• Journal of the Korean Society for Precision Engineering
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• v.31 no.5
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• pp.403-409
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• 2014

For ground-based telescope application, the performance assessment of tip-tilt actuator is important because the optical quality of telescope depends upon the windshake compensation ability of the fast steering secondary mirror. But it is difficult to measure the performance characteristics of the actuators due to the large size mirror and test facilities including the vacuum support and structural frame. In this paper, the full-scale tip-tilt test bed for the large size secondary mirror with diameter of 1m is built and the several tests are performed including the range, resolution and frequency response function. From the measurement results, it is shown that the tip-tilt actuator can successfully compensate the windshake with frequency of maximum 12 Hz and be a candidate for the Giant Magellan Telescope.

• The Bulletin of The Korean Astronomical Society
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• v.36 no.2
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• pp.124.2-124.2
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• 2011

한국천문연구원은 GMT (Giant Magellan Telescope)의 부경 중의 하나인 FSM (Fast Steering Mirror)의 시험모델을 개발 중이다. 구경 1.06m의 비축 비구면 반사경을 경량화 가공을 하는 중이며, tip-tilt 제어를 위한 test-bed를 제작하고 시험하는 중이다. 이를 위하여 actuator control model과 진공 운영모델을 마련하고 있다. 또한 tip-tilt의 최종 성능시험을 위한 장치를 개발하기 위한 계획을 세우고 있다. 이 발표에서는 FSM 시험모델의 개발 현황에 대해 논한다.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.142-147
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• 2022

After introducing Hybrid Bonding technology into image sensors using stacked sensors and image processors, large quantity production became possible. As a result, it is currently used in most of the CMOS image market in smartphones and other image-based devices worldwide, and almost all stacked CIS manufacturing sites have focused on miniaturization using hybrid bonding. In this study, an upper wafer handling module for Wafer to Wafer Hybrid Bonding developed to increase the alignment and precision between wafers when wafer bonding. The module was divided two parts to reduce error of both the alignment and degree of precision during wafer bonding. Wafer handling module developed both new Tip/Tilt system controlling θx,θy of upper wafer and striker to push upper wafer. Based on this, it was confirmed through the stability evaluation that the upper wafer handling module can be controlled without any problem during W2W hybrid bonding.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.479-486
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• 2012

This paper presents a high-speed automatic micro-alignment system that is a part of an inspection machine for small-sized molded lenses of mobile phones, palm-top computers, and so on. This work was motivated by the shortcomings of existing highest-grade commercial machine. A simple tip/tilt/Z parallel mechanism is designed based on kinematic couplings, which is a 3-degree-of-freedom (3-DOF) moderate-cost alignment stage. It is used to automatically adjust the posture of each lens on the tray, which is impossible by the conventional instrument. Amplified piezoelectric actuators are used to ensure the accuracy and dynamic response. Forward kinematic analysis and simulation show that the parasitic motion is small enough compared to the actuator stroke. From the workspace analysis of the moving platform, it is clear that the output motion range satisfies the design requirements.