• Title/Summary/Keyword: Two-step adhesive

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The Laminating process for Single Substrate Flexible LCD

  • Bae, Kwang-Soo;Choi, Yoon-Seuk;Kim, Hak-Rin;Kim, Jae-Hoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08b
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    • pp.1125-1128
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    • 2007
  • The laminating technique for developing flexible liquid crystal display was demonstrated by using a thin UV curable polymer film and a plastic substrate with patterned polymer wall structure. We adopted the rigid wall structure to provide a solid mechanical support for the stable molecular alignment of liquid crystals (LCs) in the device. The cover film was prepared to have an ability of aligning LC molecules by patterning a micro-groove structure using the soft-lithographic process. These two substrates can be assembled tightly by the laminating and one-step UV irradiation process because of the adhesive nature of the used UV curable polymers. Proposed method can be used to fabricate the flexible LC display with simplicity and also be applicable for a cost-effective roll-to-roll process.

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Fabrication of Organic Nanowire Electronics by Direct Printing Method

  • Park, Gyeong-Seon;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.563-563
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    • 2012
  • We report a one-step fabrication of single-crystal organic nanowire arrays on substrates using a new direct printing method (liquid-bridge-mediated nanotransfer moulding, LB-nTM), which can simultaneously enable the synthesis, alignment and patterning of the nanowires using molecular ink solutions. Two- or three-dimensional complex structures of various single-crystal organic nanowires were directly fabricated over a large area with a successive process. The position of the nanowires can be aligned easily on complex structures because the mold is movable on substrates before drying the polar liquid layer, which acts as an adhesive lubricant. This efficient manufacturing method can produce a wide range of optoelectronic devices and integrated circuits with single-crystal organic nanowires.

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MICROLEAKAGE OF CL V COMPOSITE RESTORATIONS USING VARIOUS LIGHT CURING METHODS (광중합 복합레진 수복시 여러 광조사 방법에 따른 미세변연누출에 관한 연구)

  • Yang, Chol-Young;Yoo, Hyeon-Mee;Kwon, Hyuk-Choon
    • Restorative Dentistry and Endodontics
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    • v.25 no.2
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    • pp.299-308
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    • 2000
  • The purpose of this in vitro study was to evaluate the microleakage of 5 curing methods in class V composite restorations which are composed of two-step light curing, pulse-delay cure, low curing-light intensity, moderate curing-light intensity and high curing-light intensity. In this study, class V cavities were prepared on buccal and lingual surfaces of 50 extracted human upper or lower molars on cementum margin. Single Bond adhesive and Z-100 shade A2 were applied for each group following the manufacture's instruction. The experimental teeth were randomly divided into 5 groups of 10 samples (20 surfaces) each. Group 1: two-step light curing; Group 2: pulse-delay cure; Group 3: low curing-light intensity; Group 4: moderate curing-light intensity; Group 5: high curing-light intensity. After 500 thermocycling between $5^{\circ}C$ and $55^{\circ}C$, the 60 teeth were placed in 2% methylene blue dye for 24 hours, then rinsed with tab water. The specimens were embedded in clear resin, then sectioned buccolingually through the center of restoration with a low speed diamond saw. The dye penetration on each of the specimen was then observed with a stereomicroscope at ${\times}20$. The composite resin/tooth interfaces were examined under Scanning Electron Microscopy. The results were statistically analyzed using the Kruskal-Wallis One Way ANOVA and Dunn's Method. The results of this study were as follows. 1. In all groups, the leakage values seen at the enamel margin were significantly lower than those seen at the dentin margin(P<0.05). 2. No group in this study showed significant differences in leakage values at both the enamel and the dentin margins(P<0.05). 3. In all groups, the gaps seen at the enamel margin were significantly lower than those seen at the dentin margin(P<0.05). 4. The gaps in this study showed significant differences and two-step light-curing and low curing-light intensity produced significant less gap than high curing-light intensity(P<0.05).

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PaperMill - A Layered Manufacturing System Using Lamination and Micro Endmill (PaperMill - 박막과 마이크로 엔드밀을 사용한 적층조형 시스템)

  • 배광모;이상욱;이병철;강경수;김형욱;홍영정;진영성;김종철;박정화
    • Korean Journal of Computational Design and Engineering
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    • v.8 no.2
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    • pp.115-121
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    • 2003
  • A new Layered Manufacturing(LM) system, named PaperMill, is developed applying micro milling technology. A micro endmill(127 11m in diameter) is introduced as the cutter of build material. The selected build material for this system is an adhesive-coated paper roll which provides advantages such as good bonding between layers, machinability, and low material cost. A 3-axis CNC controller and three step-motors are used for the movement of X-Y-Z table of the system. For simplicity of the control of mechanism, the control system for feeding the paper roll is uncoupled from CNC controller. Two code converters are developed for the toolpath generation of the new LM system. The NC converter generates a set of NC codes for PaperMill using commercial CAM software while the SML converter generates an NC code from Quickslice's SML format. The NC codes generated from the converters consist of a series of profile data and trigger code for paper feeding. Two sample gears were fabricated to prove the concept of the system, which shown that the dimensional errors of the fabricated gears is under 3.4 percent.

