• Journal of the Korean institute of surface engineering
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• v.43 no.3
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• pp.148-153
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• 2010

Transparent conducting films having a hybrid structure of GZO/Metal/GZO were prepared on glass substrates by sequential deposition using DC magnetron sputtering. Silver, copper, aluminum and zinc thin films were used as the intermediate metal layers in the hybrid structure. The electrical and optical properties of hybrid transparent conducting films were investigated with varying the thickness of metal layer or GZO layers. With increasing the metal thickness, hybrid films showed a noticeable improvement of the electrical conductivity, which is mainly dependent on the electrical property of the metal layer. GZO(40 nm)/Ag(10 nm)/GZO(40 nm) film exhibits a resistivity of $5.2{\times}10^{-5}{\Omega}{\cdot}cm$ with an optical transmittance of 82.8%. For the films with Zn interlayer, only marginal reduction in the resistivity was observed. Furthermore, unlike other metals, hybrid films with Zn interlayer showed a decrease in the resistivity with increasing the GZO thickness. The optimal thickness of GZO layer for anti-reflection effect at a given thickness of metal (10 nm) was found to be critically dependent on the refractive index of the metal. In addition, x-ray diffraction analysis showed that the insertion of Ag layer resulted in the improvement of crystallinity of GZO films, which is beneficial for the electrical and optical properties of hybrid-type transparent conducting films.

• The Journal of Korean Academy of Prosthodontics
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• v.17 no.1
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• pp.23-34
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• 1979

In this study, the adhesive strength of three commercial polycarboxylate cements to ten types of dental casting alloys, such as gold, palladium, silver, indium, copper, nickel, chromium, and human enamel and dentine were measured and compared with that of a conventional zinc phosphate cement. The $8.0mm{\times}3.0mm$ cylindrical alloy specimens were made by casting. The enamel specimens were prepared from the labial surface of human upper incisor, and the dentine specimens were prepared from the occulusal surface of the human molar respectively. Sound extracted human teeth, which had been kept in a fresh condition since, extraction, were mounted in a wax box with a cold-curing acrylic resin to expose the flattened area. The mounted teeth were then placed in a Specimen Cutter (Technicut) and were cut down under a water spray, and then the flat area on the all specimens were ground by hand with 400 and 600 grit wet silicone carbide paper. Two such specimens were then cemented together face-to-face with freshly mixed cement, and moderate finger pressure was applied to squeeze the cement to a thin and uniform film. All cemented specimens were then kept in a thermostatic humidor cabinet regulated at $23{\pm}2^{\circ}C.$ and more than 95 per cent relative humidity and tested after 24 hours and 1 week. Link chain was attached to each alloy specimen to reduce the rigidity of the jig assembly, and then all the specimens were mounted in the grips of the Instron Universal Testing Machine, and a tensile load was delivered to the adhering surface at a cross head speed of 0.20 mm/min. The loads to which the specimens were subjected were recorded on a chart moving at 0.50 mm/min. The adhesive strength was determined by measuring the load when the specimen separated from the cement block and by dividing the load by the area. The test was performed in a room at $23{\pm}2^{\circ}C.$ and $50{\pm}10$ per cent relative humidity. A minimum of five specimens were tested each material and those which deviated more than 15 per cent from the mean were discarded and new specimens prepared. From the experiments, the following results were obtained. 1) It was found that the adhesive strength of the polycarboxylate cement to all alloys tested was considerably greater than that of the zinc phosphate cement. 2) The adhesive strength of the polycarboxylate cements was superior to the non precious alloys, such as the copper, indium, nickel and chromium alloys, but it was inferior to the precious gold, silver and palladium alloys. 3) Surface treatment of the alloy was found to be an important factor in achieving adhesion. It appears that a polycarboxylate cement will adhere better to a smooth surface than to a rough one. This contrasts with zinc phosphate cements, where a rough helps mechanical interlocking. 4) The adhesion of the polycarboxylate cement with enamel was found superior to its adhesion with dentine.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.20 no.7
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• pp.38-45
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• 2006

