• Title/Summary/Keyword: TiC V/F

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MECHANICAL PROPERTIES OF TIN COATED FILM WITH VARIOUS COATING THICKNESS ON TITANIUM ALLOY (타이타늄 합금에 다양한 두께로 코팅된 TiN 피막의 기계적 성질)

  • Lee, Jae-Yun;Oh, Dong-Joon;Kim, Hee-Jung;Chung, Chae-Heon
    • The Journal of Korean Academy of Prosthodontics
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    • v.45 no.5
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    • pp.675-686
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    • 2007
  • Statement of problem: Titanium nitride(TiN) coatings are the most general and popular coating method and used to improve the properties of metallic surface for industrial purposes. When TiN coating applied to the abutment screw, frictional resistance would be reduced, as a results, the greater preload and prevention of the screw loosening could be expected. Purpose: The purpose of this study was to investigate mechanical properties of TiN coated film of various coating thickness on the titanium alloy surface and to evaluate proper coating thickness. Material and method: 95 Titanium alloy (Ti-6Al-4V) discs of 15 mm in diameter and 3 mm in thickness were prepared for TiN coating and divided into 7 groups in this study. Acceding to coating deposition time (CDT) with TiN by using Arc ion plating, were divided into 7 groups : Group A (CDT 30min), Group B (CDT 60min), Group C (CDT 90min), Group D (CDT 120min), Group E (CDT 150min), Group F(CDT 180min) and Group G (no CDT) as a control group. TiN coating surface was observed with Atomic Force Microscope(AFM), field emission scanning electron microscopy(FE-SEM) and examined with scratch tester, wear tester. Result: 1. Coating thickness fir each coated group was increased in proportion to coating deposition time. 2. Surface of all coated groups except Group A was homogeneous and smooth. However, surface of none coated Group G had scratch. 3. Adhesion strength for each coated group was increased in proportion to coating deposition time. 4. Wear resistance for each coated group was increased in proportion to coating deposition time. 5. Surface roughness in Group A, B, C was increased in proportion to coating deposition time. But, surface roughness in Group D, E, F was showed decreased tendency in proportion to coating deposition time. Conclusion: According to coating deposition time, mechanical properties of TiN coated film were changed. It was considered that 120 minutes coating deposition time ($1.32{\mu}m$ in coating thickness) is necessary.

Formation of Nanoporous TiO2 Thin Films on Si by Anodic Oxidation (양극산화에 의한 나노다공성 TiO2 박막 생성)

  • Yoon, Yeo-Jun;Kim, Do-Hong;Jang, Ho-Won
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.8
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    • pp.655-659
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    • 2010
  • Nanoporous titanium dioxide ($TiO_2$) is very attractive material for various applications due to the high surface to volume ratio. In this study, we have fabricated nanoporous $TiO_2$ thin films on Si by anodic oxidation. 500-nm-thick titanium (Ti) films were deposited on Si by using electron beam evaporation. Nanoporous structures in the Ti films were obtained by anodic oxidization using ethylene glycol electrolytes containing 0.3 wt% $NH_4F$ and 2 vol% $H_2O$ under an applied bias of 5 V. The diameter of nanopores in the Ti films linearly increased with anodization time and the whole Ti layer could become nanoporous after anodizing for 3 hours, resulting in vertically aligned nanotubes with the length of 200~300 nm and the diameter of 50~80 nm. Upon annealing at $600^{\circ}C$ in air, the anodized Ti films were fully crystallized to $TiO_2$ of rutile and anatase phases. We believe that our method to fabricate nanoporous $TiO_2$ films on Si is promising for applications to thin-film gas sensors and thin-film photovoltaics.

Studies on LiF-${Li_2}O-{B_2}{O_3}-{P_2}{O_5}$ based Glassy Solid Electrolytes (LiF-${Li_2}O-{B_2}{O_3}-{P_2}{O_5}$계 유리고체전해질에 관한 연구)

  • Park, Gang-Seok;Gang, Eun-Tae;Kim, Gi-Won;Han, Sang-Mok
    • Korean Journal of Materials Research
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    • v.3 no.6
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    • pp.614-623
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    • 1993
  • Electrical characteristics of LiF-$Li_{2}O-B_{2}O_{3}-P_{2}O_5$ glasses with fixed $Li_2O$ content have been investigated by using AC impedance spectroscopy. Part of the total lithium ions present in these glasses contributes to conduction, and the changes in electrical conductivity with composition was inconsistent with the weak electrolyte model. The power law could not be used to determine the hopping ion concentration in these glasses. Both mobile carrier density and mobility have been modified as Li were added in the form of LiF. The formation of $(B-O-P)^-,di^-$, and metaborate group gave additional available sites for Li+ diffusion causing the enhancement of conductivity. The observed maximum conductivity was $2.43 \times 10^{-4}$S/cm at $150^{\circ}C$ at the composition containing 8mol% LiF. The decomposion potential amounted to 5.94V. The Li/glass electrolyte/$TiS_2$ solid-state cell showed open circuit voltage of 3.14V and energy density of 22 Wh/Kg at $150^{\circ}C$.

