서는 초고속/초정밀 UV laser 시스템을 이용한 FPC iva hole drilling을 연구과제로 개발을 진행하고 있으며 국산화를 넘어서 세계시장점유를 목표로 공정장비개발을 진행중이다.

• Laser Solutions
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• v.6 no.1
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• pp.9-16
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• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.

• Laser Solutions
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• v.13 no.3
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• pp.13-18
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• 2010

In this paper, polyimide (PI) surface was modified by UV Laser with a low laser fluence and investigated changes of surface geometry and chemical characteristics by SEM (scanning electron microscope), X-ray diffraction (XRD), XPS (x-ray photoelectron spectroscopy) and the measurements of contact angle of water. PI surface was peeled off and modified with microstructure fabrications by photochemical ablation over the laser fluence of 50 mJ/cm2. As laser fluence increased, delamination of PI surface was occurred largely and strongly. In chemical characteristics, the O/C and N/C atomic ratios increased and contact angle decreased from $80^{\circ}$ to $40^{\circ}$.

• Laser Solutions
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• v.10 no.2
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• pp.17-24
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• 2007

We have studied a laser direct writing lithography(LDWL). This is more important to apply to micro patterning using UV laser. We demonstrate the possibility of LDWL and construct the fabrication system. We use Galvano scanner to process quickly micro patterns from computer data. And laser beam is focused with $F-{\theta}$ lens. AZ5214 and SU-8 photoresist are chosen as experimental materials and a kind of well-known positive and negative photoresist respectively. Laser ablation mechanism depends on the optical properties of polymer. In this paper, therefore we investigate the phenomenon of laser ablation according to the laser fluence variation and measure the shape profile of micro patterned holes. From these experimental results, we show that LDWL is very useful to process various micro patterns directly.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.375-376
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.26-29
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• 2003

UV laser micromachining are generally used to create microstructures for micro product through a sequence of lithography-based photopatterning steps. However, the micromachining process is not suitable for the rapid realization of complex microscale 3D product because it depends on worker experiences, excessive cost and time to make many masks. In this paper, the more effective micro rapid manufacturing process, which is developed upon the base of laser micromachining. is proposed to fabricate micro products directly using UV laser ablation and phase change filling. The filling process is useful to hold the micro product during the next ablation step. The proposed micro rapid manufacturing process is also proven experimentally that enables to fabricate the 3D microscale products of UV sensitive polymer from 3D CAD data to functional micro parts.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.196-201
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• 2005

UV laser micromachining are generally used to create microstructures for micro product through a sequence of lithography-based photopatterning steps. However, the micromachining process is not suitable for the rapid realization of complex 3D micro product because it depends on worker experiences, excessive cost and time to make many masks. In this paper, the more effective micro rapid manufacturing process, which is developed upon the base of laser micromachining, is proposed to fabricate micro products directly using UV laser ablation and phase change filling. The filling process is useful to hold the micro product during the next ablation step. The proposed micro rapid manufacturing process is also proven experimentally that enables to fabricate the 3D micro products of UV sensitive polymer from 3D CAD data to functional micro parts.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.314-316
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• 2005

이 논문에서는 아크 용접시 발생하는 IR신호와 UV호의 상호 관계를 알아보려고 레이저 용접진단에 사용되는 IR-UV 센서 모니터링 시스템을 적용하였다. 그 결과 IR신호 크기는 용접폭에 관련이 있고, 펄스 형태의 UV신호는 IR신호 증가율이 임계값을 넘으면 나타나는 것을 알 수 있다.