1 |
K. N. Pandiyaraj, V. Selvarajan, M. Pavese, P. Falaras and D. Tsoukleris, Curr. Appl. Phys., 9, 1032 (2009).
DOI
ScienceOn
|
2 |
K. O. Awitor, A. Rivaton, J. L. Gardette, A. J. Down and M. B. Johnson, Thin Solid Films, 516, 2286 (2008).
DOI
ScienceOn
|
3 |
L. T. Lamont and A. Lang, J. Vac. Sci. Tech., 7, 198 (1970).
DOI
|
4 |
Y. Zhao, Y. Qian, W. Yu and Z. Chen, Thin Solid Films, 286, 45 (1996).
DOI
ScienceOn
|
5 |
J. Guillot, F. Fabreguette, L. Imhoff, O. Heintz, M. C. Marco de Lucas, M. Sacilotti, B. Domenichini and S. Bourgeois, Appl. Surf. Sci., 177, 268 (2001).
DOI
ScienceOn
|
6 |
J. Jun, J. H. Shin and M. Dhayal, Appl. Surf. Sci., 252, 3871 (2006).
DOI
ScienceOn
|
7 |
P. M. Kumar, S. Badrinarayanan and M. Sastry, Thin Solid Films, 358, 122 (2000).
DOI
ScienceOn
|
8 |
V. M. Ferreira, J. L. Baptista, S. Kamba and J. Petzelt, J. Mater. Sci., 28, 5894 (1993).
DOI
|
9 |
M. Takeuchi, T. Itoh and H. Nagasaka, Thin Solid Films, 51, 83 (1978).
DOI
ScienceOn
|
10 |
M. D. Stamate, Appl. Surf. Sci., 218, 318 (2003).
DOI
ScienceOn
|
11 |
R. C. Pullar, S. J. Penn, X. Wang, I. M. Reaney and N. McN. Alford, J. Eur. Ceram. Soc., 29, 419 (2009).
DOI
ScienceOn
|
12 |
A. Nishino, J. Power Sourc., 60, 137 (1996).
DOI
ScienceOn
|
13 |
M. Jayalakshmi and K. Balasubramanian, Int. J. Electrochem. Sci., 3, 1196 (2008).
|
14 |
R. Vazquez-Reina, S. Chao, V. Petrovsky, F. Dogan and S. Greenbaum, J. Power Sourc., 210, 21 (2012).
DOI
ScienceOn
|
15 |
K. R. Bray, R. L. C. Wu, S. Fries-Carr and J. Weimer, Thin Solid Films, 518, 366 (2009).
DOI
ScienceOn
|
16 |
S. Chao and F. Dogan, Int. J. Appl. Ceram. Tech., 8(6), 1363 (2011).
DOI
ScienceOn
|
17 |
C. R. Martins, Y. M. de Almeida, G. C. do Nascimento and W. M. de Azevedo, J. Mater. Sci., 41, 7413 (2006).
DOI
ScienceOn
|