• Title/Summary/Keyword: Ti substrate

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Properties of TiO2 Thin Films Deposited on PET Substrate for High Energy Density Capacitor (고에너지밀도 캐패시터를 위해 PET 기판에 증착한 TiO2 박막의 특성)

  • Park, Sang-Shik
    • Korean Journal of Materials Research
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    • v.22 no.8
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    • pp.409-415
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    • 2012
  • $TiO_2$ thin films for high energy density capacitors were prepared by r.f. magnetron sputtering at room temperature. Flexible PET (Polyethylene terephtalate) substrate was used to maintain the structure of the commercial film capacitors. The effects of deposition pressure on the crystallization and electrical properties of $TiO_2$ films were investigated. The crystal structure of $TiO_2$ films deposited on PET substrate at room temperature was unrelated to deposition pressure and showed an amorphous structure unlike that of films on Si substrate. The grain size and surface roughness of films decreased with increasing deposition pressure due to the difference of mean free path. X-ray photoelectron spectroscopy (XPS) analysis revealed the formation of chemically stable $TiO_2$ films. The dielectric constant of $TiO_2$ films was significantly changed with deposition pressure. $TiO_2$ films deposited at low pressure showed high dissipation factor due to the surface microstructure. The dielectric constant and dissipation factor of films deposited at 70 mTorr were found to be 100~120 and 0.83 at 1 kHz, respectively. The temperature dependence of the capacitance of $TiO_2$ films showed the properties of class I ceramic capacitors. $TiO_2$ films deposited at 10~30 mTorr showed dielectric breakdown at applied voltage of 7 V. However, the films of 500~300 nm thickness deposited at 50 and 70 mTorr showed a leakage current of ${\sim}10^{-8}{\sim}10^{-9}$ A at 100 V.

A Study on the Phase Transformations of (TiAl)N Films Deposited by TFT Sputtering System (TFT(Two-Facing-Targets) 스퍼터장치에 의해 증착된 (TiAl)N 박막의 상변태에 관한 연구)

  • Han, Chang-Suk
    • Journal of the Korean Society for Heat Treatment
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    • v.18 no.5
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    • pp.281-287
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    • 2005
  • Titanium aluminium nitride((TiAl)N) film is anticipated as an advanced coating film with wear resistance used for drills, bites etc. and with corrosion resistance at a high temperature. In this study, (TiAl)N thin films were deposited both at room temperature and at elevated substrate temperatures of 573 to 773 K by using a two-facing-targets type DC sputtering system in a mixture Ar and $N_2$ gases. Atomic compositions of the binary Ti-Al alloy target is Al-rich (25Ti-75Al (atm%)). Process parameters such as precursor volume %, substrate temperature and Ar/$N_2$ gas ratio were optimized. The crystallization processes and phase transformations of (TiAl)N thin films were investigated by X-ray diffraction, field-emission scanning electron microscopy. The microhardness of (TiAl)N thin films were measured by a dynamic hardness tester. The films obtained with Ar/$N_2$ gas ratio of 1:3 and at 673 K substrate temperature showed the highest microhardness of $H_v$ 810. The crystallized and phase transformations of (TiAl)N thin films were $Ti_2AlN+AlN{\rightarrow}TiN+AlN$ for Ar/$N_2$ gas ratio of 1:3, $Ti_2AlN+AlN{\rightarrow}TiN+AlN{\rightarrow}Ti_2AlN+TiN+AlN$ for Ar/$N_2$ gas ratio of 1:1 and $TiN+AlN{\rightarrow}Ti_2AlN+TiN+AlN{\rightarrow}Ti_2AlN+AlN{\rightarrow}Ti_2AlN+TiN+AlN$ for Ar/$N_2$ gas ratio of 3:1. The above results are discussed in terms of crystallized phases and microhardness.

Enhancenent of Wear Resistance of TiN Coated High Speed Steel Tools through Improving some Coating Processes (코팅공정 개선에 의한 TiN코팅 고속도강 공구의 내마모특성 향상)

  • Lee, Y.M.;Son, Y.H.;Kim, H.S.;Back, J.Y.
    • Journal of the Korean Society for Precision Engineering
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    • v.13 no.11
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    • pp.32-37
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    • 1996
  • Using the are ion plating(AIP) process, TiN coating was deposited onto high speed steel substrates. The effects of coating thickness, titanisum interlayer and shield on wear resisting capability of the coated tools were investigated. In order to promote good adhesion between the substrate and the TiN coating a thin Ti interlayer was deposited. A shield was set up also between Ti target and high speed steel substrates to prevent molten droplets from reaching the substrate. Three series of varying thickness of TiN coated layer were prepared with or without the Ti interlayer, and with or without the shield. The tools with the Ti layer and the shield showed longer tool lifes than those of other series of tools and the commercially available TiN coated HSS tools, by up to 70%.

