• Journal of the Korean Society for Heat Treatment
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• v.19 no.5
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• pp.249-256
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• 2006

Structural studies have been performed on precipitation hardening found in $L1_2$ ordered ${\gamma}^{\prime}-Ni_3(Al,Ti)$ alloys using transmission electron microscopy. A uniform solid solution of ${\gamma}^{\prime}-L1_2$ ordered phase supersaturated with Ni can be obtained by solution annealing in a suitable temperature range. The ${\gamma}^{\prime}$ phase hardens appreciably by the fine precipitation of disordered ${\gamma}$. The shape of ${\gamma}$ precipitates formed during aging is initially spherical or round-cubic and grow into platelets as aging proceeds. High resolution electron microscopy revealed that the ${\gamma}$ precipitates are perfectly coherent with the matrix ${\gamma}^{\prime}$ as long as the ${\gamma}$-precipitates are plates. The loss of coherency initiates by the introduction of dislocations at the ${\gamma}/{\gamma}^{\prime}$ interface followed by the step formation at the dislocations. The ${\gamma}$ precipitates become globular after the loss of coherency. The strength of ${\gamma}^{\prime}-Ni_3(Al,Ti)$ increases over the temperature range of experiment by the precipitation of fine ${\gamma}$ particles. The peak temperature where a maximum strength was obtained shifted to higher temperature.

• Korean Journal of Materials Research
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• v.30 no.2
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• pp.57-60
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• 2020

Titanium aluminides have attracted special interest as light-weight/high-temperature materials for structural applications. The major problem limiting practical use of these compounds is their poor ductility and formability. The powder metallurgy processing route has been an attractive alternative for such materials. A mixture of Ti and Al elemental powders was fabricated to a mechanical alloying process. The processed powder was hot pressed in a vacuum, and a fully densified compact with ultra-fine grain structure consisting of Ti₃Al intermetallic compound was obtained. During the compressive deformation of the compact at 1173 K, typical dynamic recrystallization (DR), which introduces a certain extent of grain refinement, was observed. The compact had high density and consisted of an ultra-fine equiaxial grain structure. Average grain diameter was 1.5 ㎛. Typical TEM micrographs depicting the internal structure of the specimen deformed to 0.09 true strain are provided, in which it can be seen that many small recrystallized grains having no apparent dislocation structure are generated at grain boundaries where well-developed dislocations with high density are observed in the neighboring grains. The compact showed a large m-value such as 0.44 at 1173 K. Moreover, the grain structure remained equiaxed during deformation at this temperature. Therefore, the compressive deformation of the compact was presumed to progress by superplastic flow, primarily controlled by DR.

• Korean Journal of Materials Research
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• v.4 no.4
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• pp.483-490
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• 1994

The effect of vanadium additions on the thermal stability of Al-TI alloy \vas investigated. Al- 8wt.%Ti and Al-8wt.%(Ti+V) alloys wirh different Ti to V atomic ratios of 3 : 1 and 1 : 1 were pre- pared by mechanical alloying. The steady states wwe obtalncd after mechanical alloy~ng for ltihours for all the alloy compositions. The mechanically alloyed powders were consolidaicd by vacuum hot pressing and thermal st.ability was investigated by hardness testing afrcr aging thc specimens at $400^{\circ}C$, $480^{\circ}C$, $550^{\circ}C$ for up to 1000hrs. It was confirmed that addit~on of V- increased the thermal stability of Al-Ti alloy by reducing coarsening rate of $Ai_{3}Ti$ intermetallic compound.

• Korean Journal of Materials Research
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• v.28 no.4
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• pp.195-200
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• 2018

This study investigated the effects of the post annealing temperatures on the electrical and interfacial properties of a metal-semiconductor-metal photodetector(MSM-PD) device. The interdigitate type MSM-PD devices had the structure Al(500 nm) / Ti(200 nm) / poly-Si(500 nm). Structural analyses of the MSM-PD devices were performed by employing X-ray diffraction(XRD), scanning electron microscopy(SEM) and transmission electron microscope(TEM). Electrical characteristics of the MSM-PD were also examined using current-voltage(I-V) measurements. The optimal post annealing condition for the Schottky contact of MSM-PD devices are $350^{\circ}C$-30minutes. However, as the annealing temperature and time are increased, electrical characteristics of MSM-PD device are degraded. Especially, for the annealing conditions of $400^{\circ}C$-180minutes and $500^{\circ}C$-30minutes, the I-V measurement itself was impossible. These results are closely related to the solid phase reactions at the interface of MSM-PD device, which result in the formation of intermetallic compounds such as $Al_3Ti$ and $Ti_7Al_5Si_{12}$.

• Journal of Welding and Joining
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• v.17 no.5
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• pp.107-115
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• 1999

The objective of this research was to study the formation of the thick hardened layer with the addition of metal powder(Cu) and ceramics powders(TiC) on the aluminum 5083 alloys by plasma transferred arc process(PTA process) and to characterize the effect of overlaying conditions on the overlaid layer formation. This was followed by investigating the microstructures of the overlaid layers and mechanical properties such as hardness and wear resistance. The overlaid layer containing copper powder was alloyed and intermetallic compound($CuAl_2$) was formed. The overlaid layers with high melting point TiC powders, however, did not react with base metal. Wear resistance of the alloyed layer was remarkably improved by the formation of $CuAl_2$, precipitate phase, which prevented wear of base aluminum alloys and at higher wear speed, accelerated sliding of the counter part. Wear resistance of the composite layer was also remarkably improved because TiC powder act as a load barring element and Fe debris fragments detached from the counter part act as a solid lubricant on the contact surface.