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Etching Characteristics BST Thin Film in $CF_4$/Ar Plasma ($CF_4$/Ar 플라즈마에 의한 BST 박막 식각 특성)

  • 김동표;김창일;서용진;이병기;장의구
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.866-869
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    • 2001
  • In this study, (Ba,Sr)TiO$_3$(BST) thin films were etched with a magnetically enhanced inductively coupled plasma(MEICP). Etching characteristics of BST thin films including etch rate and selectivity were evaluated as a function of the etching parameters such as gas mixing ratio, rf power, dc bias voltage and chamber pressure. The maximum etch rate of the BST films was 1700 $\AA$/min at Ar(90)/CF$_4$(10), 600 W/350 V and 5 mTorr. The selectivity of BST to PR was 0.6, 0.7, respectively. To analyze the composition of surface residue remaining after the etching, samples etched with different CF$_4$/Ar gas mixing ratio were investigated with X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). From the results of XPS and SIMS, there are chemical reaction between Ba, Sr, Ti and C, F radicals during the etching and remained on the surface.

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Effect of Composition on Electrical Properties of SBT Thin Films Deposited by Reactive Sputtering (Reactive Sputtering으로 제조된 /SrBi_2Ta_2O_9$박막의 전기적 특성에 미치는 조성의 영향)

  • Park, Sang-Sik;Yang, Cheol-Hun;Chae, Su-Jin;Yun, Son-Gil;Kim, Ho-Gi
    • Korean Journal of Materials Research
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    • v.6 no.9
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    • pp.931-936
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    • 1996
  • 비휘발성 메모리 소자에의 적용을 위한 SrBi2Ta2O9(SBT)박막이 고순도의 Sr, Bi, Ti 금속타겟을 사용하여 Pt/Ti/SiO2/Si 기판 위에 reactive sputtering 법에 의해 증착되었다. 조성의 영향을 평가하기 위하여 Bi 타겟에 인가되는 전원의 변화와 열처리에 따른 C-F(capacitance-frequency), P-E(polarization-electric field), I-V(current-voltage)등의 전기적 특성이 조사되었다. Bi의 양이 증가함에 따라 Bi layer 구조를 나타내는 (105)회절 피크가 증가하였고 $700^{\circ}C$, 산소분위기에서 1시간 동안 열처리후 Sr과 Bi가 심하게 휘발되었으며 박막의 미세구조는 다공질이 되었다. 이러한 이유로 열처리된 박막의 누설 전류 밀도는 증가하였다. 열처리된 시편의 조성은 거의 화학양론비를 이루었으며 4.5$\mu$C/$\textrm{cm}^2$의 Pr값을 갖는 강유전(ferroelectric)특성을 나타내었다.

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Effects of Chamber Pressure on Dielectric Properties of Sputtered MgTiO3 Films for Multilayer Ceramic Capacitors

  • Park, Sang-Shik
    • Korean Journal of Materials Research
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    • v.20 no.7
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    • pp.374-378
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    • 2010
  • $MgTiO_3$ thin films were prepared by r.f. magnetron sputtering in order to prepare miniaturized NPO type MLCCs. $MgTiO_3$ films showed a polycrystalline structure of ilmenite characterized by the appearance of (110) and (202) peaks. The intensity of the peaks decreased with an increase in the chamber pressure due to the decrease of crystallinity which resulted from the decrease of kinetic energy of the sputtered atoms. The films annealed at $600^{\circ}C$ for 60min. showed a fine grained microstructure without micro-cracks. The grain size and roughness of the $MgTiO_3$ films decreased with the increase of chamber pressure. The average surface roughness was 1.425~0.313 nm for $MgTiO_3$ films prepared at 10~70 mTorr. $MgTiO_3$ films showed a dielectric constant of 17~19.7 and a dissipation factor of 2.1~4.9% at 1MHz. The dielectric constant of the films is similar to that of bulk ceramics. The dielectric constant and the dissipation factor decreased with the increase of the chamber pressure due to the decrease of grain size and crystallinity. The leakage current density was $10^{-5}\sim10^{-7}A/cm^2$ at 200kV/cm and this value decreased with the increase of the chamber pressure. The small grain size and smooth surface microstructure of the films deposited at high chamber pressure resulted in a low leakage current density. $MgTiO_3$ films showed a near zero temperature coefficient and satisfied the specifications for NPO type materials. The dielectric properties of the $MgTiO_3$ thin films prepared by sputtering suggest the feasibility of their application for MLCCs.