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High-temperature Oxidation of Nano-multilayered TiAlSiN Filems (나노 다층 TiAlSiN 박막의 고온 산화)

  • Lee, Dong-Bok;Kim, Min-Jeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.189-189
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    • 2016
  • In this study, the Al-rich AlTiSiN thin films that consisted of TiN/AlSiN nano-multilayers were deposited on the steel substrate by magnetron sputtering, and their high-temperature oxidation behavior was investigated, which has not yet been adequately studied to date. Since the oxidation behavior of the films depends sensitively on the deposition method and deposition parameters which affect their crystallinity, composition, stoichiometry, thickness, surface roughness, grain size and orientation, the oxidation studies under various conditions are imperative. AlTiSiN nano-multilayer thin films were deposited on a tool steel substrate, and their oxidation behavior of was investigated between 600 and $1000^{\circ}C$ in air. Since the amount of Al which had a high affinity for oxygen was the largest in the film, an ${\alpha}-Al_2O_3-rich$ scale formed, which provided good oxidation resistance. The outer surface scale consisted of ${\alpha}-Al_2O_3$ incoporated with a small amount of Ti, Si, and Fe. Below this outer surface scale, a thin ($Al_2O_3$, $TiO_2$, $SiO_2$)-intermixed scale formed by the inwardly diffusing oxygen. The film oxidized slower than the $TiO_2-forming$ kinetics and TiN films, but faster than ${\alpha}-Al_2O_3-forming$ kinetics. During oxidation, oxygen from the atmosphere diffused inwardly toward the reaction front, whereas nitrogen and the substrate element of iron diffused outwardly to a certain extent.

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Preparation of Ferroelectric $BaTiO_3$ Thin Films on MgO-Buffered Si Substrates (MgO 완충층을 이용한 Si 기판상 강유전체 $BaTiO_3$ 박막의 제조)

  • 김상섭
    • Journal of the Korean Ceramic Society
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    • v.34 no.4
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    • pp.373-379
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    • 1997
  • A study on the deposition and characterization of BaTiO3 thin films on MgO-buffered Si(100) substrates by sputtering was conducted. The MgO buffer layers were investigated as a function of deposition temperature. At lower substrate temperature, the MgO layers were not fully crystalline, but a crystallized MgO layer with (001) preferred orientation was obtained at the substrate temperature of $700^{\circ}C$. Partially (00ι) or (h00) textured BaTiO3 films were obtained on Si(100) with the MgO buffer layer grown at 700ι. While, randomly oriented BaTiO3 films with large-scale cracks on the surface were made without the MgO layer. The crystallographic orientation, morphology and electrical properties between the BaTiO3 films on Si with and without the MgO layer were compared using the BaTiO3 film on MgO(100) single crystal substrate as a reference system. Also the favorable role of the MgO layer as a buffer for growing of oriented BaTiO3 films on Si substrates was confirmed.

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Microsstructure of Sputter-Deposited and Annealed Cu-Cr, Cu-Ti Alloy Films on Polyimide Substrate and Their Adhesion Property (폴리이미드에 스퍼터 증착한 Cu-Cr, Cu-Ti 합금박막의 열처리 전후의 접착력과 미세구조)

  • 서환석;김기범
    • Journal of the Korean institute of surface engineering
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    • v.27 no.5
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    • pp.261-272
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    • 1994
  • Both Cu-Cr and Cu-Ti alloy films with different composition were prepared by dc magnetron sputtering onto polyimide substrate and their adhesion and microstructure were observed. In addition, the effect of heat treatment at $400^{\circ}C$ for 2 hours on the variation of adhesion properties and on the changess of microstructure were investigated. Cu-Cr alloy films have crystalline structure of either for or bcc phase depending on the composition of the film. However, the Cu-Ti alloy film forms fcc phase at low Ti concentration while it forms an amorphous phase as the Ti concentration in the films is increased to more than 25at.%. TEM analysis reveal that the microstructure of Cu-Cr and Cu-Ti films forms an open structure with vacant spaces. The adhesion between Cu-Cr, Cu-Ti alloy films and polyimide substrate is relatively good before the heat treatment, but is noticeably reduced after the heat treatment. In particular, the adhesion strength is significantly reduced in the Cu-Ti alloy films after the heat treatment. The reduction of adhesion strength after the heat treatment is identified to relate with the formation of oxide phases at the metal/polyimide interface by AES(Auger Electron Spectroscopy).

