• Title/Summary/Keyword: Tin bath

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Effect of bath conditions and pulse parameters on tin surface finish for microelectronic packaging applications

  • Sharma, Ashutosh;Jung, Do-hyun;Jung, Jae-pil
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.11a
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    • pp.232-233
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    • 2015
  • The effects of various bath conditions such as surfactant concentration, bath pH, bath temperature, agitation of bath; as well as pulse parameters such as cathodic current density, pulse duty cycle and frequency, on the grain size, surface finish, and appearance of the tin plated coatings have been investigated. The plating bath under investigation is an aqueous acidic solution composed of a mixture of $SnSO_4$, $H_2SO_4$, and a surfactant. The bath conductivity and pH are measured by a glass pH electrode. The microstructure of the coatings produced is characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and surface profilometry. XRD analysis shows that the deposits consist of tetragonal ${\beta}$-Sn crystal structure irrespective of plating conditions. The mechanism involved in the morphology evolution in response to various parameters and conditions has also been discussed.

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Composition and microstructure of Silver-Tin alloy deposits from prophosphate bath (피로인산염욕을 사용한 은-주석 합금도금층의 조성 및 현미경 조직)

  • 예길촌;김용웅;김진수
    • Journal of the Korean institute of surface engineering
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    • v.26 no.3
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    • pp.143-148
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    • 1993
  • Composition and microstructures of Silver-Tin alloy deposits from a pyrophosphate bath were studied under the D.C. electrolysis conditions. Cathode current efficiency and throwing power of alloy deposits de-creased with increasing current density. Tin content of Ag-Sn alloy deposits decreased noticeably with the cur-rent density and with decreasing pH. The preferred orientation of the deposits tended to change in sequence of (110)longrightarrow(111)longrightarrow(100) texture with increasing the cathode overpotential. The surface structure of alloy deposits showed the smooth surface structure with fine crystallites.

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Porous Nickel-Tin Nano-Dendritic Electrode for Rechargeable Lithium Battery (리튬 이차 전지를 위한 다공성 니켈-주석 나노 수지상 전극)

  • Jung, Hye-Ran;Shin, Heon-Cheol
    • Korean Journal of Materials Research
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    • v.20 no.11
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    • pp.592-599
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    • 2010
  • A porous nickel-tin nano-dendritic electrode, for use as the anode in a rechargeable lithium battery, has been prepared by using an electrochemical deposition process. The adjustment of the complexing agent content in the deposition bath enabled the nickel-tin alloys to have specific stoichiometries while the amount of acid, as a dynamic template for micro-porous structure, was limited to a certain amount to prevent its undesirable side reaction with the complexing agent. The ratios of nickel to tin in the electro-deposits were nearly identical to the ratios of nickel ion to tin ion in the deposition bath; the particle changed from spherical to dendritic shape according to the tin content in the deposits. The nickel to tin ratio and the dendritic structure were quite uniform throughout the thickness of the deposits. The resulting nickel-tin alloy was reversibly lithiated and delithiated as an anode in rechargeable lithium battery. Furthermore, the resulting anode showed much more stable cycling performance up to 50 cycles, as compared to that resulting from dense electro-deposit with the same atomic composition and from tin electrodeposit with a similar porous structure. From the results, it is expected that highly-porous nickel-tin alloys presented in this work could provide a promising option for the high performance anode materials for rechargeable lithium batteries.

Reflectivity of Sn Solder for LED Lead Frame

  • Xu, Zengfeng;Gi, Se-Ho;Park, Sang-Yun;Kim, Won-Jung;Jeong, Jae-Pil
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2011.05a
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    • pp.184-185
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    • 2011
  • In this study, in order to obtain a high reflectivity for the LED lead frame, tin dip coating and tin plating were conducted respectively, and wettability of LED lead frame with tin solder also was tested by wetting balance tester. A Cu sheet was plated in Cu brighten electroplating bath and followed by immersion in a Sn electro-less plating bath [1]. On the other hand, in the dip coating process, a Cu sheet was dipped into molten tin. In the progress of wetting test, besides wetting balance curve, the maximum measured force($F_m$), the maximum withdrawal force($F_w$) and zero-cross time($t_0$) were obtained in various temperatures. With the maximum withdrawal force, the surface tension was calculated at different temperatures. The Cu sheet plated with bright Cu and Sn show a silver bright property while that of Cu dipped with Sn possessed a high reflectance density of 1.34GAM at $270^{\circ}C$.