• Journal of the Korean Society for Heat Treatment
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• v.12 no.2
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• pp.145-156
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• 1999

The distribution of the second phase, the change of transformation temperature and mechanical properties with thermomechanical treatment conditions were investigated by metallography, calorimetry, EDS, tensile test and fractography in a Cu-Al-Ni-Ti-Mn alloy. The cast structure revealed Ti-rich precipitates($X_L$ phase) between dendrite arms, which have been identified as $(Cu,Ni)_2TiAl$ intermetallic compounds. By homogenizing above $900^{\circ}C$, the $X_L$ phase was melted in the matrix, while the Xs phase was precipitated in matrix and the volume fraction of it was increased. When hot-rolled specimen was betatized below $750^{\circ}C$, recrystallization could not be observed. However, the specimen betatized above $800^{\circ}C$ was recrystallized and the grain size was about $50{\mu}m$, while Xs phase was precipitated in matrix. With raising betatizing temperature, $M_s$ and $A_s$ temperatures were fallen and transformation hysteresis became larger. The strain of the specimen betatized at $800^{\circ}C$ was 8.2% as maximum value. The maximum shape recovery rate could be obtained in the specimen betatized at $800^{\circ}C$ but it was decreased due to the presence of Xs phase with increasing betatizing temperature.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.117-125
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• 1996

The variation of the interfacial and the electrical properties of SiO$_{2}$TiW layers as a function of anneal temperature was extensively investigated. During the deposition of SiO$_{2}$ on TiW chemical bonds such as SiO$_{2}$, TiW, WO$_{3}$, WO$_{2}$ TiO$_{2}$ Ti$_{2}$O$_{5}$ has been created at the SiO$_{2}$/TiW interface. At the anneal temperature of 300$^{\circ}C$, WO$_{3}$ and TiO$_{2}$ bonds started to break due to the reduction phenomena of W and Ti and simultaneously the metallic W and Ti bonds started to create. Above 500$^{\circ}C$, a part of Si-O bonds was broken and consequently Ti/W silicide was formed. Form the current-voltage characteristics of Al/Sico$_{2}$(220$\AA$)/TiW antifuse structure, it was found that the breakdown voltage of antifuse device wzas decreased with increasing annealing temperature for SiO$_{2}$(220$\AA$)/TiW layer. When r, the insulating property of antifuse device of the deterioration of intermetallic SiO$_{2}$ film, caused by the influw of Ti and W.W.

• Journal of the Korean Ceramic Society
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• v.33 no.2
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• pp.155-162
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• 1996

A Taguchi methodology study of the plasma spraying thermal barrier coating (TBC) layer is presented. The experiment parameters were designed by a L8-style orthogonal arrays approach. A Taguchi analysis was conduc-ted through the results of the coating properties which were affected by plasma spraying parameters. Zirconia (partially stbilized with ytrria: PSZ) was sprayed on TiAl intermetallic compound substrates, The coating layer was characterized by thickness microstructure and porosity using SEM and Image analyzer. The coating quali-ties are discussed with respect to thermal barrier effect thermal cycling test6 and adhesion strength test. An optimum condition of plasma spraying process which are derived from the Taguchi analysis could be found for high quality TBC.

• Korean Journal of Materials Research
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• v.10 no.7
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• pp.499-504
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• 2000

Recently there have been many investigations on the synthesis and properties of transition metal trialuminides based on Ti, Zr, V, Nb and Ta for use aircraft structure materials in an elevated environment. The effect of Zr additions on the formation behaviour of Al-Nb alloy was investigated. Al-1.3at.%(Nb+Zr) alloys with different Nb to Zr atomic 1:3, 1:1 and 3:1 were prepared by mechanical alloying(MA). The morphological changes and microstructural evolution of Al-Nb-Zr powders during MA were investigated by SEM, XRD and TEM. The intermetallic compound phase of $Nb_2Al\; and\; Al_3Zr_4$ was identified by X-ray diffraction. The intemetallic compound of $Al_3Zr,\; Al_3Nb$ and $Al_3Zr_4$ were formed by heat treatment for 1 hour at $500^{\circ}C$. The size of intermetallic compounds observed by TEM were approximately below 100nm, when they were heat treated after mechanically alloying for 30 hours.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1223-1231
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• 2002

Al alloy matrix composite with TiNi shape memory fiber as reinforcement has been fabricated by hot pressing to investigate microstructures and mechanical properties. The analysis of SEM and EDS showed that the composites have shown good interface bonding. The stress-strain behavior of the composites was evaluated at temperatures between 363K and room temperature as a function of prestrain, and it showed that the yield stress at 363K was higher than that of the room temperature. Especially, the yield stress of this composite increases with increasing the amount of prestrain, and it also depends on the volume fraction of fiber and heat treatment. The smartness of the composite is given due to the shape memory effect of the TiNi fiber which generates compressive residual stress in the matrix material when heated after being prestrained. Microstructural observation has revealed that interfacial reactions occur between the matrix and fiber, creating two intermetallic layers.