• Title/Summary/Keyword: Transversely Isotropic Property

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A Study on the Development of Photoelastic Experiment Model Material for Transversely Isotropic Material (횡등방성체용 광탄성재료 개발에 관한 연구)

  • 황재석;김병일;이광호;최선호
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.8
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    • pp.1876-1888
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    • 1995
  • In this paper, glass surface-mat reinforced epoxy(G.S.R.E.) is developed, It is assured that the material(G.S.R.E.) can be used as photoelastic model material and it satisfy with the required properties of photoelastic model material. Therefore, the material can be used as model material of transparent photoelastic experiment when we analyze the stress distributions of transversely isotropic material by photoelastic experiment. When we use G.S.R.E. as photoelastic experiment model material, we had better use the G.S.R.E. which fiber volume ratio is less than 0.7% in the high temperature(stress freezing method) and than 1.74% in the room temperature. Relationships between stress fringe value and elastic modulus in transversely isotropic material are developed in this paper, it is assured by experiment that they are established in the room temperature or in the high temperature. Therefore we can obtain stress fringe value or elastic modulus from the relationships between stress fringe value and elastic modulus.

Local stress field for torsion of a penny-shaped crack in a transversely isotropic functionally graded strip

  • Feng, W.J.;Su, R.K.L.
    • Structural Engineering and Mechanics
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    • v.18 no.6
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    • pp.759-768
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    • 2004
  • The torsion of a penny-shaped crack in a transversely isotropic strip is investigated in this paper. The shear moduli are functionally graded in such a way that the mathematics is tractable. Hankel transform is used to reduce the problem to solving a Fredholm integral equation. The crack tip stress field is obtained by taking the asymptotic behavior of Bessel function into account. The effects of material property parameters and geometry criterion on the stress intensity factor are investigated. Numerical results show that increasing the shear moduli's gradient and/or increasing the shear modulus in a direction perpendicular to the crack surface can suppress crack initiation and growth, and that the stress intensity factor varies little with the increasing of the strip's height.

Exact and complete fundamental solutions for penny-shaped crack in an infinite transversely isotropic thermoporoelastic medium: mode I problem

  • LI, Xiang-Yu;Wu, J.;Chen, W.Q.;Wang, Hui-Ying;Zhou, Z.Q.
    • Structural Engineering and Mechanics
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    • v.42 no.3
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    • pp.313-334
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    • 2012
  • This paper examines the problem of a penny-shaped crack in a thermoporoelastic body. On the basis of the recently developed general solutions for thermoporoelasticity, appropriate potentials are suggested and the governing equations are solved in view of the similarity to those for pure elasticity. Exact and closed form fundamental solutions are expressed in terms of elementary functions. The singularity behavior is then discussed. The present solutions are compared with those in literature and an excellent agreement is achieved. Numerical calculations are performed to show the influence of the material parameters upon the distribution of the thermoporoelastic field. Due to its ideal property, the present solution is a natural benchmark to various numerical codes and simplified analyses.

A Study on the Prediction of the Mechanical Properties of Printed Circuit Boards Using Modal Parameters (모달 파라미터 정보를 활용한 PCB 물성 예측에 관한 연구)

  • Choo, Jeong Hwan;Jung, Hyun Bum;Hong, Sang Ryel;Kim, Yong Kap;Kim, Jae San
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.41 no.5
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    • pp.421-426
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    • 2017
  • In this study, we propose a method for predicting the mechanical properties of the printed circuit board (PCB) that has transversely isotropic characteristics. Unlike the isotropic material, there is no specific test standard for acquisition of the transversely isotropic properties. In addition, common material test methods are not readily applicable to that type of laminated thin plate. Utilizing the natural frequency obtained by a modal test and the sizing optimization technique provided in $OptiStruct^{(R)}$, the mechanical properties of a PCB were derived to minimize the difference between test and analysis results. In addition, the validity of the predicted mechanical properties was confirmed by the MAC (Modal Assurance Criteria) value of each of the compared mode shapes. This proposed approach is expected to be extended to the structural analysis for the design verification of the top product that includes a PCB.

Transmission/reflection phenomena of waves at the interface of two half-space mediums with nonlocal theory

  • Adnan, Jahangir;Abdul, Waheed;Ying, Guo
    • Structural Engineering and Mechanics
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    • v.85 no.3
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    • pp.305-314
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    • 2023
  • The article is about the theoretical analysis of the transmission and reflection of elastic waves through the interface of perfectly connected materials. The solid continuum mediums considered are piezoelectric semiconductors and transversely isotropic in nature. The connection among the mediums is considered in such a way that it holds the continuity property of field variables at the interface. The concept of strain and stress introduced by non-local theory is also being involved to make the study more applicable It is found that, the incident wave results in the generation of four reflected and three transmitted waves including the thermal and elastic waves. The thermal waves generated in the medium are encountered by using the concept of three phase lag heat model along with fractional ordered time thermoelasticity. The results obtained are calculated graphically for a ZnO material with piezoelectric semiconductor properties for medium M1 and CdSc material with transversely isotropic elastic properties for medium M2. The influence of fractional order parameter, non-local parameter, and steady carrier density parameter on the amplitude ratios of reflected and refraction waves are studied graphically by MATLAB.

Impact Behavior Simulation of Anisotropic Materials (이방성 재료의 충격거동에 관한 시뮬레이션)

  • Ahn, Kook-Chan;Jung, Dae-Sik;Kim, Bong-Hwan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.10 no.1
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    • pp.38-46
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    • 2011
  • A study was performed to investigate the dynamic behaviors of fiber-reinforced composite materials subjected to transversely low-velocity impact. For this purpose, the simulation of modified beam finite element based on higher order beam theory for two(isotropic and anisotropic) materials is carried out according to the changes of material property, stacking sequence, geometric dimension and impact velocity of steel ball, etc. Main composite materials for simulation are composed of $[0^{\circ}/90^{\circ}/0^{\circ}/-90^{\circ}/0^{\circ}]_{2s}$, $[0^{\circ}/90^{\circ}/0^{\circ}/-90^{\circ}/0^{\circ}]_s$ and $[0^{\circ}/45^{\circ}/0^{\circ}/-45^{\circ}/0^{\circ}]_{2s}$, $[0^{\circ}/45^{\circ}/0^{\circ}/-45^{\circ}/0^{\circ}]_s$ stacking sequences. The effectiveness of this simulation for qualitative and quantitative evaluations in composite materials subjected to foreign object impact was established.

Dowel-embedment Properties-Based Finite Solid Element Model for Bolted Connections

  • Hong, Jung-Pyo;Kim, Hyun-Bae;Oh, Jung-Kwon;Lee, Jun-Jae
    • Journal of the Korean Wood Science and Technology
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    • v.42 no.5
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    • pp.563-570
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    • 2014
  • Two transversely isotropic plasticity-based models for wood, derived from the standard compression properties and the embedment properties were investigated for suitability of application for bolted connections. It was found that the conventional connection models involving the compression properties were incapable of simulating the real behaviour of the connections because the compression properties provided too stiff foundation to represent embedding behaviour of wood under the bolt. However, wood foundation-based connection model that was newly developed using the bolt embedment properties showed good agreement with the actual behaviour of bolted connections.