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Melt Properties of Plasma Display Panel Substrate Glasses Based on Float Process (Float 공법을 고려한 Plasma Display Panel용 기판유리 용융체의 특성)

  • Kim, Ki-Dong;Jung, Woo-Man;Jung, Hyun-Su;Kwon, Sung-Ku;Choi, Se-Young
    • Journal of the Korean Ceramic Society
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    • v.43 no.7 s.290
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    • pp.433-438
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    • 2006
  • In order to examine the working condition of melts in tin bath of float process it was investigated Sn diffusion behavior and solidification rate of melts for alkali-alkaline earth-silica PDP substrate glasses such as commercial CaO rich CS-77 glass, commercial $Al_2O_3$ rich PD-200 glass and self developed $SiO_2$ rich T-series (T-2, T-4, T-6) glasses. In the case of Sn depth and concentration created in glass surface by ion exchange between Sn and alkali, T-series showed lower value than CS-77, especially T-2 is more excellent than PD-200. The solidification rate of melts expressed by cooling time between $log{\eta}=4\;and\;7.6dPa{\cdot}s$ was low for T-series comparing with CS-77 and PD-200. Therefore, it was concluded that T-series is desirable considering forming condition in the tin bath of the float process.

Composition and microstructure of Lead-Tin alloy electrodeposits (납-주석합금 도금층의 조성 및 조직특성)

  • 예길촌;지창훈
    • Journal of the Korean institute of surface engineering
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    • v.34 no.2
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    • pp.151-160
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    • 2001
  • The composition and the microstructure of the lead-tin alloy electrodeposited in a gluconate bath were invesitigated according to electrolysis conditions. The tin content of the lead-tin alloy electrodeposits increased with increasing current density and EDTA addition, while it decreased with increasing temperature and sodium gluconate concentration. The preferred orientation of the alloy deposits changed from the (220) plane through (200) to (200) + (111) planes with increasing cathode overpotential. The surface morphology of the films was closely related to both the preferred orientation and the alloy composition.

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Corrosion resistance and Hardness of Tin-Nickel Electrodeposits (주석-니켈합금 도금층의 내식성 및 경도)

  • 예길촌;채영욱
    • Journal of the Korean institute of surface engineering
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    • v.32 no.4
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    • pp.521-530
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    • 1999
  • The corrosion resistance and the hardness of the tin-nickel alloy deposits electroplated in pyrophosphate bath were invesitigated according to electrolysis conditions and microstructure of the alloy. The weight loss of alloy deposits increased with the Sn content of single phase (Ni-Sn) alloy showing the lowest weight loss in the alloy with 54∼57wt% Sn. On the other hand, the multiphase alloy with 35∼42wt% Sn showed the highest one. The CASS test result was consistent with that of immersion test, and was good agreement with the corrosion data of polarization measurements. The hardness of alloy deposits decreased with the increase of Sn ratio in bath due to the grain size increase of the alloy. However, it increased noticeably with decreasing current density in the bath condition of low Sn ratio (0.1)

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Recovery of Tin from Tin Oxide Resulted from Glass Manufacturing Process by Pyrometallurgy (유리생산공정 폐주석산화물에서 건식제련에 의한 주석회수기술)

  • Lee, Sang-Ro;Kim, Sang-Yeol;Lee, Man-Seung;Park, Man-Bok
    • Resources Recycling
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    • v.24 no.2
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    • pp.23-28
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    • 2015
  • Most of the domestic need for tin rely on imports. In this work, a pyrometallurgical process was investigated to recover pure tin from the tin oxides in tin bath which results from the production of flat glass and LCD panel. From the results on the effect of reaction temperature, the highest recovery percentage of tin was obtained at $1350^{\circ}C$. The recovery percentage of tin was improved to 88% by employing the first and second smelting step. Electrorefining of the crude tin thus obtained led to pure tin with purity higher than 99.9%.