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A study on the chemically vapor deposited TiC, TiN, and Ti(C, N) on $Si_3N_4$-TiC ceramic tools ($Si_3N_4$-TiC ceamic 공구에 화학증착된 TiC, TiN 및 Ti(C, N)에 관한 연구)

  • 김동원;김시범;이준근;천성순
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 1988.06a
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    • pp.39-42
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    • 1988
  • 요업체 절삭공구(ceramic tool)는 공구강이나 초경제품에 비해 고속 절삭 작업이 가능하며 생산성을 높일 수 있기 때문에 최근 주목을 받고 있다. 본 실험에서 모재(substrate)로 사용된 $Si_3N_4$-TiC ceramic은 요업체 공구중에서 파괴인성이 우수하며, 주철이나 초합금을 절삭할 때 우수한 성능을 나타낸다. 그러나 요업체 절삭공구중에서 경도가 낮은 편에 속하며, Fe,Mn,O와 $Si_3N_4$가 화학적 반응을 일으켜서, steel을 절삭할 때 상면 마모(crater wear)가 심하게 발생하기 때문에 우수한 성능을 나타내지 못하고 있는 실정이다. 따라서 이러한 단점을 보완하기 위해 공구의 표면에 보호피막(protective coating)을 입히는 것은 필수적이다. 본 연구에서는 반응변수들이 TiC 및 TiN 증착층의 증착속도, 미세구조, 화학적 조성 및 증착층과 substrate 사이의 interface를 조사하여 각 증착층의 최적증착조건을 규명하고자 한다.

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Electrical properties of $SrTiO_3$ thin films deposited at low temperatures by RF magnetron sputtering (RF 마그네트론 스퍼터링에 의해 저온 증착한 $SrTiO_3$ 박막의 전기적 특성)

  • 김동식;이재신
    • Journal of the Korean Vacuum Society
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    • v.5 no.4
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    • pp.359-364
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    • 1996
  • $SrTiO_3$ thin films were deposited on Pt/Ti/$SiO_2$/Si substrates at low temperatures below $300^{\circ}C$ by r.f. magnetron sputtering. The materials and the electrical properties of the deposited films were investigated with controlling deposition parameters such as substrate temperature(T_s) and positive substrate d.c. bias voltage. Stoichiometric $SrTiO_3$ films were obtained at Ts of $300^{\circ}C$, but Sr content in the film was less than that of a target when Ts was lower than $300^{\circ}C$, resulting in poor electrical properties. By introducing a positive substrate d.c. bias during deposition, the crystallinity and the dielectric properties of the films were markedly improved. 400 nm thick $SrTiO_3$, films deposited at $300^{\circ}C$ with a positive substrate d.c. bias of 20V showed a columnar structure with <211> crystallographic direction and a dielectric constant of 98.

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Structure of epitaxial MgO layers on TiC(001) studied by time-of-flight impact-collision ion scattering spectroscopy (비행시간형 직충돌 이온산란 분광법을 사용한 TiC(001)면에 성장된 MgO막의 구조해석)

  • Hwang, Yeon;Souda, Ryutaro
    • Journal of the Korean Vacuum Society
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    • v.6 no.3
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    • pp.181-186
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    • 1997
  • Time-of-flight impact-collision ion scattering spectroscopy (TOF-ICISS) was applied to study the geometrical structure of epitaxially grown MgO layers on a TiC(001). The hetero-epitaxial MgO layer was able to be deposited by thermal evaporation of magnesium onto the TiC(001) surface and subsequent exposure of oxygen at room temperature. A slight heating of the substrate at around $300^{\circ}C$ was necessary to overcome a thermal barrier for the ordering. The well-ordered MgO structure was confirmed with the 1$\times$1 LEED pattern. TOF-ICISS was useful in studying interface structure between oxide and substrate. The results revealed that the MgO layer is formed at the on-top sites of the TiC(001) substrate and the lateral lattice constant of MgO layer is the same as that of the TiC substrate. The MgO was deposited within two layers on the most parts of the surface.

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