• 한국재료학회지
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• 제9권4호
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• pp.419-427
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• 1999

TiNi shape memory alloy was shape memory heat-treated and investigated its mechanical properties with the variation of prestrain. Also 6061 Al matrix composites with TiNi shape memory alloy fiber as reinforcement have been fabricated by Permanent Mold Casting to investigate the microstructures and interface properties. Yield stress of TiNi wire was the most high in the case of before heat-treatment and then decreased as increasing heat-treatment time. In each heat-treatment condition, the yield stress of TiNi wire was not changed with increasing the amount of prestrain. The interface bonding of TiNi/6061Al composite was fine. There was a 2$\mu\textrm{m}$ thickness of diffusion reaction layer at the interface. We could find out that this diffusion reaction layer was made by the mutual diffusion. The diffusion rate from Al base to TiNi wire was faster than that of reverse diffusion and the amount of the diffusion was also a little more than that of reverse.

• 소성∙가공
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• 제20권2호
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• pp.140-145
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• 2011

The aim of the present study is to derive optimized post heat treatment temperatures to get a proper formability for Ti/STS409L/Ti clad materials. These clad materials were fabricated by cold rolling followed by a post heat treatment process for 10 minutes at temperatures ranging from $500^{\circ}C$ to $850^{\circ}C$. The microstructure of the interface was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersive X-ray Analyser(EDX) in order to investigate the effects of post heat treatment on the bonding properties of the Ti/STS409L/Ti clad materials. Diffusion bonding was observed at the interfaces with a diffusion layer thickness increasing with the post heat treatment temperature. The diffusion layer was composed of a type of(${\varepsilon}+{\zeta}$) intermetallic compound containing additional elements, namely, Fe, Ti and Ni. The micro Knoop hardness of the Ti/STS409L interfaces was found to increase with heat treatment up to $800^{\circ}C$ and then decrease for temperatures rising up to $850^{\circ}C$. The tensile strength was shown to decrease for heat treatment temperature increasing to $750^{\circ}C$ and then increase rapidly for temperature rising up to $850^{\circ}C$. A post heat treatment temperature range of $700{\sim}750^{\circ}C$ was found to optimize the formability of Ti/STS409L/Ti clad materials.

• 대한금속재료학회지
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• 제50권4호
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• pp.316-323
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• 2012

The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having $({\epsilon}+{\zeta})+({\zeta}+{\beta}-Ti)$ intermetallic compounds at $700^{\circ}C$ and an $({\zeta}+{\beta}-Ti)$ intermetallic compound at $800^{\circ}C$, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of $500{\sim}600^{\circ}C$ and showed a uniform value until $800^{\circ}C$ and then increased rapidly up to $900^{\circ}C$. The micro Knoop hardness value of the diffusion layer increased up to $700^{\circ}C$ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to $800^{\circ}C$ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were $500{\sim}600^{\circ}C$ to obtain the proper formability for an additional plastic deformation process.

• 전자공학회논문지A
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• 제30A권7호
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• pp.47-59
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• 1993

16M DRAM 용 Al/Si contact 의 열적안정성을 개선하기 위하여 "stuffed" TiN/Ti diffusion barrier를 사용하였다. Diffusion barrier 로서의 특성을 개선하기 위한 Al 증착전 TiN/Ti barrier metal의 열처리 과정중 barrier metal의 두께, 열처리온도, 분위기 등을 변화시켰다. 질소분위기하에서 450도에서 TiN(900A)/Ti(300A) 박막을 열처리 하여 "stuffed" barrier metal을 형성 시켰을 경우 Al 원자의 TiN층으로의 확산의 600도에서 후속열처리한 경우 일어났으나, 700도까지도 Al-spike를 관찰할 수 없었다. 그러나 "stuffed" barrier metal을 550도에서 형성한 경우에는 600도의 후속열처리온도에서 Al이 Si 기판으로 침투했음을 관찰하였다. 박막의 두께를 얇게한 경우, 600도의 후속 열처리에서 Al-spike가 형성되었음을 확인하였다.

