• Elastomers and Composites
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• 제37권1호
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• pp.31-38
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• 2002

카르복실화 스티렌-부타디엔 라텍스의 중합시간은 사용되는 부타디엔 모노머가 공액 이중결합을 가진 화학적 구조로 인하여 라디칼 중합시 홀 전파의 비편재화로 인해 아크릴 에멀젼의 제조시 보다 중합시간이 매우 길다. 또한 라텍스 자체가 고분자와 분산매의 분리 없이 사용되기 때문에 라텍스의 안정성은 대단히 중요하다. 물성의 저하없이 반응시간을 단축하기 위하여 기존에 사용하던 연쇄이동제인 사염화탄소 대신 tert-dodecylmercaptane 과 ${\alpha}$-methylstyrene dimer를 혼합 사용하여 반응시간을 14시간에서 12시간으로 줄일 수 있었다. 반응 성장단계에서 아크릴산의 투입량을 0.3 part로 제한하여 라텍스의 점도 상승을 막고 초기중합단계 직후에 아크릴아미드를 0.1 part 첨가하여 라텍스 입자의 내부영역과 외부영역의 고분자 사슬의 상호간확산을 막아 단단하면서도 접착력을 유지할 수 있는 라텍스의 합성 결과를 얻었다.

• 패션비즈니스
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• 제27권4호
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• pp.125-140
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• 2023

This study aimed to develop a smart wearable device for assessing the risk angle associated with turtle neck syndrome in patients with Video Display Terminal (VDT) syndrome. Turtle neck syndrome, characterized by forward head posture resulting from upper cross syndrome, leads to thoracic kyphosis. In this research, a stretch sensor was used to monitor the progression of turtle neck syndrome, and the sensor data was analyzed using a Universal Testing Machine (UTM) and the Gauge Factor (GF) calculation method. The scapula and cervical spine angles were measured at five stages, with 15-degree increments from 0° to 60°. During the experimental process, the stretch sensor was attached to the thoracic spine in three different lengths: 30mm, 50mm, and 100mm. Among these, the attachment method yielding the most reliable data was determined by measuring with three techniques (General Trim Adhesive, PU film, and Heat Transfer Machine), and clothing using the heat transfer machine was selected. The experimental results confirmed that the most significant change in thoracic kyphosis occurred at approximately 30° of forward head posture. Prolonged deformity can lead to various issues, highlighting the need for textile sensor solutions. The developed wearable device aims to provide users with real-time feedback on their turtle neck posture and incorporate features that can help prevent or improve the condition.

• Nuclear Engineering and Technology
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• 제55권12호
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• pp.4317-4328
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• 2023

To ensure the measuring accuracy of the wall temperature, the outer wall temperature measurement values by using three kinds of thermocouple welding methods were analyzed and evaluated in the paper, including single-point flush-mounted in the wall groove method, single-point insert-mounted in the wall groove, and outer surface direct welding method, based on the application of a tube-in-tube condensing heat exchanger. And the impacts of silver, tin, and thermal resistance adhesive as filling materials on wall temperature measurement were also investigated, and the results were compared to that obtained without filling materials. The results showed that the wall temperatures measured by the three welding methods were lower than the theoretically calculated value. And the wall temperature measured by the outer surface direct welding method was lowest under the same experimental conditions. The wall temperatures measured by single-point flush-mounted and insert-mounted in the wall groove methods were also affected by different welding filling materials. It was found that the greater the thermal resistance of filling materials, the smaller the heat loss. By analyzing the reasons for the low measured value of wall temperature, a new wall temperature measurement method was developed to improve the accuracy of the current measurement method. Meanwhile, the outer wall temperature measurement experiments of vertical and horizontal heat transfer tubes were carried out to validate and calibrate the improved outer wall temperature measurement method. The results showed that the average outer wall temperature deviation measured by the improved wall temperature measurement method ranged from - 0.82% to +2.29% for vertical tubes and - 4.75% to - 1.44% for horizontal tubes, and the improved measurement method had good measurement accuracy.

