• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.10
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• pp.1561-1564
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• 2012

In this work, we have fabricated the nanocrystalline carbon films by using unbalanced magnetron sputtering method with graphite and Ti targets for contact strip application of electrical railway. The power density of graphite target was fixed and the power density was increased for the increase of Ti concentration in TiC films. We investigated the hardness, surface roughness, contact angle, resistivity, HRTEM and XPS of TiC films with Ti concentration. The hardness and resistivity were improved with increasing Ti concentration. These results indicate that the improvement of hardness and resistivity is related to the increase of sp2 clusters in TiC films.

• Journal of Korea Foundry Society
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• v.29 no.5
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• pp.187-191
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• 2009

Microstructures and shape memory characteristics of $Ti_{50}Ni_{20}Cu_{30}$ alloy strips fabricated by arc melt overflow have been investigated by means of XRD, optical microscopy and DSC. The microstructure of as-cast strips exhibited columnar grains normal to the strip surface. X-ray diffraction analysis showed that one-step martensitic transformation of B2-B19 occurred in the alloy strips. According to the DSC analysis, it was known that the martensitic transformation temperature ($M_s$) of B2 $\rightarrow$ B19 in $Ti_{50}Ni_{20}Cu_{30}$ strip is $57^{\circ}C$. During thermal cyclic deformation with the applied stress of 60 MPa, transformation hysteresis and elongation associated with the B2-B19 transformation were observed to be $3.7^{\circ}C$ and 1.6%, respectively. The as-cast strip of $Ti_{50}Ni_{20}Cu_{30}$ alloy also showed a superelasticity and its stress hysteresis was as small as 14 MPa. These mechanical properties and shape memory characteristics of the alloy strips were ascribed to B2-B19 transformation and the controlled microstructures produced by rapid solidification of the arc melt overflow process.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.3
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• pp.343-351
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• 1988

Planar optical waveguides are fabricated on a Y-cut LiNbO3 single crystal substrate by Ti indiffusion method. From data measured by the bright M-line spectroscopy, refractive index profiles are reconstructed by WKB approximation method. Then, single strip, X-crossing strip, and Y-brinch strip optical waveguides are fabricated on X-cut LiNbO3 single crystal substrate, with waveguide patterns made by the laser beam direct writing method. And their near-field intensity profiles are observed after coupling the light to the waveguide edges.

• Proceedings of the Optical Society of Korea Conference
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• 2003.02a
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• pp.168-169
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• 2003

Ti：LiNbO$_3$ 광도파로는 확산형 도파로이기 때문에 그 도파특성이 확산공정 조건에 크게 의존할 뿐만 아니라 굴절률 분포를 모델링하기가 어렵다. 이러한 이유로 설계된 Ti：LiNbO$_3$ 광도파로의 특성은 실제 제작된 소자와 큰 차이를 보이는 경우가 많은데, 이를 개선하기 위해서는 각 공정파라미터에 따른 도파 특성의 변화를 파악하는 작업이 우선적으로 수행되어야 한다. 본 논문에서는 서로 다른 너비를 갖는 Ti strip을 동일한 확산조건에서 확산시킨 후 제작된 광도파로의 도파손실 및 모드패턴을 측정하였다. (중략)

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.61-61
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• 2000

Device의 고성능화를 위하여 소자의 고속화, 고집적화가 가속됨에 따라 SALICIDE Process가 더욱 절실하게 요구되고 있다. 이러한 SALICIDE Process의 재료로써는 metal/silicide 중에서 비저항이 가장 낮은 TiSi2(15-25$\mu$$\Omega$cm), CoSi2(17-25$\mu$$\Omega$cm)가 일반적으로 많이 연구되어 왔다. 그러나 Ti-silicide의 경우 Co-silicide는 배선 선폭의 감소에 따른 면저항 값의 변화가 작으며, 고온에서 안정하고, 도펀트 물질과 열역학적으로 안정하여 화합물을 형성하지 않는다는 장점이 있으마 Ti처럼 자연산화막을 제거할 수 없어 Si 기판위에 자연산화막이 존재시 균일한 실리사이드 박막을 형성할 수 없는 단점등을 가지고 있다. 본 연구에서는 Ti Capping layer 에 의한 균일한 Co-silicide의 형성을 일반적인 Si(100)기판과 SCl 방법에 의하여 chemical Oxide를 성장시킨 Si(100)기판의 경우에 대하여 연구하였다. 스퍼터링 방법에 의해 Co를 150 증착후 capping layer로써 TiN, Ti를 각각 100 씩 증착하였다. 열처리는 RTP를 이용하여 50$0^{\circ}C$~78$0^{\circ}C$까지 4$0^{\circ}C$ 구간으로 N2 분위기에서 30초 동안 열처리를 한후, selective metal strip XRD, TEM의 분석장비를 이용하여 관찰하였다. lst RTP후 selective metal strip 후 면저항의 측정과 XRD 분석결과 낮은 면저항을 갖는 CoSi2로의 상전이는 TiN capping과 Co 단일박막이 일반적인 Si(100)기판과 interfacial oxide가 존재하는 Si(100)기판위에서 Ti capping의 경우보다 낮은 온도에서 일어났다. 또한 CoSi에서 CoSi2으로 상전이는 일반적인 Si(100)기판위에서 보다 interfacial Oxide가 존재하는 Si(100)기판 위에 TiN capping과 Co 단일박막의 경우 열처리 후에도 Oxide가 존재하는 불균인한 CoSi2박막을 관찰하였으며, Ti capping의 경우 Oxise가 존재하지 않는 표면과 계면이 더 균일한 CoSi2 박막을 형성 할 수 있었다.