Study on Angular Rate Sensor using Sol-Gel PZT thin film (Sol-gel 압전체 박막을 이용한 각속도 센서에 대한 연구)

  • Lee, S. H.;R. Meada;M. Esashi
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.03a
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    • pp.34-34
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    • 2003
  • Piezoelectric or magnetostrictive materials, known as smart materials, have been researched widely for sensors or actuators in micro system technology. In our research, thick sol-gel lead zirconate titanate(Pb(Zr$\sub$1-x/Ti$\sub$x/)O$_3$) films were fabricated and their characteristics were investigated f3r angular rate sensor applications. The thickness of the PZT films is 1.5${\mu}$m, which is required by a vibration angular rate sensor for a good actuation and sensing. The remnant polarization of the PZT flms is 12.0 ${\mu}$C/$\textrm{cm}^2$. The electromechanical constants of PZT thin film showed the value of susceptance(B) of 4800${\mu}$ s at capacitance of 790pF. The PZT films were applied to the vibration angular rate sensor structure and the vibration of 1.78 ${\mu}$m in amplitude at the resonant frequency of 35.8㎑ was obtained by driving voltage of 5V$\sub$p-p/ of bulk piezoelectric materials with out of phase signal through voltage and inverting amplifier.

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Simultaneous treatment of Cr(VI) and EDCs using flat type photocatalytic reactor under solar irradiation (평판형 태양광반응기를 이용한 복합오염물질의 동시처리 연구)

  • Kim, Saewon;Cho, Hyekyung;Joo, Hyunku;Her, Namguk;Yi, Kwangbok;Kim, Jong Oh;Yoon, Jaekyung
    • Journal of Korean Society of Water and Wastewater
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    • v.30 no.5
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    • pp.501-509
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    • 2016
  • In this study, a flat-type photocatalytic reactor is applied under solar irradiation for simultaneous treatment of target pollutants: reduction of Cr(VI) to Cr(III) and oxidation of EDCs (BPA, EE2, E2). An immobilized type of photocatalyst was fabricated to have self-grown nanotubes on its surface in order to overcome limitations of powdery photocatalyst. Moreover, Ti mesh form was chosen as substrate and modified to have both larger surface area and photocatalyst content. Ti mesh was anodized at 50V and $25^{\circ}C$ for 30min in the mixed electrolytes ($NH_4F-H_2O-C_2H_6O_2$) and annealed at $450^{\circ}C$ for 2 hours in ambient oxygen to have anatase structure. Surface characterization was done with SEM and XRD methodologies. Fabricated NTT was applied to water treatment, and coexisting Cr(VI) and organics (EDCs) enhanced each other's reactions by scavenging holes and electrons and thus impeding recombination. Also, several experiments were conducted outdoor under direct sunlight and it was observed that both solar-tracking and applying modified photocatalyst were proven to enhance reaction efficiency.

