• Steel and Composite Structures
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• v.31 no.4
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• pp.341-359
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• 2019

Non-monolithic concrete structural connections are commonly used both in new constructions and retrofitted structures where anchors are used for connections. Often, flaws are present in anchor system due to poor workmanship and deterioration; and methods available to check the quality of the composite system afterward are very limited. In case of presence of flaw, load transfer mechanism inside the anchor system is severely disturbed, and the load carrying capacity drops drastically. This raises the question of safety of the entire structural system. The present study proposes a wave propagation technique to assess the integrity of the anchor system. A chemical anchor (embedded in concrete) composite system comprising of three materials viz., steel (anchor), polymer (adhesive) and concrete (base) is considered for carrying out the wave propagation studies. Piezoelectric transducers (PZTs) affixed to the anchor head is used for actuation and the PZTs affixed to the surrounding concrete surface of the concrete-anchor system are used for sensing the propagated wave through the anchor interface to concrete. Experimentally validated finite element model is used to investigate three types of composite chemical anchor systems. Studies on the influence of geometry, material properties of the medium and their distribution, and the flaw types on the wave signals are carried out. Temporal energy of through time domain differentiation is found as a promising technique for identifying the flaws in the multi-layered composite system. The present study shows a unique procedure for monitoring of inaccessible but crucial locations of structures by using wave signals without baseline information.

• Structural Engineering and Mechanics
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• v.82 no.1
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• pp.17-30
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• 2022

The use of composite patches for the reduction of stresses at the level of the damaged zone in aeronautical structures has experienced rapid expansion given its advantages over conventional mechanical processes (riveting, bolting, etc.). Initially, The research axes in this field were aimed at choosing suitable mechanical properties for the composite and the adhesive, then to optimize the shape of the composite patch in order to ensure good load transfer and avoid having a debonding at the level of the edges essentially for the case of a repair by single side where the bending moment is present due to the non-symmetry of the structure. Our work falls within this context; the objective is to analyze by the finite element method the fracture behavior of a damaged plate repaired by composite patch. Stress reduction at the edge is accomplished by creating a variable angle chamfer on the composite patch. The effects of the crack length, the laminate sequence and the nature of the patch as well as the use of a hybrid patch were investigated. The results show clearly that a beveled patch reduces the stress concentrations in the damaged area and even at its edges. The hybrid patch also ensures good durability of the repair by optimizing its stacking sequence and the location of the different layers according to the fibers orientations.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.23-29
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• 2013

Development of flexible electronic devices has primarily focused on printing technology using organic materials. However, organic-based flexible electronics have several disadvantages, including low electrical performance and long-term reliability. Therefore, we fabricated nano- and micro-thick silicon film attached to the polymer substrate using transfer printing technology to investigate the feasibility of silicon-based flexible electronic devices with high performance and high flexibility. Flexibility of the fabricated samples was investigated using bending and stretching tests. The failure bending radius of the 200 nm-thick silicon film attached on a PI substrate was 4.5 mm, and the failure stretching strain was 1.8%. The failure bending radius of the micro-thick silicon film attached on a FPCB was 2 mm, and the failure strain was 3.5%, which showed superior flexibility compared with conventional silicon material. Improved flexibility was attributed to a buffering effect of the adhesive between the silicon film and the substrate. The superior flexibility of the thin silicon film demonstrates the possibility for flexible electronic devices with high performance.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06a
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• pp.5-18
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• 1996

The solid state cesium ion source os alumino-silicate based zeolite which contains cerium. The material is an ionic conductor. Cesiums are stably stored in the material and one can extract the cesiums by applying electric field across the electrolyte. Cesium ion bombardment has the unique property of producing high negative ion yield. This ion source is used as the primary source for the production of a negative ion without any gas discharge or the need for a carrier gas. The deposition of materials as an ionic species in the energy range of 1.0 to 300eV is recently recognized as a very promising new thin film technique. This energetic non-thermal equilibrium deposition process produces films by “Kinetic Bonding / Energetic Condensation" mechansim not governed by the common place thermo-mechanical reaction. Under these highly non-equilibrium conditions meta-stable materials are realized and the negative ion is considered to be an optimum paeticle or tool for the purpose. This process differs fundamentally from the conventional ion beam assisted deposition (IBAD) technique such that the ion beam energy transfer to the deposition process is directly coupled the process. Since cesium ion beam sputter deposition process is forming materials with high kinetic energy of metal ion beams, the process provider following unique advantages:(1) to synthesize non thermal-equilibrium materials, (2) to form materials at lower processing temperature than used for conventional chemical of physical vapor deposition, (3) to deposit very uniform, dense, and good adhesive films (4) to make higher doposition rate, (5) to control the ion flux and ion energy independently. Solid state cesium ion beam sputter deposition system has been developed. This source is capable of producing variety of metal ion beams such as C, Si, W, Ta, Mo, Al, Au, Ag, Cr etc. Using this deposition system, several researches have been performed. (1) To produce superior quality amorphous diamond films (2) to produce carbon nitirde hard coatings(Carbon nitride is a new material whose hardness is comparable to the diamond and also has a very high thermal stability.) (3) to produce cesiated amorphous diamond thin film coated Si surface exhibiting negative electron affinity characteristics. In this presentation, the principles of solid state cesium ion beam sputter deposition and several applications of negative metal ion source will be introduced.

