• The Bulletin of The Korean Astronomical Society
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• 제37권2호
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• pp.111.2-111.2
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• 2012

We observed an Ellerman bomb(EB) and its associated surge using the Fast Imaging Solar Spectrograph(FISS) and the broadband TiO filter of the 1.6 meter New Solar Telescope at Big Bear Solar Observatory. As is well-known, the EB appears as a feature that is very bright at the far wings of the H alpha line. The lambdameter method applied to these wings indicates that the EB is blue-shifted up to 6km/s in velocity. In the photospheric level below the EB, we see rapidly growing "granule-like" feature. The transverse velocity of the dark lane at the edge of the "granule" increased with time as reached a peak of 6km/s, at the time of the EB's occurrence. The surge was seen in absorption and varied rapidly both in the H alpha and the Ca II 8542 line. It originated from the Ellerman bomb, and was impulsively accelerated to 20km/s toward us(blueshift). Then the velocity of the surge gradually changed from blueshift of 20km/s to redshift of 40km/s. By adopting the cloud model, we estimated the temperature of the surge material at about 27000K and the non-thermal velocity at about 10km/s. Our results shed light on the conventional idea that an EB results from the magnetic reconnection of an emerging flux tube and pre-existing field line.

• Transactions of the Korean Society of Mechanical Engineers
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• 제11권3호
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• pp.501-508
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• 1987

Experimental studies of particle (TiO$\_$2/) deposition from the laminar hot gas particle flow (about 1565K) onto the cold wall surface (about 1215K-1530K) were carried out by the 'real time' laser light reflectivity method (LLRM) and the photographs of scanning electron microscope(SEM). The LLRM was used for the measurement of thermophoretic deposition rates of small particles (d$\_$p/<3.mu.m), and the photographs of SEM were used for determining what factors control the collection of particles having diameters ranging from 0.2 to 30 microns. Two phenomena are primarily responsible for transport of the particles across the laminar boundary layers and deposition: (1) particle thermophoresis (i.e. particles migration down a temperature gradient), and (2) particle inertial impaction, the former effect being especially larger factor of the particle deposition in its size over the range of 0.2 to 1 microns. And also, this study indicates that thermophoresis can be important for particles as large as 15 microns. Beyond d$\_$p/=16.mu.m, this effect diminishes and the inertial impaction is taken into account as a dominant mechanism of particle deposition. The results of present experiments found to be in close agreement with existing theories.

• Journal of the Korean Ceramic Society
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• 제44권5호
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• pp.179-183
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• 2007

BCB $Resin-BaNd_2Ti_4O_{12}$(BNT) composites with BNT contents were prepared by tape casting method and epoxy resin-BNT composites were prepared by using heating press. Their dielectric properties and microstructures were investigated. The dielectric properties such as dielectric constant and dielectric loss at 1 MHz for epoxy resin-BNT composites and BCB resin-BNT composites are improved with an increase of BNT volume fraction. The dielectric constant of the Epoxy-BNT composite increased from 5.9 to 7.8 as the volume fraction of BNT increased from 15 to 25. The dielectric constant of the BCB-BNT composite increased from 9.1 to 15.5 as the volume fraction of BNT increased from 30 to 50. The dielectric behavior of BCB-BNT system can be explained by Lichtenecker's equation. The dielectric constant of epoxy resin-BNT composite is smaller than that of BCB resin-BNT composite. These results are considered to be related with the dispersion of BNT filler in polymer matrix from the result of SEM photograph.

• Journal of Electrical Engineering and Technology
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• 제7권6호
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• pp.959-964
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• 2012

Internal pressure of vacuum interrupter (VI) is one of the most important parameters in VI operation and may increase due to the outgassing from the materials inside VI or gas permeation through metal flange or ceramic vessel. The increase of the pressure above a certain level leads to the failures of switching or insulation. Therefore, an effective pressure check of VI is essential and an analysis of partial discharge (PD) characteristics is an effective monitoring method to identify the degree of the internal pressure of VI. This paper introduces a research work on monitoring the internal pressure of VI by analyzing PDs which were measured using a capacitive PD coupler. The authors have developed cost effective capacitive coupler based on the ceramic material that has an excellent insulation properties and the main component of the capacitive coupler is made by SrTiO3. Detectable internal pressure range and distinguishability of the internal pressure of VI were investigated. From the PD tests results, the internal pressure range, from $10^{-2}$ torr to 500 torr, can be monitored by PD measurements using the capacitive coupler and PD inception voltage (PDIV) follows the Paschen's law. In addition, rise time of PD pulse at 13.2kV decreases with the increase of the internal pressure of VI.

