• Journal of Welding and Joining
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• v.16 no.1
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• pp.88-97
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• 1998

The surface characteristics of 13Cr stainless steel systems by plasma nitriding were investigated. The plasma nitriding for the 13Cr steels, in which the nitriding forming elements such as Ti, V, W, Nb, Al, Zr and Si were added about 2~3wt.%, respectively, was performed. In all nitrided specimens, .epsilon.-F $e_{2-3}$N, UPSILON.'-F $e_{4}$N and CrN were detected as the nitrides with the a-Fe in the nitrided layer. VN and .betha.- $W_{2}$N were also detected in 13Cr-3V and 13Cr-3W alloys. The growth of the nitrided layer was controlled by the diffusion process. The thickness of the nitrided layer was similar in the 13Cr-2Nb and 3Zr specimens to that of 13Cr(BM) specimen, while the others exhibited the thinner layer. The activation energy for the growth of the nitrided layer in the temperature range of 773-873K was about 130kJ/mol in 13Cr(BM), 13Cr-2Ti, 3W, 3Al, 3Zr and 3Si alloys. The hardness of the nitrided specimens was significantly increased above Hv1000, comparing to the non-nitrided specimen. The specimens with the nitrided forming elements revealed much higher hardness values and, especially, 13Cr-3Al, 3V and 3Si specimens were significantly hardened up to Hv1300.v1300.0.

• Journal of dental hygiene science
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• v.9 no.2
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• pp.153-160
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• 2009

The purposed of this study was to investigate the effect of Gold bonding agent as intermediate layer between metal substrate and ceramic coating. Gold bonding agent used to seal off any surface porosity, to mask the greyish color of the metal, and to provide an underlying bright golden hue to the ceramic coverage. The adhesion between metal substrate and ceramic is related to diffusion of oxygen during ceramic firing. The oxide layer produced on non-precious alloy anti titanium was considered to have a potentially adverse effect on metal-ceramic bonding. The oxidation characteristics of titanium and non-precious alloys are the main problem. Every group were divided into test and control groups. Control groups are carried out process of degassing for product oxide layer. Au coating was applied on each Ni-Cr, Co-Cr alloys and cp-Ti specimens with difference surface condition or degassing. Specimens surfaces and cutting plane was characterized by SEM/EDS. Results suggested that Au coating is effective barriers to protect metal oxidation during ceramic firing.

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.242-247
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• 2009

On the Transient Liquid Phase Bonding (TLPB) phenomenon with the MBF-50 insert metal at narrow gap (under 100), it takes long time for the bonding and the homogenizing. Typically, isothermal solidification is controlled by the diffusion of depressed element of B and Si. However, the amount of B and Si in the MBF-50 filler metal is large. This is reason of the long bonding time. Also, the MBF-50 filler metal did not contained Al and Ti which are ${\gamma}^{\prime}$ phases former. This is reason of the long homogenizing time. From the bonding phenomenon with the MBF-50 insert metal, we search main factors on the bonding mechanism and select several insert-metals for using the wide-gap TLPB. New insert-metals contained Al and Ti which are ${\gamma}^{\prime}$ phases former and decrease the B then the MBF-50. When the new insert-metal was used on the TLPB, the bonding time was decreased about 1/10 times and homogenizing heat treatment was no needed. In spite of the without homogenizing, the volume fraction of ${\gamma}^{\prime}$ phases in the boned interlayer was equal to homogenizing heat treated specimen which was TLPB with the MBF-50. Finally, the new insert metal named WG1 for the wide-gap TLPB is more efficient then the MBF-50 filler metal without decreasing the bonding characteristic.

