• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.38 no.10
• /
• pp.687-698
• /
• 2001

This paper presents a three dimensional stacked pad area away (PAA) package configuration as an implementation method of radio frequency (RF) circuits. 224MHz RF circuits of intelligence traffic system(ITS) were constructed with the stacked PAA RF pakage configuration. In the process of manufacturing the stacked PAA RF pakage, RF circuits were partitioned to subareas following their function and operating frequency. Each area of circuits separated to each subunits. The operating characteristics of RF PAA package module and the electrical properties of each subunits were examined. The measurement of electrical parameters for solder balls which were interconnects for stacked PAA RF packages showed that the parasitic capacitance and inductance were 30fF and 120pH, respectively, which might be negligible in PAA RF packaging system. HP 4396B network/spectrum analyzer revealed that the amplification gain of a receiver and transmitter at 224 MHz was 22dB and 27dB, respectively. The gain was 3dB lower than designed values. The difference was probably generated from fabrication process of the circuits by employing commercial standard

• Korean Journal of Optics and Photonics
• /
• v.8 no.6
• /
• pp.510-515
• /
• 1997

Packaging takes an extremely important element of optical module cost due primarily to the added complication of alignment between semiconductor devices and optical fiber, and many efforts have been devoted on reducing the cost by eliminating the complicated optical alignment procedures in passive manner. In this study, we fabricated silicon optical benches on which the optical alignments are accomplished passively. To improve the positioning accuracy of a flip-chip bonded LD, we adopted fiducial marks and solder dams which are self-aligned with V-groove etch patterns, and a stand-off to control the height and to improve the heat dissipation of LD. Optical sub-assemblies exhibited an average efficiency of -11.75$\pm$1.75 dB(1$\sigma$) from the LD-to-single mode fiber coupling and an average sensitivity of -35.0$\pm$1.5 dBm from the fiber and photodetector coupling.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
• /
• v.16 no.6
• /
• pp.478-488
• /
• 2023

This paper investigates the naval application of laser communication as a potential replacement for traditional acoustic wave communication in underwater environments. We developed a laser transceiver using Arduino and MATLAB, conducting a water tank experiment to validate communication feasibility across diverse underwater conditions. In the first experiment, when transmitting data through a laser, the desired message was converted into data and transmitted, received, and confirmed to be converted into the correct message. In the second experiment, the operation of communication in underwater situations was confirmed, and in the third experiment, the intensity of light was measured using the CDS illuminance sensor module and the limits of laser communication were measured and confirmed in various underwater situations. Additionally, MATLAB code was employed to gather data on salinity, water temperature, and water depth for calculating turbidity. Optimal wavelength values (532nm, 633nm, 785nm, 1064nm) corresponding to calculated turbidity levels (5, 20, 55, 180) were determined and presented. The study then focuses on analyzing potential applications in naval tactical communication, remote sensing, and underwater drone control. Finally, we propose measures for overcoming current technological limitations and enhancing performance.