ENAMEL ADHESION OF LIGHT-AND CHEMICAL-CURED COMPOSITES COUPLED BY TWO STEP SELF-ETCH ADHESIVES (2단계 자가 산부식 접착제와 결합된 광중합과 화학중합 복합레진의 법랑질 접착)

  • Han, Sae-Hee;Kim, Eun-Soung;Cho, Young-Gon
    • Restorative Dentistry and Endodontics
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    • v.32 no.3
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    • pp.169-179
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    • 2007
  • This study was to compare the microshear bond strength $({\mu}SBS)$ of light- and chemically cured composites to enamel coupled with four 2-step self-etch adhesives and also to evaluate the incompatibility between 2-step self-etch adhesives and chemically cured composite resin. Crown segments of extracted human molars were cut mesiodistally, and a 1 mm thickness of specimen was made. They were assigned to four groups by adhesives used: SE group (Clearfil SE Bond) AdheSE group (AdheSE), Tyrian group (Tyrian SPE/One-Step Plus), and Contax group (Contax) Each adhesive was applied to a cut enamel surface as per the manufacturer's instruction. Light-cured (Filtek Z250) or chemically cured composite (Luxacore Smartmix Dual) was bonded to the enamel of each specimen using a Tygon tube. After storage in distilled water for 24 hours, the bonded specimens were subjected to ${\mu}SBS$ testing with a crosshead speed of 1 mm/minute. The mean ${\mu}SBS$ (n=20 for each group) was statistically compared using two-way ANOVA, Tukey HSD, and t test at 95% level. Also the interface of enamel and composite was evaluated under FE-SEM. The results of this study were as follows ; 1. The ${\mu}SBS$ of the SE Bond group to the enamel was significantly higher than that of the AdheSE group, the Tyrian group, and the Contax group in both the light-cured and the chemically cured composite resin (p < 0.05). 2. There was not a significant difference among the hdheSE group, the Tyrian group, and the Contax group in both the light-cured and the chemically cured composite resin. 3. The ${\mu}SBS$ of the light-cured composite resin was significantly higher than that of the chemically cured composite resin when same adhesive was applied to the enamel (p < 0.05). 4. The interface of enamel and all 2-step self-etch adhesives showed close adaptation, and so the incompatibility of the chemically cured composite resin did not show.

An Evaluation of Shear Bond Strength of New Dentin Bonding Agents (최근 소개된 상아질 접착제의 전단 접착 강도 비교)

  • Shin, Jisun;Hwang, Eunji;Kim, Jongbin
    • Journal of the korean academy of Pediatric Dentistry
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    • v.44 no.3
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    • pp.358-364
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    • 2017
  • For the purpose of convenience and reducing time, newer bonding agents have been developed for composite resin restoration. Recently developed one bottle bonding system including etching, primer and adhesive can make procedures simpler and less technique-sensitive than old generation adhesives. The aim of this study was comparing the shear bond strength of new dentin bonding agents to the 5th generation bonding agent which had an etching step. 78 premolar teeth were randomly divided into three groups which were treated with $Tetric^{(R)}$ N-Bond Universal (Ivoclar Vivadent, Liechtenstein), $GC^{(R)}$ G-Premio BOND (GC Co., Japan) without additional etching step and $3M^{TM}$ Single Bond2 (3M ESPE, USA) with an etching step following manufacturer's instructions. $Filtek^{TM}$ Z-350 (3M ESPE, USA) composite resin was applied and light cured over bonding agents. For shear bond strength evaluation, universal testing machine was used with a wedge technique. As a result, shear bond strength of one step bonding agents was lower than two step bonding agent and there were statistically significant differences between them (p < 0.05). In addition, within the result of two new bonding agents, $Tetric^{(R)}$ N-Bond Universal showed significantly higher shear bond strength than $GC^{(R)}$ G-Premio BOND (p < 0.05).

