• 제목/요약/키워드: Transfer device

검색결과 1,122건 처리시간 0.031초

소형의 평판형 냉각장치 개발 (Development of Small Flat Plate Type Cooling Device)

  • 문석환;황건;강승열;조경익
    • 설비공학논문집
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    • 제22권9호
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    • pp.614-619
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    • 2010
  • Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of a slimness of the devices, so it is not easy to find the optimal thermal management solution for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint of the applications. In the present study, the silicon flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. The normal isothermal characteristics created by vapor-liquid phase change was confirmed through the experimental study. The cooling device with 70 mm of total length showed 6.8 W of the heat transfer rate within the range of $4{\sim}5^{\circ}C/W$ of thermal resistance. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of the silicon and glass cooling device.

Single-Crystal Silicon Thin-Film Transistor on Transparent Substrates

  • Wong, Man;Shi, Xuejie
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.1103-1107
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    • 2005
  • Single-crystal silicon thin films on glass (SOG) and on fused-quartz (SOQ) were prepared using wafer bonding and hydrogen-induced layer transfer. Thinfilm transistors (TFTs) were subsequently fabricated. The high-temperature processed SOQ TFTs show better device performance than the low-temperature processed SOG TFTs. Tensile and compressive strain was measured respectively on SOQ and SOG. Consistent with the tensile strain, enhanced electron effective mobility was measured on the SOQ TFTs.

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Synthesis of Graphene by Plasma Enhanced Chemical Vapor Deposition and Its transfer for Device Application

  • 서동익;한정윤;김언정;박완준
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
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    • pp.277-277
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    • 2010
  • In this report, we present a very effective growing method of graphene using plasma enhanced chemical vapor deposition(PECVD). The graphene is successfully grown on copper substrate. Low temperature growing is obtained with methane and hydrogen plasma. The graphene layers are analyzed by Raman spectroscopy and atomic force microscope. We also provide a transfer technique of graphene layer onto silicon substrate to build up various kinds of application devices.

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Parametric Transformer의 동작해석 (An analysis on the Parametric Transformer)

  • 황영문;정기화;박한웅
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1991년도 하계학술대회 논문집
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    • pp.31-33
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    • 1991
  • A passive power converter operating on the principle of parametric excitation, called Parametric transformer, is analyzed. The energy transfer from the input to the output is achieved through the double frequency variation of magnetic path reluctance to the input frequency without mutual flux coupling between two windings. Thus, output becomes available which is essentially independant of waveform of excitation. The mathmatical model of the device is developed and its solution is obtained. The outstanding characteristics of the device is explained from the analysis.

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Novel electrode architecture for transparent organic thin-film transistors

  • Chen, Fang-Chung;Chen, Tung-Hsien;Lin, Yung-Sheng
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.194-197
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    • 2006
  • One novel electrode-architecture has been adapted to fabricate transparent OTFTs. The device has more than 70% transmittance, yet reminds high performance. Furthermore, we also use transfer line method to prove that the device performance enhancement indeed contributes from the reduction of the contact resistances. It is anticipated that the transparent OTFTs would be very suitable to be the driving circuits for liquid crystal displays (LCDs).

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후향 계단이 부착된 회전하는 실린더 주위 난류 물질전달 - 유동유발 부식 - (Turbulent Mass Transfer Around a Rotating Stepped Cylinder - Flow-Induced Corrosion -)

  • 윤동혁;양경수
    • 대한기계학회논문집B
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    • 제31권9호
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    • pp.799-806
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    • 2007
  • Direct Numerical Simulation was carried out to predict mass transfer in turbulent flow around a rotating stepped cylinder. This investigation is a follow-up study of DNS of turbulent flow in Nesic et al. [Corrosion, Vol. 56, No. 10, pp. 1005 - 1014] The original motivation of this work stemmed from the efforts to design a simple device which can generate flows of high turbulence intensity at low cost for corrosion researchers. Two cases were considered; Sc=1 and 10 both at Re=335. Here, Sc and Re stand for Schmidt number and Reynolds number, respectively, based on the step height and the surface speed of the cylinder upstream of the step. Main focus was placed on the correlation between turbulence and mass transfer. The spatio-temporal evolution of concentration field is discussed. The numerical results are qualitatively compared with those of the experiment conducted with a similar flow configuration.

종횡비가 큰 사각 덕트내 난류 유동의 대류 열전달 증진 기술에 대한 연구 (TURBULENCE HEAT TRANSFER ENHANCEMENT TECHNIQUE FOR SQUARE DUCT WITH HIGH ASPECT RATIO)

  • 이찬용;신승원;정하승;박승호
    • 한국전산유체공학회:학술대회논문집
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    • 한국전산유체공학회 2010년 춘계학술대회논문집
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    • pp.305-307
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    • 2010
  • In this study, we develop a method to achieve heat transfer enhancement inside a square duct with high aspect ratio without changing any inner structures. Especially, a method to lower the possible maximum temperature is suggested if constant heat flux is provided to single surface of square duct. Knowing the fact that heat transfer rate is inversely proportional to flow area, we proposed tapered channel concept which uses narrower gap toward the flow exit where the maximum temperature is expected. To maintain equivalent power consumption, inlet section has been enlarged. To verify the proposed concept, experimental tests have been performed.

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첨두부하 저감을 위한 비상발전기 연계형 STS 운영 방안에 관한 연구 (A Study on Operation Scheme of STS with Emergency Generator for Peak Shedding)

  • 김창환;이상봉;김규호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2015년도 제46회 하계학술대회
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    • pp.155-156
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    • 2015
  • Recently, electricity consumption has rapidly increased along with economic growth. The operating strategy using emergency generator is aimed, to resolve a demand response management. For strategy of peak shedding using emergency generator, it is essential to introduce the fast transfer switching device. One of the most effective solutions is to use a static transfer switch (STS) based on thyristor. However, the characteristic of natural commutated SCR thyristor should anticipate short duration voltage sag. STS system thus requires more than a quarter cycle to successfully complete transfer process. This paper proposes the operation scheme of the STS system using the forced-commutation technique to mitigate instantaneous voltage sag during peak transfer process. Proposed STS system improved turn-off characteristic thus accomplishes the peak load shedding satisfied power quality. Performance of the proposed STS system is evaluated using electromagnetic transient program (EMTP) to confirm the effectiveness.

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타공파이프 절단을 위한 이송시스템 개발에 관한 연구 (A Study on the development of transfer system of cutting punched pipes.)

  • 박진석;윤두환;정찬세;김용석;양순용
    • 유공압시스템학회:학술대회논문집
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    • 유공압시스템학회 2010년도 춘계학술대회
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    • pp.66-69
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    • 2010
  • A punched pipe in a muffler for an automobile has many important variables, like location of holes in the pipe and length of the pipe related to noise reduction of a diffuser. This pipe is cut depending on length of product and this process, generally workers cut pipes by hands. In this process, there are many errors and it relies on the skill of workers, so it can happen that cycle time for complete product gets long and productivity gets low. Therefore, we need a vision system to distinguish holes in the punched pipe and a transfer system to set the cutting position automatically by moving the pipe depending on forward and backward part of the holes. This paper explains the development of an automatic transfer device which will cause the beating pipe to be cut correctly, exactly the same length as the product.

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