• Bulletin of the Korean Chemical Society
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• v.33 no.5
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• pp.1480-1484
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• 2012

We report a series of novel imidazolium iodides based ionic liquids (NMIPHI, NAIPHI, and NBIPHI) with different functional groups for the development of a quasi-solid type electrolyte for dye-sensitized solar cells (DSSCs). The diffusion coefficients of redox ions ($I^-$ and $I_3{^-}$) are dependent on the molecular weight and it was higher for lighter salts. Among the three ionic liquids, NMIPHI showed highest efficiency of 4.18% when it was used in a liquid electrolyte of a DSSC with $ca$. 6 ${\mu}m$ thick $TiO_2$ mesoporous film. Even though the efficiency was $ca$. 19% lower than that obtained from a liquid electrolyte composed of PMII. When NMIPHI was mixed with PMII with a molar ratio of 1:1 in a solvent free electrolyte, the efficiency of the DSSCs was enhanced compared to that based on pristine PMII.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.444-445
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• 2009

The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• Journal of the Korean Ceramic Society
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• v.36 no.2
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• pp.167-171
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• 1999

Titanium dioxide bodies sintered at 130$0^{\circ}C$ for 10 h under the oxygen flowing were reduced with hydrogen in 1200, 1250 and 130$0^{\circ}C$ for 4~20 h. Reduction kinetics were evaluated by measuring a weight loss between before and after reduction, and the thickness of reduced layer, respectively. The reduction followed the parabolic rate law, indicating that the rate-determining process is diffusion. From the Arrhenius plots, the apparent activation energies for the reduction were obtained as 210$\pm$10 kJ/mol.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.212-212
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• 2010

Recently, lithium transition metal phosphates with an ordered olivine-type structure, $LiMPO_4$ (M=Fe, Mn, Ni, and Co), have attracted extensive attention due to a high theoretical specific capacity (170 mAh/g). The $LiMPO_4$ is the most attractive because of its high stability, low cost, high compatibility with environment. However, it is difficult to attain its full capacity because its electronic conductivity is very low, and diffusion of Li-ion in the olivine structure is slow and the supervalue cation doping was used. In this research, we are used the supervalue cation doping methode such as Cu, Ti, and Mg were partially replace the Fe. The cycling performance resulted of the used $LiM_xFe_{1_x}PO_4$ cathode materials for lithium batteries exhibit excellent high capacity than $LiFePO_4$/Li cells.

• Journal of Electrochemical Science and Technology
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• v.7 no.1
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• pp.82-89
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• 2016

In this work, a ruthenium dioxide electrode has been prepared by thermal decomposition at 400 ℃ then used for the oxidation of commercial amoxicillin. The physical characterization showed that RuO₂ electrode presents a mud cracked structure. Its electrochemical characterization has revealed an increase of the voltammetric charge in acid electrolyte compared to neutral electrolyte indicating the importance of protons in its surface redox processes. The voltammetric study of the oxidation of amoxicillin has been investigated. It has been obtained that the oxidation of amoxicillin is controlled by both adsorption and diffusion processes. Moreover, the oxidation of amoxicillin occurs via direct and indirect processes in free or electrolyte containing chlorides. Through preparative electrolysis, enhancement of amoxicillin oxidation was observed in the presence of chloride where the amoxicillin degradation yield reached more than 50 % compared to less than 5% in the absence of chlorides. Spectrophotometric investigations have revealed the degradation of intermediates absorbing at 350 nm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1186-1190
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• 2003

In this paper, a valveless bubble-actuated fluid micropump was has been developed and its performance was tested. The valveless micropump consists of the lower plate, the middle plate, the upper plate and a resistive heater. The lower plate includes the nozzle-diffuser elements and the double-chamber. Nozzle-diffuser elements and a double-chamber are fabricated on the silicon wafer by the DRIE(Deep Reactive Ion Etching) process. The lower plate also has inlet/outlet channels for fluid flow. The middle plate is made of glass and plays the role of the diaphragm. The chamber in the upper plate is filled with deionized water, and which contacts with the resistive heater. The resistive heater is patterned on a silicon substrate by Ti/Pt sputtering. Three plates and the resister heater are laminated by the aligner and bonded in the anodic bonder. Since the bubble is evaporated and condensed periodically in the chamber, the fluid flows from inlet to outlet with respect to the diffusion effect. In order to avoid backflow, the double chamber system is introduced. Analytical and experimental results show the validity of the developed double-chamber micropump.