• Journal of Advanced Marine Engineering and Technology
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• 제10권2호
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• pp.136-145
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• 1986

The perfect and accurate methods to control the wear are not made clear so far. For this phenomenon only mating surface has been studied. In order to control the wear the essence of it has to be made clear. It is reported that adhesive wear might occure as a result of plastic deformation, the fracture and removal or transfer asperities on close contacting surfaces. On this view point the plastic flow was attempted to compare with fluid or electromagnetic flow. The partial differential equations of equilibrium for the plane strain deformation will make use of the method of characteristics. The characteristic curves or characteristics of the hyperbolic equation coincide with the slip lines by R. Hill's papers. By Hencky's stress equation, it is evident that if P and .phi. are prescribed for a boundary condition then it may be possible to proceed along constant .alpha. and .betha. lines to determine the value of the hydrostatic pressure everywhere in the slip line field net work. A wedge formation mechanism has been considered for an explanation of this matters. The analysis shows that there is a critical value, which depends on the hardness ratio and the shear stress on the interface, for the top angle of asperity is less than this critical value, the asperity can yield plastically despite of being harder than the mating surface.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1402-1405
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• 2003

The main object of this study was evaluated by the delamination damage for fiber stacking angle. Therefore, this work need to compare the shape of delamination for a different fiber stacking angie. So this study uses a method of fatigue test which was created [0]$_2$,[+45]$_2$[90]$_2$. The extension of the delamination zone formed between aluminium alloy and glass fiber-adhesive layer were measured by an ultrasonic C-scan image. As a result, the shapes of delamination zone don't depend upon the crack propagation. We could know that the delamination zone grew interaction between stress flow of fiber layer and crack driving force. Hence, the existing study were applied to the stress transfer, fiber bridging effect, delaminantion growth rate should need to the develop useful factor because of change of fiber stacking angle.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 접착 및 계면
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• 제12권1호
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• pp.1-10
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• 2011

자동화된 반응 열량계를 이용하여 중합비율을 관찰하면서 blockiness가 다른 PVOH를 이용하여 VAE 에멀젼을 합성하였다. 입자 분포도를 관찰 결과 단량체와 물과 비율에 따른 일정한 그라프트율은 없었다. 초기 단량체-물의 비율이 낮은 곳에서 겔 효과가 관찰되었다. 또한 입자 분포는 넓고 이중 피크가 관찰되었다. 지속적으로 제한적으로 응징집되면서 입자성장이 이루어지는 것이 관찰되었다. 이것은 제한적인 응집현상과 사슬이 PVOH로 그라프팅되어 발생한 결과로 판단된다.

• Structural Engineering and Mechanics
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• 제72권4호
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• pp.409-420
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• 2019

The paper presents the results of an experimental and numerical programme to characterize the behaviour of steel beams reinforcement by composite plates. Important failure mode of such plated beams is the debonding of the composite plates from the steel beam due to high level of stress concentration in the adhesive at the ends of the composite plate. In this new research, an experimental and numerical finite element study is presented to calculate the stresses in the sika carbodur and sika wrap reinforced steel beam under mechanical loading. The main objective of the experimental program was the evaluation of the force transfer mechanism, the increase of the load capacity of the steel beam and the flexural stiffness. It also validated different analytical and numerical models for the analysis of sika carbodur and sika wrap reinforced steel beams. In particular, a finite element model validated with respect to the experimental data and in relation to the analytical approach is presented. Experimental and numerical results from the present analysis are presented in order to show the advantages of the present solution over existing ones and to reconcile debonding stresses with strengthening quality.

• Elastomers and Composites
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• 제11권1호
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• pp.54-62
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• 1976

It has been studied the graft copolymerization of glycidyl-methacrylate monomer containing two functional groups (vinyl- & epoxyl-) to chloroprene rubber. The reaction occured in the manner of chain transfer mechanism was carried out by means of solution polymerization in toluene in the presence of benzoyl peroxide as the radical initiator. The graft copolymer obtained from this work was analyzed by using IR spectrum, and the physical properties of the polymer such as the thermal behavior were also studied according to TG-DTA methods, and the potency of adhesiveness for the purpose of commercial application was investigated. Experimental results for the graft copolymerization are summarized as follows. 1) A small amount of initiator (0.5%) and 50% of monomer showed the best result for the grafting of monomer to the polymer chain of rubber while the 15% of rubber solution was found to be most suitable to raise either for the grafting ratio or the polymerization ratio. 2) Optimum temperature for better yield of graft copolymer was proved to he at $75^{\circ}C\sim80^{\circ}C$ while those of reaction time was to be $1\sim2$ hours.