• 한국산업융합학회 논문집
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• 제24권4_2호
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• pp.509-515
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• 2021

In this study, a pressure vessel for a heat pipe was fabricated by bonding a metal thin film using a polymer compound sheet. In order to confirm the applicability of the experimentally manufactured copper material thin heat pipe of 0.6 mm or less, the pressure resistance and effective thermal conductivity for pressure generated according to the type of the working fluid of the heat pipe were evaluated to suggest the commercialization potential of the thin heat pipe. As a result of evaluating the pressure resistance and effective thermal conductivity performance of the thin heat pipe, the following conclusions were drawn. 1) Using a PEEK-based polymer compound sheet, it was possible to fabricate a pressure vessel for a thin heat pipe with a pressure resistance of up to 1.0 MPa by bonding a copper thin film, and the possibility of commercialization was confirmed at a temperature below 120 ℃. 2) In the case of the effective thermal conductivity performance evaluation test, the effective thermal conductivity of ethanol was higher than that of FC72 and Novec7000, and in the case of ethanol, the maximum effective thermal conductivity was 2,851 W/mK at 3.0 W of heating.

• 대한기계학회논문집B
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• 제40권11호
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• pp.755-759
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• 2016

전자 통신 분야에서 히트파이프를 활용한 방열기술은 점차 늘어나고 있다. 특히 전자 패키지 응용에서는 원형 단면 히트파이프에 비해 평판 형상의 얇은 히트파이프가 보다 더 적용하기에 용이하다. 압출 공정에 기반한 평판 히트파이프는 내벽에 사각 단면 그루브들로 이루어진 단순한 모세관 윅 구조를 갖는다. 그루브 윅이 내벽에 다수 개 설치가 된다고 하더라도 상대적으로 높은 모세관력을 달성하기는 어렵다. 본 연구에서는 그루브 윅의 모세관력 향상을 위해 와이어 다발을 적용한 평판 히트파이프의 제작 및 성능평가 실험을 수행하였다. 실험을 통해 와이어 다발을 윅으로 갖는 평판 히트파이프의 열저항 및 열전달률이 그루브 윅 평판 히트파이프에 비해 각각 3.4배와 3.8배 가량 우수한 것으로 나타났다. 본 연구를 통해 와이어 다발을 통한 모세관력 향상 효과를 실험적으로 확인하였으며, 향후 상용화를 위한 연구를 진행할 계획이다.

• 반도체디스플레이기술학회지
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• 제8권4호
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• pp.25-29
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• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1506-1511
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• 2003

The present study proposes a new structure for a flat plate heat pipe which could embody a thin thickness, any shapes and high heat density a unit area. It is on the structure for the formation of vapor passages and the support of the case of the flat plate heat pipe. A screen mesh is used as the one. To verify the validity of the one, the flat plate heat pipe of 1.08mm thickness was made with a layer of the screen mesh with 14 and 100 mesh number respectively and tested. Here the screen mesh with 14 mesh number plays a role of the vapor passage and the support of the case and the screen mesh with 100 mesh number functions as the wick structure. T he results show that the screen mesh excellently carries out the function of the vapor passage and the support of the case.

• Nuclear Engineering and Technology
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• 제54권8호
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• pp.3117-3129
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• 2022

Deeply understanding the phase change of thin liquid sodium film inside wick pore is very important for further studying high-temperature sodium heat pipe's heat transfer. For the first time, the evaporation and condensation of thin liquid sodium film are investigated by the Lennard-Jones potential of molecular dynamics. Based on the startup and normal operation of the sodium heat pipe, three different cases are simulated. First, the equilibrium is achieved and the Mass Accommodation Coefficients of the three cases are 0.3886, 0.2119, 0.2615 respectively. Secondly, the non-equilibrium is built. The change of liquid film thickness, the number of gas atoms, the net evaporation flux (J_net), the heat transfer coefficient (h) at the liquid-gas interface are acquired. Results indicate that the magnitude of the J_net and the h increase with the basic equilibrium temperature. In 520-600 K (the startup of the heat pipe), the h has approached 5-6 W m^-2 K^-1 while liquid film thickness is in 11-13 nm. The fact shows that during the initial startup of the sodium heat pipe, the thermal resistance at the liquid-gas interface can't be negligible. This work is the complement and extension for macroscopic investigation of heat transfer inside sodium heat pipe. It can provide a reference for further numerical simulation and optimal design of the sodium heat pipe in the future.

• Journal of Advanced Marine Engineering and Technology
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• 제28권3호
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• pp.451-456
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• 2004

This present experimental study has dealt with the heat transfer characteristics of plastic particle slurry which flows in a circular tube. This type of slurry is suggested for heat transfer enhancement effect cause by random and vortex effect of plastic particle dispersed in water. As a result, the thermal boundary layer becomes thin so the heat transfer coefficient on the tube wall more increase compare to pure water flow. This experimental test section was composed with stainless pipe which has the length of 2000mm, inner pipe diameter of 14mm and outer pipe diameter of 60mm. The most effective and important parameter of this experiment is plastic packing factor(PPF). The focuses of these results are pressure drop and heat transfer coefficient. As results, the friction factor of plastic particle slurry becomes higher at laminar flow region than pure water because of buoyancy effect of plastic particle but the local heat transfer coefficient becomes higher.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2113-2118
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• 2007

In this study, a mathematical model for a thermal analysis of a flat heat pipe with a grooved wick structure is presented. The effects of the liquid-vapor interfacial shear stress, the contact angle, and the amount of liquid charge have been included in the proposed model. In particular, the axial variations of the wall temperature and the evaporation/condensation rates are considered by solving the one-dimensional conduction and the augmented Young-Laplace equations, respectively. In order to verify the model, the results obtained from the model are compared to existing experimental data.

• 대한기계학회논문집
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• 제9권1호
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• pp.47-55
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• 1985

본 논문에서는, 긴 단열부를 갖는 열파이프에 있어서, 단열부에 유동저항이 매우 작은 접힌판재의 그루우브 wick를 넣은 구조에 대한 이론적, 실험적 연구를 다 루었다. 본 논문의 목적은, 위에서 설명한 열파이프의 근본적인 상반기능을 해결해 줄 수 있는 하나의 열파이프 구조를 제공할 뿐만 아니라, 더 나아가 접힌 판재의 그루 우브라는 새로운 형태의 wick의 가능성을 암시하는 데 있는 것이다.

• 대한기계학회논문집B
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• 제25권6호
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1999년도 봄 학술발표회 논문집(I)
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• pp.269-274
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• 1999

Various method have been developed for mass concrete structures to reduce the temperature increase of concrete mass due to exothermic hydration reactions of concrete compounds and thereby to avoid thermal cracks. One of the methods widely acceptable for practical use is pipe cooling, in which cooling is achieved by circulating cold water through thin-wall steel pipes embedded in the concrete. A numerical simulation was performed to investigate the effectiveness of pipe cooling. A three-dimensional finite element method was proposed to analyse the transient three-dimensional heat transfer between the hardening concrete and the cooling water in pipe and to predict the stress development during the curing process. The effects of the cement type and content and the environment were taken into consideration by the heat generation rate and the boundary conditions, respectively. In order to test the validity of the numerical simulation, a model RC structure with pipe cooling was constructed and the time-dependent temperature and stress distributions within the structure as well as the variation of the temperature of cooling water along the pipe were measured. The results of the simulation agreed well the experimental measurements. The results of this study have important implications for the optimal design of the cooling pipe layout and for the estimation of thermal stress in order to eliminate thermal cracks.