CMOS 소자 응용을 위한 Plasma doping과 Silicide 형성

  • Choe, Jang-Hun;Do, Seung-U;Seo, Yeong-Ho;Lee, Yong-Hyeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.456-456
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    • 2010
  • CMOS 소자가 서브마이크론($0.1\;{\mu}m$) 이하로 스케일다운 되면서 단채널 효과(short channel effect), 게이트 산화막(gate oxide)의 누설전류(leakage current)의 증가와 높은 직렬저항(series resistance) 등의 문제가 발생한다. CMOS 소자의 구동전류(drive current)를 높이고, 단채널 효과를 줄이기 위한 가장 효율적인 방법은 소스 및 드레인의 얕은 접합(shallow junction) 형성과 직렬 저항을 줄이는 것이다. 플라즈마 도핑 방법은 플라즈마 밀도 컨트롤, 주입 바이어스 전압 조절 등을 통해 저 에너지 이온주입법보다 기판 손상 및 표면 결함의 생성을 억제하면서 고농도로 얕은 접합을 형성할 수 있다. 그리고 얕은 접합을 형성하기 위해 주입된 불순물의 활성화와 확산을 위해 후속 열처리 공정은 높은 온도에서 짧은 시간 열처리하여 불순물 물질의 활성화를 높여주면서 열처리로 인한 접합 깊이를 얕게 해야 한다. 그러나 접합의 깊이가 줄어듦에 따라서 소스 및 드레인의 표면 저항(sheet resistance)과 접촉저항(contact resistance)이 급격하게 증가하는 문제점이 있다. 이러한 표면저항과 접촉저항을 줄이기 위한 방안으로 실리사이드 박막(silicide thin film)을 형성하는 방법이 사용되고 있다. 본 논문에서는 (100) p-type 웨이퍼 He(90 %) 가스로 희석된 $PH_3$(10 %) 가스를 사용하여 플라즈마 도핑을 실시하였다. 10 mTorr의 압력에서 200 W RF 파워를 인가하여 플라즈마를 생성하였고 도핑은 바이어스 전압 -1 kV에서 60 초 동안 실시하였다. 얕은 접합을 형성하기 위한 불순물의 활성화는 ArF(193 nm) excimer laser를 통해 $460\;mJ/cm^2$의 에니지로 열처리를 실시하였다. 그리고 낮은 접촉비저항과 표면저항을 얻기 위해 metal sputter를 통해 TiN/Ti를 $800/400\;{\AA}$ 증착하고 metal RTP를 사용하여 실리사이드 형성 온도를 $650{\sim}800^{\circ}C$까지 60 초 동안 열처리를 실시하여 $TiSi_2$ 박막을 형성하였다. 그리고 $TiSi_2$의 두께를 측정하기 위해 TEM(Transmission Electron Microscopy)을 측정하였다. 화학적 결합상태를 분석하기 위해 XPS(X-ray photoelectronic)와 XRD(X-ray diffraction)를 측정하였다. 접촉비저항, 접촉저항과 표면저항을 분석하기 위해 TLM(Transfer Length Method) 패턴을 제작하여 I-V 특성을 측정하였다. TEM 측정결과 $TiSi_2$의 두께는 약 $580{\AA}$ 정도이고 morphology는 안정적이고 실리사이드 집괴 현상은 발견되지 않았다. XPS와 XRD 분석결과 실리사이드 형성 온도가 $700^{\circ}C$에서 C54 형태의 $TiSi_2$ 박막이 형성되었고 가장 낮은 접촉비저항과 접촉저항 값을 가진다.

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Characteristics of the ( Pb, La ) $TiO_3$ Thin Films with Pb/La Compositions (Pb/La 조성에 따른 ( Pb, La ) $TiO_3$ 박막의 특성 변화)

  • Kang, Seong-Jun;Joung, Yang-Hee;Yoon, Yung-Sup
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.36D no.1
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    • pp.29-37
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    • 1999
  • In this study, we have prepared PLT thin films having various La concentrations by using sol-gel method and studied on the effect of La concentration on the electrical properties of PLT thin films. As the La concentration increases from 5mol% to 28mol%, the dielectric constant at 10kHz increases from 428 to 761, while the loss tangent decreases from 0.063 to 0.024. Also, the leakage current density at 150kV/cm has a tendency to decrease from 6.96${\mu}A/cm^2$ to 0.79${\mu}A/cm^2$. In the result of hysteresis loops of PLT thin films, the remanent polariation and the coercive field decrease from 9.55${\mu}C/cm^2$ to 1.10${\mu}C/cm^2$ and from 46.4kV/cm to 13.7kV/cm, respectively. With the result of the fatigue test on the PLT thin films, we have found that the fatigue properties are improved remarkably as the La concentration increases from 5 mol% to 28mol%. In particular, the PLT28) has paraelectric phase and its charge storage clensity and leakage current density at 5V are 134fC/${\mu}cm^2$ and 1.01${\mu}A/cm^2$, respectively. The remanent polarization and coercive field of the PLT(10) film are 6.96${\mu}C/cm^2$ and 40.2kV/cm, respectively. After applying of $10^9$ square pulses with ${\pm}5V$, the remanent polarilzation of the PLT(10) film decreases about 20% from the initial state. In the results, we conclude that the 10mol% and the 28mol% La doped PLT thin films are very suitable for the capacitor dielectrics of new generation of DRAM and NVFRAM respecitively.

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