• Journal of the Korean Society for Precision Engineering
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• v.21 no.1
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• pp.140-148
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• 2004

A novel rapid prototyping (RP) process, a full-automated transfer type variable lamination manufacturing process (Full-automated VLM-ST) has been developed. In the full-automated VLM-ST process, a vacuum chuck and a rectilinear motion system transfer the EPS foam material in the form of the plate with two pilot holes to the rotary supporting stage. The supplied material is then cut into an automated unit shape layer (AUSL) with a desired width, a desired length, a desired slope on the side surface, and a pair of reference shapes, which is called the guide shape (GS)’, including two pilot holes in accordance with CAD data through cutting in two steps using a four-axis synchronized hotwire cutter. Then, each AUSL is stacked by setting each AUSL with two pilot holes in the building plate with two pilot pins, and subsequently, adhesive is applied onto the top surface of the stacked AUSL by a bonding roller and pressure is simultaneously given to the bottom surface of the stacked AUSL. Finally, three-dimensional shapes are rapidly and automatically fabricated. This paper describes the method to generate guide shapes in AUSL data for the full-automated VLM-ST process. In order to examine the applicability of the method to generate guide shapes, three-dimensional shapes, such as a piston shape and a human head shape, are fabricated from the full-automated VLM-ST apparatus.

• Elastomers and Composites
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• v.37 no.1
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• pp.31-38
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• 2002

Polymerization of carboxylated styrene-butadiene latex takes longer time than that of acrylic emulsion due to delocalization of radical in butadiene unit having conjugated double bond. A latex stability is the most important properties owing to use intact without separating polymer from base latex. For reducing polymerization time without decreasing any properties of latex, carbon tetra-chloride which has been used as the most popular chain transfer agent was replaced to combination of tert-dodecylmercaptane and ${\alpha}$-methylstyrene dimer. The replacement yielded reducement or 2 hr in polymerization time. In the increment step, charge amount of acrylic acid was limited to 0.3 part to restrain viscosity enhancement. Just after initial step, addition of 0.1 part acrylamide prevent polymer chain from diffusing between two region followed by giving hardness and final good adhesive force to latex particles.

• Journal of Fashion Business
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• v.27 no.4
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• pp.125-140
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• 2023

This study aimed to develop a smart wearable device for assessing the risk angle associated with turtle neck syndrome in patients with Video Display Terminal (VDT) syndrome. Turtle neck syndrome, characterized by forward head posture resulting from upper cross syndrome, leads to thoracic kyphosis. In this research, a stretch sensor was used to monitor the progression of turtle neck syndrome, and the sensor data was analyzed using a Universal Testing Machine (UTM) and the Gauge Factor (GF) calculation method. The scapula and cervical spine angles were measured at five stages, with 15-degree increments from 0° to 60°. During the experimental process, the stretch sensor was attached to the thoracic spine in three different lengths: 30mm, 50mm, and 100mm. Among these, the attachment method yielding the most reliable data was determined by measuring with three techniques (General Trim Adhesive, PU film, and Heat Transfer Machine), and clothing using the heat transfer machine was selected. The experimental results confirmed that the most significant change in thoracic kyphosis occurred at approximately 30° of forward head posture. Prolonged deformity can lead to various issues, highlighting the need for textile sensor solutions. The developed wearable device aims to provide users with real-time feedback on their turtle neck posture and incorporate features that can help prevent or improve the condition.

• Nuclear Engineering and Technology
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• v.55 no.12
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• pp.4317-4328
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• 2023

To ensure the measuring accuracy of the wall temperature, the outer wall temperature measurement values by using three kinds of thermocouple welding methods were analyzed and evaluated in the paper, including single-point flush-mounted in the wall groove method, single-point insert-mounted in the wall groove, and outer surface direct welding method, based on the application of a tube-in-tube condensing heat exchanger. And the impacts of silver, tin, and thermal resistance adhesive as filling materials on wall temperature measurement were also investigated, and the results were compared to that obtained without filling materials. The results showed that the wall temperatures measured by the three welding methods were lower than the theoretically calculated value. And the wall temperature measured by the outer surface direct welding method was lowest under the same experimental conditions. The wall temperatures measured by single-point flush-mounted and insert-mounted in the wall groove methods were also affected by different welding filling materials. It was found that the greater the thermal resistance of filling materials, the smaller the heat loss. By analyzing the reasons for the low measured value of wall temperature, a new wall temperature measurement method was developed to improve the accuracy of the current measurement method. Meanwhile, the outer wall temperature measurement experiments of vertical and horizontal heat transfer tubes were carried out to validate and calibrate the improved outer wall temperature measurement method. The results showed that the average outer wall temperature deviation measured by the improved wall temperature measurement method ranged from - 0.82% to +2.29% for vertical tubes and - 4.75% to - 1.44% for horizontal tubes, and the improved measurement method had good measurement accuracy.