The superconducting fault current limiters(SFCLs) provide the effect such as enhancement in power system reliability due to limiting the fault current within a few miliseconds. Among various SFCLs we have developed a flux-lock type SFCL and exploited a special design to effectively reduce the fault current according to properly adjustable magnetic field after the short-circuit test. This SFCL consists of two copper coils wound in parallel on the same iron core and a component using the YBCO thin film connected in series to the secondary copper coil. Meanwhile, operating characteristics can be controlled by adjusting the inductances and the winding directions of the coils. To analyze the operational characteristics, we compared closed-loop with open-loop iron core. When the applied voltage was 200[Vrms] in the additive polarity winding, the peak values of the line current the increased up to 30.71[A] in the closed-loop and 32.01[A] in the open-loop iron core, respectively. On the other hand, in the voltages generated at current limiting elements were 220.14[V] in the closed-loop and 142.73[V] in the opal-loop iron core during first-half cycle after fault instant under the same conditions. We confirmed that the open-loop iron core had lower power burden than in the closed-loop iron core. Consequently, we found that the structure of iron core enabled the flux-lock type SFCL at power system to have the flexibility.

• Journal of the Korean Chemical Society
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• v.41 no.4
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• pp.180-185
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• 1997

Zinc, cadmium, lead and copper were simultaneously determined by depositing metals at - 1.200 V vs. a Ag/AgCl(sat. KCl) reference electrode for 150 seconds on a hanging mercury drop electrode(HMDE) or a thin mercury film electrode(TMFE), followed by scanning towards anodic direction using differential pulse voltammetric(DPASV) and square wave voltammetric(SWASV) techniques. The linear calibration curves were obtained for four metal ions simultaneously determined by DPASV with a HMDE in the concentration range between 20 and 100 ppb. However, the linear calibration plots were obtained only for $Cd^{2+}$ and $Pb^{2+}$ in the simultaneous determinations with a TMFE in the concentration range up to 100 ppb using DPASV and up to 10 ppb using SWASV. DPASV with a TMFE was about 15 times more sensitive than DPASV with a HMDE for simultaneous determinations of $Cd^{2+}$ and $Pb^{2+}$. SWASV was about 5 times more sensitive than DPASV at a TMFE. Concentrations of zinc in seven different sediment samples determined by DPASV with a HMDE and inductively coupled plasma-mass spectrometry were compared, resulting with an excellent correlation coefficient of 0.9993 and with no significant difference between two methods after t-test.

• Journal of the Korean Vacuum Society
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• v.20 no.5
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• pp.356-360
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• 2011

Indium oxide ($In_2O_3$) single layer and $In_2O_3$/copper (Cu) bi-layer films were prepared on glass substrates by RF and DC magnetron sputtering without intentional substrate heating. In order to determine the effect of the Cu bottom layer on the optical, electrical and structural properties of $In_2O_3$ films, 3-nm-thick Cu film was deposited on the glass substrate prior to deposition of the $In_2O_3$ films. As-deposited $In_2O_3$ films had an optical transmittance of 79% in the visible wavelength region and a sheet resistance of 2,300 ${\Omega}/{\square}$, while the $In_2O_3$/Cu film had optical and electrical properties that were influenced by the Cu bottom layer. $In_2O_3$/Cu films had a lower sheet resistance of 110 ${\Omega}/{\square}$ and an optical transmittance of 71%. Based on the figure of merit, it can be concluded that the Cu bottom layer effectively increases the performance of $In_2O_3$ films for use as transparent conducting oxides in flexible display applications.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.79-84
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• 2014

To investigate the plating properties of a diethylene glycol-based Ag immersion plating solution containing citric acid, silver immersion plating was performed in a range from room temperature to $50^{\circ}C$ using sputtered Cu specimens. The used Cu specimens possessed surface structure with large numbers of pinholes which were created with over-acid etching. The Ag immersion plating performed at $40^{\circ}C$ exhibited that the pinholes and copper surface were completely filled with Ag just after 5 min mainly due to galvanic displacement reaction, indicating the best plating properties. Subsequently, the surface morphology of Ag-coated Cu became rougher as the plating time increased to 30 min because of the deposition of silver nanoparticles created by chemical reduction in the solution. The specimen that its overall surface was covered with silver indicated the start of oxidation at temperature higher than around $50^{\circ}C$ in air as compared with pure Cu, indicating enhanced anti-oxidation properties.