• Applied Chemistry for Engineering
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• v.7 no.2
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• pp.280-288
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• 1996

In the ozone evolution using $PbO_2$, which was electrodeposited on Ti plate at various conditions in electrolyte, the effects of lead dioxide structure on the current efficiency and surface structure changes of lead dioxide were investigated. Also the effects of oxygen transfer reaction on the ozone evolution were investigated by means of a $PbO_2$ electrodeposited on the platinum rotating disk electrode. In order to develope an electrode for ozone evolution, durability of lead dioxide and optimum current density were investigated. At the electrodeposited lead dioxide with the larger grain size and higher crystallinity, the efficiency for ozone evolution was higher. Optimum current density to electrodeposite lead dioxide with large grain size and high crystalinity was $50mA/cm^2$. Lead dioxide deposited in the presence of glycerin showed the best advantage of ozone evolution. Also lead dioxide electrodeposited at less than $10mA/cm^2$ or at more than $100mA/cm^2$ has poor performance of ozone evolution and poor adhesive strength to substrate. In the beginning of ozone evolution, surface structure of lead dioxide was changed and this change resulted in good effects on ozone evolution. Lead dioxide doped with other elements was favorable not to ozone evolution but to oxygen evolution, so it is speculated that ozone evolution has not intermediate stage of oxygen evolution and occurs competitively with oxygen evolution. When ozone was evolved at $0.7{\sim}0.8A/cm^2$, the current efficiency was highest.

• The korean journal of orthodontics
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• v.28 no.2 s.67
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• pp.277-284
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• 1998

The purpose of this study was to evaluate the propriety of making use of the light-cured resin base in indirect bracket bonding technique by study of shear bond strength and failure patterns according to the material of resin base. Metal brackets were bonded to the stone models of specimens involving bovine lower incisor with chemical-cured(Excel), light-cured(Light-Bond) and thermal-cured(Therma-Cure) resin. They were transferred to the specimens and bonded using sealant. The shear bond strength was tested on Instron. After bracket removal, the bracket base was examined and assessed with the adhesive remnant index(ARI). The results were as follows : 1. No significant differences in shear bond strength were found among the three groups (P>0.05). 2. No significant differences in ARI score were found among the three groups (P>0.05). The above results suggest that light-cured resin base in addition to chemical-cured and thermal-cured resin bases is useful in the indirect bonding technique.

• Journal of Korean Society of Forest Science
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• v.63 no.1
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• pp.12-20
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• 1984

This research was performed to estimate the properties of particleboard based on the press time and temperature which was made of chip of larch that grows in Korea. The results in this study were as follows: 1) Even though the chips, 1:1-35 ratio between length and thickness, are relatively bad condition, the surface smoothness that can easily spread the adhesive evenly and thoroughly and bonding ability of chips can give proper physical properties. 2) It shows more mechanical properties at the press time of 10 min. in MOR (Modulus of Rupture), MOE (Modulus of Elasticity) and SHA (Screw Holding Ability). 3) It is not significant according to the press time 20 min. in MOR, IBS (Internal Bonding Strength) and SHA, for the reciprocal actions between the accelerating aging effect of chip and the softening effect of adhesion are occured. 4) IBS is rising according to the increasing temp at the press time of 10 min. Because it needs to transfer the plate heat to make the proper hardening temp. In the layer. 5) The heat treatment effects have greatly influenced the stahility of dimension by falling the absorption, anisotropy and inhomegenity. As a result of these the values of thickness and linear expansion ratio were respectively dropped by the increase of press temp and the time and so did absorption.