• The Transactions of the Korean Institute of Electrical Engineers C
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• 제51권9호
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• pp.449-454
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• 2002

A rectangular straight microchannel, integrated with the resistance temperature detectors(RTDs) for temperature sensing and a micro-heater for generating the Temperature gradient along the channel, was fabricated. Its dimension is 57${\mu}{\textrm}{m}$(H)$\times$200${\mu}{\textrm}{m}$(W)$\times$48,050${\mu}{\textrm}{m}$(L), and RTDs were placed at the inner-channel wall. Si wafer was used as a substrate. For the fabrication of RTDs, 5300$\AA$ thick Pt/Ti layer was sputtered on a Pyrex glass wafer. Finally, the glass wafer was bonded with Si wafer by anodic bonding, so that the RTDs are located inside the microchannel. Temperature coefficient of resistance(TCR) values of the fabricated Pt-RTDs were 2800~2950ppm$^{\circ}C$ and the variation of TCR value In the range of O~10$0^{\circ}C$ was less than 0.3％. Therefore, it was proved that the fabricated Pt-RTDs without annealing were excellent as temperature sensors. The temperature distribution in the microchannel was investigated as a function of mass flow rate and heating power. The temperature increase rate diminished with decreasing the applied power and increasing the mass flow rate. It was confirmed from the comparison with the simulation results that the temperature measured inside the microchannel is more accurate than measuring the temperature measured at the outer wall. The proposed temperature sensing method and microchannel are expected to be useful in microfluidics researches.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제16권7호
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• pp.573-578
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• 2003

Low temperature selective epitaxial growth of Si and SiGe has been obtained using an industrial single wafer chemical vapor deposition module operating at reduced pressure. Epitaxial Si and heteroepitaxial SiGe deposition with Ge content about 20 % has been studied as extrinsic base for self-aligned heterojunction bipolar transistors(HBTs), which helps to reduce the parasitic resistance to obtain higher maximum oscillation frequencies(f$\_$max/). The dependence of Si and SiGe deposition rates on exposed windows and their evolution with the addition of HCl to the gas mixture are investigated. SiH$_2$Cl$_2$ was used as the source of Si SEG(Selective Epitaxial Growth) and GeH$_4$ was added to grow SiGe SEG. The addition of HCl into the gas mixture allows increasing an incubation time even low growth temperature of 675∼725$^{\circ}C$. In addition, the selectivity is enhanced for the SiGe alloy and it was proposed that the incubation time for the polycrystalline deposit on the oxide is increased probably due to GeO formation. On the other hand, when only SiGe SEG(Selective Epitaxial Growth) layer is used for extrinsic base, it shows a higher sheet resistance with Ti-silicide because of Ge segregation to the interface, but in case of Si or Si/SiGe SEG layer, the sheet resistance is decreased up to 70 %.

• Proceedings of the KIEE Conference
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1938-1940
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• 2003

본 연구는 요소 센서 제작을 위한 과정으로서, 전기화학적 방법을 이용한 다공질 실리콘 구조 형성과, PDV(Physical Vapor Deposition) 법에 의한 백금 박막 코팅 및 전기화학적 전도성 고분자 코팅과 urease 고정화 단계를 고찰하고 감도 특성을 제시 하였다. 전극 기질로서 B을 도우핑한 p-type 실리콘웨이퍼를 사용하였고, HF:$C_2H_5OH:H_2O$=1:2:1의 부피비를 갖는 에칭 용액에서 5분간 -7 $mA/cm^2$의 일정 전류를 가하여 폭 2 ${\mu}m$, 깊이 10 ${\mu}m$의 다공질 실리콘(PS) 충을 형성하였다. 그 위에 200 ${\AA}$의 Ti 층을 underlayer로서 증착하고, 2000 ${\AA}$의 Pt를 중착하여 PS/Pt 박막 전극을 제작하고, 전도성 고분자로서 polypyrrole (PPy), 또는 poly(3-mehylthiophene) (P3MT)을 전기화학적으로 코팅한 후, urease(EC 3.5.1.5, type III, Jack Bean, Sigma)를 고정화 하였다. 고정화 시 전해질 수용액의 pH는 7.4로 하여 urease표면이 음전하를 갖도록 하고, 전극에 0.6 V (vs. SCE(Saturated Calomel Electrode))의 일정 전압을 가함으로써 urease가 전도성 고분자 표면에 전기적으로 흡착되도록 하였다. 이상의 방법으로 제작한 요소 센서의 감도는 PPy와 P3MT를 전자 전달 매질로 사용한 경우, 각각 8.44 ${\mu}A/mM{\cdot}cm^2$와 1.55 ${\mu}A/mM{\cdot}cm^2$의 감도를 보였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제31권1호
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• pp.19-23
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• 2018