• Journal of Korean Society of Environmental Engineers
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• v.35 no.7
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• pp.464-471
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• 2013

In this study, the resource efficiency and future metal resource requirement in photovoltaic (PV) production system were evaluated by using material balance data and life cycle assesment (LCA) method. As a result, in the resource efficiency of ferrous and non-ferrous metal, lead and tin had higher resource efficiency than other materials in all PV systems (SC-Si, MC-Si, CI(G)S, CdTe). In the resource efficiency of rare metals, gallium and rhenium in silicon system and rhenium and rhodium in thin-film system ranked as the first and second high resource efficiency. In case of rare earth metal, gadolinium and samarium took higher resource efficiency. The results of the future metal resource requirement in PV systems showed that 2,545,670 ton of aluminium, 92,069 ton of zinc, 22,044 ton of copper, 1,695 ton of tin and 31 ton of nickel will be needed by 2030 in South Korea, except resource recycling supplement.

• Journal of the Korean Vacuum Society
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• v.18 no.3
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• pp.203-207
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• 2009

Copper is known as a replacement for aluminum wire which is used for semiconductor. Because specific resistance of Cu ($1.67{\mu}{\Omega}$-cm) is lower than that of Al ($2.66{\mu}{\Omega}$-cm), Cu reduce RC delay time. Although melting point of Cu($1085^{\circ}C$) is higher than melting point of Al, Cu have characteristic to easily react with Silicon(Si) in low temperature, and it isn't good at adhesive strength with Si. For above these reason, research of diffusion barrier to prevent reaction between Cu and Si and to raise adhesive strength is steadily advanced. Our study group have researched on W-C-N (tungsten-carbon-nitrogen) Diffusion barrier for preventing diffusion of Cu through semiconductor. By recent studies, It's reported that W-C-N diffusion barrier can even precent Cu and Si diffusing effectively at high temperature. In this treatise, we vaporized different proportion of N into diffusion barrier to research Cu's Electromigration based on the results and studied surface hardness in the heat process using nano scale indentation system. We gain that diffusion barrier containing nitrogen is more stable for Cu's electromigration and has stronger surface hardness in heat treatment process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.5
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• pp.475-480
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• 2017

In this paper, the conductivity of the fine pattern is improved in the insulating substrate by laser-induced forward transfer (LIFT) process. The high laser beam energy generated in conventional laser induced deposition processes induces problems such as low deposition density and oxidation of micro-patterns. These problems were improved by using a polymer coating layer for improved deposition accuracy and conductivity. Chromium and copper were used to deposit micro-patterns on silicon wafers. A multi-pulse laser beam was irradiated on a metal thin film to form a seed layer on an insulating substrate(SiO2) and electroless plating was applied on the seed layer to form a micro-pattern and structure. Irradiating the laser beam with multiple scanning method revealed that the energy of the laser beam improved the deposition density and the surface quality of the deposition layer and that the electric conductivity can be used as the microelectrode pattern. Measuring the resistivity after depositing the microelectrode by using the laser direct drawing method and electroless plating indicated that the resistivity of the microelectrode pattern was $6.4{\Omega}$, the resistance after plating was $2.6{\Omega}$, and the surface texture of the microelectrode pattern was uniformly deposited. Because the surface texture was uniform and densely deposited, the electrical conductivity was improved about three fold.

• Journal of the Korean Magnetics Society
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• v.16 no.1
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• pp.34-39
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• 2006

Pure and Fe-doped CuO thin-film and powder samples were prepared using a sol-gel method. Undoped CuO films exhibited monoclinic structure and p-type electrical conductivity $(\~10^{-2}\;{\Omega^{-1}\;cm^{-1}$ due to copper deficiency. On the other hand, CuO: Fe films were found to be insulating and Li doping on the films led to a restoration of p-type conductivity and a ferromagnetic hysteresis behaviour at room temperature. The observed properties far the CuO : Fe, Li films can be explained in terms of hole creation by substitution of $Li^+$ for $Cu^{2+}$ sites and mediation of long-range interactions between $Fe^{3+}$ ions by the $Li^+$-induced defect states. CuO: Fe powders exhibited a ferromagnetism at room temperature with its strength being dependent on post-annealing temperature. Mossbauer measurements on the CuO: Fe films and powders revealed that the octahedral $Cu^{2+}$ sites are mostly substituted by $Fe^{3+}$ ions.