• Journal of Powder Materials
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• v.16 no.1
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• pp.33-36
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• 2009

In order to increase the magnetic loss for electromagnetic(EM) wave absorption, the soft magnetic $Fe_{73}Si_{16}B_7Nb_3Cu_1$(at%) alloy strip was used as the basic material in this study. The melt-spun strip was pulverized using an attrition mill, and the pulverized flake-shaped powder was crystallized at $540^{\circ}C$ for 1h to obtain the optimum grain size. The Fe-based powder was mixed with 2 wt% $BaTiO_3$, $0.3{\sim}0.6$ wt% carbon black, and polymer-based binders for the improvement of electromagnetic wave absorption properties. The mixture powders were tape-cast and dried to form the absorption sheets. After drying at $100^{\circ}C$ for 1h, the sheets of 0.5 mm in thickness were made by rolling at $60^{\circ}C$, and cut into toroidal shape to measure the absorption properties of samples. The characteristics including permittivity, permeability and power loss were measured using a Network Analyzer(N5230A). Consequently, the properties of electromagnetic wave absorber were improved with the addition of both $BaTiO_3$ and carbon black powder, which was caused by the increased dielectric loss of the additive powders.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.2
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• pp.284-287
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• 2013

In this work, we have fabricated TiC films by using unbalanced magnetron sputtering method with graphite and Ti targets for contact strip application of electric railway. TiC films were deposited with various substrate temperatures. We investigated various properties of TiC films prepared with various substrate temperatures, such as the hardness, surface roughness, friction coefficient, resistivity, FESEM (Field Emission Scanning Electron Microscopy), HRTEM (High Resolution Transmission Electron Microscopy) and XPS (X-ray Photoelectron Spectroscopy). The hardness and friction coefficient properties of TiC films were improved with increasing substrate temperature. These results indicate that the improvement of hardness and resistivity is related to the increase of sp2 clusters in TiC films. And also, the resistivity value of TiC films were decreased with increasing substrate temperature.

• Korean Journal of Metals and Materials
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• v.48 no.5
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• pp.387-393
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• 2010

High-strength aluminum alloy sheets with high magnesium contents were fabricated by a strip caster equipped with an asymmetric nozzle, which has been proven to be effective for reducing surface defects and internal segregation. 4 mm thick as-cast sheets consisting of fine dendrites and minor $Al_{8}Mg_{5}$ segregation were hot-rolled successfully to 1 mm sheets and subsequently annealed at various temperatures. The sheet revealed the tensile strength and elongation of 306 MPa and 34%, respectively, when it was rolled at 250${^{\circ}C}$ and subsequently annealed at 475${^{\circ}C}$, which exhibits the feasibility of the practical application for autobodies. The observed mechanical properties were explained on the basis of the microstructural characteristics of the alloy sheets.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.08a
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• pp.262-271
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• 1999

This work was intended to modify the solidification structure of high speed steel roll material for hot strip mill, by the introduction of alloying elements designed to form primary carbide dispersions via melt treatment procedure. Solidification structure was modified by the melt treatment with titanium and distribution. This modifying effect could be attributed to the fact that the nuclie formed at high temperature upon inoculation induce the formation of fine equiaxed grain and primary carbide during solification, which is also likely to be responsible for the fact that TiC acts as effective nuclie for primary VC solidification.

• 전자공학회논문지 IE
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• v.48 no.2
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• pp.1-5
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• 2011

The epitaxial GaN layer of $120{\mu}m$ ~ $300{\mu}m$ thickness with a stripe Ti mask pattern is performed by hydride vapor phase epitaxy(HVPE). Ti strpie mask pattern is deposited by DC magnetron sputter on GaN epitaxial layer of $3{\mu}m$ thickness is grown by hydride vapor phase epitaxy(HVPE). Void are observed at point of Ti mask pattern when GaN layer is investigated by scanning electron microscope. The Crack of GaN layer is observed according to void when it is grown more thick GaN layer. The full width at half maximum of peak which is measured by X-ray diffraction is about 188 arcsec. It is not affected its crystallization by Ti meterial when GaN layer is overgrown on Ti stripe mask pattern according as it is measure FWHM of overgrowth GaN using Ti material against FWHM of first growth GaN epitaxial layer.