• Polymer(Korea)
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• v.30 no.6
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• pp.519-524
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• 2006

Poly(4-vinyl pyridine) (PVP) and its copolymers, poly(4-vinyl pvridine- co-acrylamide) and poly(4-vinyl pyridine-co-allylamine), were synthesized and evaluated for application to organic solder-ability preservatives (OSP). The copolymers were synthesized by radical polymerization of vinyl pyridine in the presence of acrylamide or allylamine as a comonomer. Various kinds of polymers with different chemical composition were synthesized by varying the feed ratio of monomers and their low $M_w$ polymers can be obtained by adding 2-mercaptoethanol as a chain transfer agent during poly-merization. All the polymers showed good adhesion properties on Cu pad when they were spin-coated. Especially, allylamine -containing copolymers showed both good adhesion and solubility properties. Also, they exhibited better thermal stability than PVP homopolymer and such thermal properties were changed depending on the chemical composition and their $M_w$, which were evidenced by the measurement of oxygen induced temperature (OIT). From the OIT measurement, poly(4-vinyl pyridine- co-allylamine) was thermally stable up to $230^{\circ}C$ for 70 min in the 100% oxygen environment. As a result, allylamine-containing copolymers can be considered as a promising OSP coating material that has excellent thermal and adhesive properties applicable to the present microelectronic package processes.

• Korean Journal of Microbiology
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• v.40 no.4
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• pp.286-294
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• 2004

Between 1997 and 1998 in Korea, 56 isolates of Escherichia coli were obtained from pig suffering diarrhea. Among those, 38 isolates that showed the hemolytic activity, antimicrobial resistance, and toxin production were studied. Among 38 isolates, thirty-six isolates $(94.7\%)$ were resistant to tetracycline, 27 isolates $(71.0\%)$ were resistant to ampicillin, 26 isolates $(68.4\%)$ were resistant to chloramphenicol, and 21 isolates $(55.2\%)$ were resistant to trimethoprim, while none was resistant to aztreonam, amikacin, and norfloxacin. Among these iso­lates, 21 isolates $(55.3\%)$ were multiple drug resistant to at least four different class antimicrobial agents. Extended spectrum $\beta-lactamase$ producing isolates were not detected in the double disk synergy test. In these hemolytic Escherichia coli, heat-stable enterotoxin $(89.5\%)$ was the most prevalent toxin, followed by vero­toxins $(47.4\%),$ and then heat-labile enterotoxin $(31.6\%).$ Except 8 isolates $(21.0\%)$ which produced ST only, 12 isolates $(31.6\%)$ produced ST and LT, 13 isolates $(34.2\%)$ produced ST, VT, and VTe, and 5 isolates $(13.2\%)$ produced VT and VTe. However, none produced all 4 types of toxin, simultaneously. The predominant serotype could not be determined by the agglutination method. Sixteen isolates $(42.1\%)$ were strongly adhered to T-24 bladder cell and 17 isolates $(44.7\%)$ were to Caco-2 intestinal cell. Especially, 11 strains $(28.9\%)$ were evaluated as strongly adhesive to both T-24 cells and Caco-2 cells. Genes for toxin and the antimicrobial resistance were transferred to clinical isolates of Escherichia coli from human urine by the filter mating method. Results suggest the possibility that antimicrobial resistance and toxin can be transferred from animals to humans by direct con­tact of resistant bacteria as well as gene transfer, although there was no correlation between toxin production, adherent activity, and antimicrobial resistance among hemolytic E. coli isolated from pig suffering diarrhea.

• Journal of the Korea Concrete Institute
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• v.14 no.1
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• pp.126-135
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• 2002

Plate bonding technique has been widely used in strengthening of existing concrete structures, although it has often a serious problem of premature falure such as interface separation and rip-off. However, this premature failure problem has not been well explored yet especially in view of local failure mechanism around the interface of plate ends. The purpose of the present study is, therefore, to identify the local failure of strengthened plates and to derive a separation criterion at the interface of plates. To this end, a comprehensive experimental program has been set up. The double lap pull-out tests considering pure shear force and half beam tests considering combined flexure-shear force were performed. The main experimental parameters include plate thickness, adhesive thickness, and plate end arrangement. The strains along the longitudinal direction of steel plates have been measured and the shear stress were calculated from those measures strains. The effects of plate thickness, bonded length, and plate end treatment have been also clarified from the present test results. Nonlinear finite element analysis has been performed and compared with test results. The Interface properties are also modeled to present the separation failure behavior of strengthened members. The cracking patterns as well as maximum failure loads agree well with test data. The relation between maximum shear and normal stresses at the interface has been derived to propose a separation failure criterion of strengthened members. The present study allows more realistic analysis and design of externally strengthened flexural member with steel plates.