• Title/Summary/Keyword: Thin disk

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Holographic disk memories based on localized hologram recording (국소 홀로그램 기록방식에 기초한 홀로그래픽 디스크 메모리)

  • 오용석;김복수;장주석;강영수
    • Korean Journal of Optics and Photonics
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    • v.14 no.6
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    • pp.663-668
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    • 2003
  • We studied a localized hologram recording method that can be used in a disk-shaped medium. In this method, the reference beam is focused by use of a cylindrical lens to get a thin spot in the medium, and then a hologram is recorded in that spot by illuminating the signal beam. Many localized holograms are multiplexed by shifting the medium by a distance more than the thin spot size of the reference beam. This method does not need recording-time scheduling for uniform diffraction efficiencies. We show that a minimal required thickness of the recording medium exists for a given spot size of the signal beam. We performed experiments for data storage and retrieval, and obtained a storage density of 20 bits/${\mu}{\textrm}{m}$$^2$ and a raw-bit error rate (RBER) of 2.5${\times}$10$^{-3}$ , when a 2 mm-thick Fe-doped LiNbO$_3$ crystal was used.

열처리 조건에 따른 Rubrene 박막의 결정 특성 변화 연구

  • Yun, Yeong-Un;Kim, Song-Hui;Lee, Han-Ju;Kim, Tae-Dong;Lee, Gi-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.124-124
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    • 2009
  • We observed the changes of crystal structure of Rubrene (5,6,11,12-tetraphenylnaphthacene) polycrystal thin films at various in situ substrate temperature and process by scanning electron microscope(SEM), x-ray diffraction (XRD) and near-field microwave microprobe (NFMM). Amorphous rubrene thin film was initially obtained on 200 nm thick $SiO_2/Si$ substrate at 35 $^{\circ}C$ in a vacuum evaporation but in situ long time postannealing at the temperature 80 $^{\circ}C$ transformed the amorphous phase into crystalline. Four heating conditions are followed : (a) preheating (b) annealing (c) preheating, annealing (d) preheating, cooling(35 $^{\circ}C$), annealing. We have obtained the largest polycrystal disk in sample (c). But the highest crytallity and conductivity of the rubrene thin films were obtained in sample (d).

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A Study on Friction and Wear of Manganese Phosphate Thin Film (인산망간 피막의 마찰 마모 특성에 관한 연구 ,)

  • 박영도;유상희
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.1384-1389
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    • 2004
  • In these days, wear resistance is an essential condition because the relative movement between machine parts is being accelerated and those connected with the drive parts transmit power and force. Also wear resistance is closely related to reliability and life of products, therefore the study on friction and wear is very important in many fields. In this paper, wear test was conducted to know properties about friction and wear of manganese phosphate being used widely. Test type is 1 ball on disk and we compared manganese phosphate thin film with non-coated material. Through this study, we could know the effect of this surface treatment method, and then it is assumed that the reliability of parts will be secure.

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Numerical Analysis of Ultra-Thin Gas Film Lubrication (초박막 기체윤활의 수치해석)

  • Chung C. H.
    • Journal of computational fluids engineering
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    • v.9 no.4
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    • pp.64-70
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    • 2004
  • A kinetic theory analysis is used to study the ultra-thin gas flow field in a gas slider bearing. The Boltzmann equation simplified by a collision model is solved by means of a finite difference approximation with the discrete ordinate method. Calculations are made for a flow in a micro-channel between an inclined slider and a moving disk drive platter The results are compared well with those from the DSMC method. The present method does not suffer from statistical noise which is common in particle-based methods and requires much less computational effort.

Numerical Analysis of Ultra-Thin Gas Film Lubrication (초박막 기체윤활의 수치해석)

  • Chung C. H.
    • 한국전산유체공학회:학술대회논문집
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    • 2004.10a
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    • pp.207-213
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    • 2004
  • A kinetic theory analysis is used to study the ultra-thin gas flow field in a gas slider bering, The Boltzmann equation simplified by a collision model is solved by means of a finite difference approximation with the discrete ordinate method. Calculations are made for a flow in a micro-channel between an inclined slider and a moving disk drive platter. The results are compared well with those from the DSMC method. The present method does not suffer from statistical noise which is common in particle based methods and requires much less computational effort.