SHEAR BOND STRENGTH OF "ONE-BOTTLE ADHESIVE" SYSTEM IN PRIMARY DENTIN. (One-Bottle 상아질 결합제의 유치 상아질에 대한 전단 결합 강도에 관한 연구)

  • Kim, Jong-Bin;Kim, Jong-Soo
    • Journal of the korean academy of Pediatric Dentistry
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    • v.27 no.3
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    • pp.444-456
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    • 2000
  • To test the shear bond strength of a new "one-bottle adhesive" system to primary dentin two commercially available one-bottle adhesives (Prime & Bond NT, Single bond) and conventional three step system(Scotchbond Multi-Purpose Plus) were included for comparison. And We observe the interfacial morphology by scanning electron microscope. 90 primary molar teeth were embedded in acrylic and buccal and lingual surface were polished to 320 grit to create standardized dentin surface for testing. After bonding of composite resin to sample surfaces according to the manufacturer s direction and 1000 times thermocycling in dwell time 30 second, Shear bond strengths of adhesives to dentin were determined using universal testing machine and analyzed by ANOVA test. Another groups of specimens were treated by hydrochloric acid to secure the resin only and those tags were evaluated under SEM for their length and forms and the morphology of the bonding sites were also observed. The result are as follows. 1. Group I(Prime & Bond NT) showed higher shear bond strength than group iI(Single Bond) and III(Scotchbond Multi Purpose Plus) but no statistically significant difference was founded between groups(p>.05). 2. Relating long resin tags of $70-120{\mu}m$ were observed in samples of all groups under SEM. We could observed hybrid layer, resin tag and many lateral branches in every group. But, we observed in group III rare lateral branched than other two group and discontinuous hybrid layer.

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Mixed Mode Analysis using Two-step Extension Based VCCT in an Inclined Center Crack Repaired by Composite Patching (복합재료 팻칭에 의한 중앙경사균열에서 2단계 확장 가상균열닫힘법을 사용한 혼합모우드해석)

  • Ahn, Jae-Seok;Woo, Kwang-Sung
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.32 no.1A
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    • pp.11-18
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    • 2012
  • This paper deals with the numerical determination of the stress intensity factors of cracked aluminum plates under the mixed mode of $K_I$ and $K_{II}$ in glass-epoxy fiber reinforced composites. For the stress intensity factors, two different models are reviewed such as VCCT and two-step extension method. The p-convergent partial layerwise model is adopted to determine the fracture parameters in terms of energy release rates and stress intensity factors. The p-convergent approach is based on the concept of subparametric element. In assumed displacement field, strain-displacement relations and 3-D constitutive equations of a layer are obtained by combination of 2-D and 1-D higher-order shape functions. In the elements, Lobatto shape functions and Gauss-Lobatto technique are employed to interpolate displacement fields and to implement numerical quadrature. Using the models and techniques considered, effects of composite laminate configuration according to inclined angles and adhesive properties on the performance of bonded composite patch are investigated. In addition to these, the out-of-plane bending effect has been investigated across the thickness of patch repaired laminate plates due to the change of neutral axis. The present model provides accuracy and simplicity in terms of stress intensity factors, stress distribution, number of degrees of freedom, and energy release rates as compared with previous works in literatures.

MICROTENSILE BOND STRENGTH OF DENTIN BONDING ADHESIVES ON BOVINE TEETH (Bovine teeth에 대한 수 종 상아질 접착제의 미세인장결합강도)

  • Song, Eun-Ju;Kim, Jae-Moon;Kim, Shin;Jeong, Tae-Sung
    • Journal of the korean academy of Pediatric Dentistry
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    • v.34 no.3
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    • pp.420-429
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    • 2007
  • The purpose of this study was to compare the micro ensile bond strength to bovine dentin of several adhesives (SM, Scotch $Bond^{TM}$ Multipurpose; SB, $Adper^{TM}$ Single Bond 2; SE, $Clearfil^{(R)}$ SE Bond; AQ, AQ $Bond^{TM}$; TS, $Clearfil^{(R)}$ tri-S Bond). Except SM and SB, they have a simplified one- or two-step application protocols in compare with the dentin adhesives conventional three-step protocols. For the microtensile bond strength test, the labial surfaces of bovine incisors were used. Following exposure of dentin layer, according to their manufacturer's directions, each dentin adhesives were applied and composite resin blocks were constructed. The teeth were sectioned for specimen and tested microtensile bond strength. Also observed the fracture mode of interface. The obtained results were as follows : 1. The microtensile bond strength values ranged from 51.34 to 24.04 MPa on dentin(in decreasing order, SE, SM, SB, AQ and TS). 2. The highest microtensile bond strength was by SE and SM on bovine dentin, and the lowest by AQ and TS. 3. SM, SB and SE showed cohesive failures and adhesive failure but AQ, TS presented almost adhesive failures. In summary, microtensile bond strengths of single-step adhesives (AQ and TS) on bovine dentin were significantly lower than those of multi-step adhesives (SM, SB and SE) (p<0.05).

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Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals

  • Gutmann, R.J.;Zeng, A.Y.;Devarajan, S.;Lu, J.Q.;Rose, K.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.3
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    • pp.196-203
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    • 2004
  • A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.