• Restorative Dentistry and Endodontics
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• v.33 no.1
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• pp.9-19
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• 2008

The purpose of this study was: (1) to compare nanoleakage patterns of a conventional 3-step etch and rinse adhesive system and two experimental hydrophobic adhesive systems and (2) to investigate the change of the nanoleakage patterns after load cycling. Two kinds of hydrophobic experimental adhesives, ethanol containing adhesive (EA) and methanol containing adhesive (MA), were prepared. Thirty extracted human molars were embedded in resin blocks and occlusal thirds of the crowns were removed. The polished dentin surfaces were etched with a 35 % phosphoric acid etching gel and rinsed with water. Scotchbond Multi-Purpose (MP), EA and MA were used for bonding procedure. Z-250 composite resin was built-up on the adhesive-treated surfaces. Five teeth of each dentin adhesive group were subjected to mechanical load cycling. The teeth were sectioned into 2 mm thick slabs and then stained with 50 % ammoniacal silver nitrate. Ten specimens for each group were examined under scanning electron microscope in backscattering electron mode. All photographs were analyzed using image analysis software. Three regions of each specimen were used for evaluation of the silver uptake within the hybrid layer. The area of silver deposition was calculated and expressed in gray value. Data were statistically analyzed by two-way ANOVA and post-hoc testing of multiple comparisons was done with the Scheffe's test. Silver particles were observed in all the groups. However, silver particles were more sparsely distributed in the EA group and the MA group than in the MP group (p < .0001). There were no changes in nanoleakage patterns after load cycling.

• Restorative Dentistry and Endodontics
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• v.33 no.1
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• pp.45-53
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• 2008

The purpose of this study was to determine the effects on the elastic moduli of the adhesive and the hybrid layer from thermocycling. Twenty one human molars were used to create flat dentin surfaces. Each specimen was bonded with a light-cured composite using one of three commercial adhesives (OptiBond FL [OP], Clearfil SE Bond [CL], and Xeno III [XE]). These were sectioned into two halves and subsequently cut to yield 2-mm thickness specimens; one specimen for immediate bonding test without thermocycling and the other subjected to 10,000 times of thermocycling. Nanoindentation test was performed to measure the modulus of elasticity of the adhesive and the hybrid layer, respectively, using an atomic force microscope. After thermocycling, XE showed a significant decrease of the modulus in the adhesive layer (p < 0.05). Adhesives containing hydrophilic monomers are prone to hydrolytic degradation. It may result in the reduced modulus of elasticity, which leads to the mechanically weakened bonding interface.

• Korean Journal of Dental Materials
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• v.45 no.4
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• pp.301-310
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• 2018

The purpose of this study is to evaluate the compatibility of universal adhesives with two dual-cured resin cements. Eighty human molars were divided into eight groups. Tooth was embedded in self-curing acrylic resin and sectioned horizontally to exposure dentine surface. After polishing with 600-grit SiC paper, adhesives were applied. All-Bond Universal (Bisco), G-premio bond (GC), Scotch-bond universal (3M ESPE), Scotch-bond Multipurpose (3M ESPE) were used in this study. Calibra (Dentsply) as a conventional dual-curing resin cement and RelyX Ultimate (3M ESPE) as an amine free resin cement were used. The adhesives and the cements were applied according to the manufacturer's instructions. Final specimens were cylinder (diameter 2mm, height 3mm) shape. After storing in distilled water at $37^{\circ}C$ for 7 days the shear bond strength (SBS) test was performed. There was no significant difference in shear bond strength between the adhesives when RelyX Ultimate was used (p>0.05). However, when Calibra used with Scotch-bond Multipurpose and All-Bond Universal were used, statistically higher SBS was observed, as compared to the groups which Calibra cements with G-premio bond and Scotch-bond universal adhesive (p<0.05) were used. Within the limitations of this study, RelyX Ultimate resin cement was compatible with universal adhesives of various pH. All-Bond Universal adhesive was compatible with a resin cement containing the tertiary amine.

• Korean Chemical Engineering Research
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• v.53 no.5
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• pp.557-564
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• 2015

The previous etching, rinsing and drying processes of wafers for MEMS (microelectromechanical system) using SC-$CO_2$ (supercritical-$CO_2$) consists of two steps. Firstly, MEMS-wafers are etched by organic solvent in a separate etching equipment from the high pressure dryer and then moved to the high pressure dryer to rinse and dry them using SC-$CO_2$. We found that the previous two step process could be applied to etch and dry wafers for MEMS but could not confirm the reproducibility through several experiments. We thought the cause of that was the stiction of structures occurring due to vaporization of the etching solvent during moving MEMS wafer to high pressure dryer after etching it outside. In order to improve the structure stiction problem, we designed a continuous process for etching, rinsing and drying MEMS-wafers using SC-$CO_2$ without moving them. And we also wanted to know relations of states of carbon dioxide (gas, liquid, supercritical fluid) to the structure stiction problem. In the case of using gas carbon dioxide (3 MPa, $25^{\circ}C$) as an etching solvent, we could obtain well-treated MEMS-wafers without stiction and confirm the reproducibility of experimental results. The quantity of rinsing solvent used could be also reduced compared with the previous technology. In the case of using liquid carbon dioxide (3 MPa, $5^{\circ}C$, we could not obtain well-treated MEMS-wafers without stiction due to the phase separation of between liquid carbon dioxide and etching co-solvent(acetone). In the case of using SC-$CO_2$ (7.5 Mpa, $40^{\circ}C$), we had as good results as those of the case using gas-$CO_2$. Besides the processing time was shortened compared with that of the case of using gas-$CO_2$.