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Shape Design Sensitivity Analysis For The Radiated Noise From Thin body (박판구조물의 방사소음에 대한 형상 설계민감도 해석)

  • 이제원;왕세명
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2001.05a
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    • pp.90-95
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    • 2001
  • A continuum-based shape design sensitivity analysis (DSA) method is presented for the acoustic radiation from thin body. The normal derivative integral formulation is employed as an analysis formulation and differentiated directly by using material derivative to get the acoustic shape design sensitivity. In the acoustic sensitivity formulation, derivative coefficients of the structural normal velocities on the surface are required as the input. Thus, the shape design sensitivities of structural velocities on the surface with respect to the shape change are also calculated with continuum approach. A simple disk is considered as a numerical example to validate the accuracy and efficiency of the analytical shape design sensitivity equations derived in this research. This research should be very helpful to design an application involving thin body and to change its acoustic characteristics.

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Laser Line Welder for Continuous Operation of Cold-rolled Steel Coil (초극박재 냉연코일의 연속조업을 위한 Laser Line Welder)

  • Choi, Jun
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.1
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    • pp.31-37
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    • 2015
  • A laser line welder using a solid-state laser (Yb:YAG) has been manufactured for joining ultra-thin cold-rolled steel coils in steelworks. The coils to be welded primarily range from 0.15 to 0.3 mm in thickness and 800 to 1,100 mm in width. Because the steel plate is extremely thin, it is very important to control the stop positions of the clamp at cutting and welding points. In this study, both hydraulic proportional control valves and LVDT sensor embedded cylinders were used to precisely control and monitor the positions of clamps with complementary stoppers. As a result, the positions could be controlled within an error of ${\pm}30{\mu}m$. Erichsen cupping tests on the welded joints show that the Erichsen index ranges from 4.4 to 4.6 mm. Furthermore, the tensile strength of welding points is comparable to that of the base metal.

Fabrication and Characteristic Analysis of Piezoelectric Micro-Transformer (초소형 마이크로 압전변압기 제작 및 특성 분석)

  • Kim Seong-Kon;Seo Young-Ho;Choi Doo-Sun;Whang Kyung-Hyun
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.469-470
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    • 2006
  • Piezoelectric transformers based on lead zirconate titanate(PZT) have been received considerable interest because of their wide potential applications in transformer, oscillator, resonance sensor, actuator, acoustic transducer, as well as active slider for hard disk drives. However, for the applications which need a small power supply such as thin and flat displays, micro-robot, micro-system, it is especially necessary to integrate the passive components because they typically need more than 2/3 of the space of the conventional circuit. So, we have fabricated the piezoelectric micro-transformer to supply energy for micro-systems using PZT thin films and MEMS technologies.

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Temperature Compensation and Characteristics of Non-dispersive Infrared Alcohol Sensor According to the Intensity of Light (입사광량의 조절과 이에 따른 비분산 적외선 알코올 센서의 온도 특성과 보정)

  • Kim, JinHo;Cho, HeeChan;Yi, SeungHwan
    • Journal of Sensor Science and Technology
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    • v.27 no.1
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    • pp.47-54
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    • 2018
  • In this paper, we describe the thermal characteristics of the output voltages of ethanol gas sensor according to the amount of radiation incident on the infrared sensors located at each focal point of two elliptical waveguides. In order to verify the output characteristics of the gas sensor according to the amount of incident light on the infrared sensor, two combinations of sensor modules were fabricated. Hydrophobic thin film is deposited on one of the reflectors of sensor modules and one of the two infrared sensors was equipped with a hollow disk (10 Ø), and the temperature characteristics of the infrared sensor equipped with the hollow disk (10 Ø) and the infrared sensor without the disk were tested. The temperature was varied from 253 K to 333 K at 10 K intervals based on 298 K. The properties of ethanol gas sensor have been identified with respect to varying temperature for a range of ethanol concentration from 0 ppm to 500 ppm. In the case of an infrared sensor equipped with a hollow disk (10 Ø), the output voltage of the sensor decreased by 0.8 mV and 1 mV, respectively, as the temperature increased. Conversely, the output voltage of the diskless infrared sensor showed an average increase of 67 mV and 57 mV as the temperature increased. The ethanol concentrations estimated on the basis of results show an error of more than 10 % for less than 100 ppm concentration. However, if the ethanol concentration exceeds 100 ppm, the gas concentration can be estimated within the range of ${\pm}10%$.

A Study on the Fluxless Bonding of Si-wafer/Solder/Glass Substrate (Si 웨이퍼/솔더/유리기판의 무플럭스 접합에 관한 연구)

  • ;;;N.N. Ekere
    • Journal of Welding and Joining
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    • v.19 no.3
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    • pp.305-310
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    • 2001
  • UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

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