In a Pb-included piezoelectric composition, $Sr_yPb_{1-y}[(Zn_{1/3}Nb_{2/3})_x-(Ni_{1/3}Nb_{2/3})_{0.2}-(Zr_{0.46}Ti_{0.54})_{0.8-x}]O_3$ was selected in order to attain high piezoelectric properties. According to the PZN ratio (x) and the amount of Sr doping (y), the crystal structure, microstructure and piezoelectric properties were measured and evaluated. In the case of Sr 4 mol% doping, the piezoelectric properties were the highest for a PZN ratio of 0.1. In this condition, the grain size was larger and the intensity was higher. With the PZN ratio fixed and varying the Sr doping, the piezoelectric properties increased until 10 mol% doping and then decreased for over 12 mol% doping. In the case of x＝0.1 and y＝10 mol%, the best piezoelectric properties were obtained, i.e., $d_{33}=660pC/N$ and $k_p=68.5%$, and these values seem to be related to the grain size and crystal structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.181-181
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• 2007

PTCR 세라믹스를 적층형 부품으로 제조할 경우 소형화, 저 저항화 및 과전류 유입 시 빠른 응답특성을 갖는다는 장점을 가지고 있으며, 이러한 적층형 부품제조시에는 내부전극재가 부품소자의 물성에 중요한 영향을 미친다. 특히 우수한 옴성 접촉(Ohmic Contact)을 갖는 Zn, Fe, Sn, Ni 등의 적층 PTC용 전극재는 높은 산화특성으로 인해 재산화 과정에서의 비옴성 접촉(Non-ohmic contact)을 갖게 되어 PTC 특성을 저하시킬 우려가 있다. 따라서 본 연구에서는 적층형 PTCR 세라믹스의 내부전극재와 반도체 세라믹층의 동시소성거동 및 적층 PTCR 세라믹스의 전기적 특성을 평가하였다. 본 연구에 적용된 내부전극재로는 Ni 전극을 사용하였고, Ni 전극용 paste로는 무공제 paste, 반도체 세라믹공제 paste, $BaTiO_3$ 공제 paste의 3종 전극재가 이용되었다. 적층형 PTCR 세라믹스의 제조공정은 테이프 캐스팅(Tape casting), 내부전극인쇄, 적층 및 동시소성을 포함하는 적층화공정을 적용하였다. 각각의 전극 paste를 적용하여 제조된 chip은 미세구조관찰, I-V특성, R-T특성 등을 평가하여 내부전극내 세라믹공제의 영향을 고찰하였다.

• Transactions on Electrical and Electronic Materials
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• 제3권1호
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• pp.14-17
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• 2002

The effects of substrate temperatures and annealing temperatures on the microstructures and ferroelectric properties of PbZ $r_{0.52}$ $Ti_{0.48}$ $O_3$(PZT) thin fims prepared by pulsed laser deposition (PLD) were investigated. For this purpose, the PZT films were deposited at various substrate temperatures (400~$600^{\circ}C$) with post annealing process in oxygen atmosphere. The single perovskite phase was formed at the deposition temperature of 500 to 55$0^{\circ}C$ without post annealing and the PZT films deposited below 50$0^{\circ}C$ formed the single phase with post annealing at $650^{\circ}C$. The grain size of the films increased and the grain boundary of the films was clearly defined as the substrate temperature increased from 400 to 55$0^{\circ}C$. The remnant polarization (Pr) and the coercive field (Ec) of the films deposited at 55$0^{\circ}C$ and annealed at $650^{\circ}C$ were 34.3 $\mu$C/c $m^2$and 60.2 kV/cm, respectively.y.y.