• 한국전기전자재료학회논문지
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• 제17권2호
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• pp.150-155
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• 2004

This study attempts to form a TiN barrier layer against Cu diffusion by the easier and more convenient method. In this new approach, Ti was sputter-deposited, and nitrided by heat-treating in the NH$_3$ambient. Sheet resistance of as-deposited Ti was 20 Ω/$\square$, but increased to 195 Ω/$\square$ after the heat-treatment at 30$0^{\circ}C$, and lowered to 120 Ω/$\square$ after the heat-treatment at 50$0^{\circ}C$, and $600^{\circ}C$. AES results for these thin films confirmed that the atomic ratio of Ti and N was close to 1:1 at or above 40$0^{\circ}C$ heat-treatment. However, it was also found that excessive oxygen was contained in the TiN layer. To examine the barrier property against Cu diffusion, 100nm Cu was deposited on the TiN layer and then annealed at 40$0^{\circ}C$ for 40 min.. Cu remained at the surface without diffusing into the Si layer.

• 한국재료학회지
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• 제12권12호
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• pp.955-961
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• 2002

2.7vol%TiNi/6061 Al composites with TiNi shape memory alloy as reinforcement were fabricated by vacuum hot press. It was investigated by OM, SEM, EPMA and XRD analysis for the behavior of diffusion layer formation on various heat treatment condition. Thickness of diffusion layer was increased proportionally according to heat treatment time. The layer was formed by the mutual diffusion of TiNi and Al. The diffusion rate from TiNi fiber to Al matrix was faster than that of reverse diffusion path. The more diffused layer was formed in Al matrix. The diffusion at interface layer was consisted of $A1_3$Ti, $Al_3$Ni analyzed by EPMA, XRD results.

• 동력기계공학회지
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• 제20권5호
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• pp.5-13
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• 2016

This study is on wear damage of the material for a molding machine that be used at finally cutting of metal beam made in roll forming process of vehicle bump beam process line. SKD11 steel was used with the material for cutting mold jig. In the cutting mold jig, Ti diffusion heat treatment after vacuum heat treatment was carried out for upgrade of surface hardness and anti-wear. Also, the heat treatments by various methods were performed to compare the wear damage degree against above the existing heat treatment. Wear loss and friction coefficient were obtained from wear test. And, micro Vickers hardness values were compared with damaged parts or not of cutting mold jig. Micro Vickers hardness value appeared higher at the undamaged part by Ti diffusion heat treatment. The micro Vickers hardness well followed a two-parameter Weibull probability distribution.

• 열처리공학회지
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• 제31권2호
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• pp.49-55
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• 2018

A T-shape structure was manufactured by the superplastic forming and diffusion bonding process using two Ti-3Al-2.5V alloy tubes. A Ti-3Al-2.5V tube was prepared for the hydroforming in the superplastic condition until it reaches a surface area such as a roof welded in the hole of another Ti-3Al-2.5V tube. Afterward, the superplastic forming process and the diffusion bonding process were carried out simultaneously until the appropriate bonding along the interface area of two Ti-3Al-2.5V tubes was obtained. The bonding qualities were different at each location of the entire interface according to the applied process conditions such as strain, pressure, temperature, holding time, geometries, etc. The microstructures of bonding interface have been observed to understand the characteristics of the applied processes in this study.

• 열처리공학회지
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• 제29권2호
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• pp.56-61
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• 2016

Heating experiments using the Ti-3Al-2.5V tube materials in a vacuum furnace have been performed to investigate a pertinent range of working temperatures and holding times for the development of the successive or simultaneous operation of superplastic hydroforming and diffusion bonding. The specimens were heated at $820^{\circ}C$, $870^{\circ}C$ and $920^{\circ}C$ respectively. Holding times at each temperature were varied up to 4 hours. Holding times longer than 1 hour were selected to consider the diffusion bonding process after or during the hydroforming process in the superplastic state. Grain sizes were varied from $5.7{\mu}m$ of the as-received tube to $9.2{\mu}m$ after heating at $870^{\circ}C/4hours$. Homogeneus granular microstructures could be maintained up to $870^{\circ}C$, while microstructures at $920^{\circ}C$ showed no more granular type.

• 한국세라믹학회지
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• 제36권11호
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• pp.1266-1273
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• 1999