• Journal of Advanced Marine Engineering and Technology
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• v.10 no.2
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• pp.136-145
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• 1986

The perfect and accurate methods to control the wear are not made clear so far. For this phenomenon only mating surface has been studied. In order to control the wear the essence of it has to be made clear. It is reported that adhesive wear might occure as a result of plastic deformation, the fracture and removal or transfer asperities on close contacting surfaces. On this view point the plastic flow was attempted to compare with fluid or electromagnetic flow. The partial differential equations of equilibrium for the plane strain deformation will make use of the method of characteristics. The characteristic curves or characteristics of the hyperbolic equation coincide with the slip lines by R. Hill's papers. By Hencky's stress equation, it is evident that if P and .phi. are prescribed for a boundary condition then it may be possible to proceed along constant .alpha. and .betha. lines to determine the value of the hydrostatic pressure everywhere in the slip line field net work. A wedge formation mechanism has been considered for an explanation of this matters. The analysis shows that there is a critical value, which depends on the hardness ratio and the shear stress on the interface, for the top angle of asperity is less than this critical value, the asperity can yield plastically despite of being harder than the mating surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1402-1405
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• 2003

The main object of this study was evaluated by the delamination damage for fiber stacking angle. Therefore, this work need to compare the shape of delamination for a different fiber stacking angie. So this study uses a method of fatigue test which was created [0]$_2$,[+45]$_2$[90]$_2$. The extension of the delamination zone formed between aluminium alloy and glass fiber-adhesive layer were measured by an ultrasonic C-scan image. As a result, the shapes of delamination zone don't depend upon the crack propagation. We could know that the delamination zone grew interaction between stress flow of fiber layer and crack driving force. Hence, the existing study were applied to the stress transfer, fiber bridging effect, delaminantion growth rate should need to the develop useful factor because of change of fiber stacking angle.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of Adhesion and Interface
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• v.12 no.1
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• pp.1-10
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• 2011

An automated reaction calorimeter was used to directly monitor the rate of emulsion polymerization of vinyl acetate using poly(vinyl alcohol) (PVAs) having different degrees of blockiness. By using this technique in conjunction with other off-line measurements of the evolution of particle size distributions, important details of the process were observed. No constant graft rate period was observed for both low and high initial monomer-water ratios. The gel effect was observed for the low monomer-water ratio recipe. The particle size distributions were broad (particle diameter 40~100 nm) and bimodal. Continuous nucleation was observed to be accompanied by 'limited aggregation' and flocculation during the particle growth stages. It was speculated to be due to the occurrence of the extensive 'limited aggregation' and chain transfer to PVA leading to grafting.

• Structural Engineering and Mechanics
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• v.72 no.4
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• pp.409-420
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• 2019

The paper presents the results of an experimental and numerical programme to characterize the behaviour of steel beams reinforcement by composite plates. Important failure mode of such plated beams is the debonding of the composite plates from the steel beam due to high level of stress concentration in the adhesive at the ends of the composite plate. In this new research, an experimental and numerical finite element study is presented to calculate the stresses in the sika carbodur and sika wrap reinforced steel beam under mechanical loading. The main objective of the experimental program was the evaluation of the force transfer mechanism, the increase of the load capacity of the steel beam and the flexural stiffness. It also validated different analytical and numerical models for the analysis of sika carbodur and sika wrap reinforced steel beams. In particular, a finite element model validated with respect to the experimental data and in relation to the analytical approach is presented. Experimental and numerical results from the present analysis are presented in order to show the advantages of the present solution over existing ones and to reconcile debonding stresses with strengthening quality.