• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• 한국전기전자재료학회논문지
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• 제14권11호
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• pp.874-878
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• 2001

Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.288-291
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• 2001

It is very important to select suspension solution for forming electrophoretic deposited YBCO thick film, because it is heavily affected to its superconducting properties. In this paper, high-temperature superconductor films of YBa$_2$Cu$_3$$O_{7-x}$ were fabricated by electrophoretic deposition (EPD) from alcohol-based suspension such as iso-propanol, iso-butanol, and their mixture. For the formation of YBCO dense and adherent coating on a silver wire by EPD, 1% PEG(1000) 2 $m\ell$, as a additive for making their surface crack-free, was used for electrophoresis. As a results, the cracks were considerably decreased and the superconducting critical current density (J$_{c}$) without/with PEG was 1200 A/$\textrm{cm}^2$ and 2020 A/$\textrm{cm}^2$, which films deposited in mix ism-propanol and iso-butanol suspension.ion.

• Journal of information and communication convergence engineering
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• 제1권2호
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• pp.63-66
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• 2003

High $T_c$ superconducting lines will be applied as key materials in the areas of power transmission line; magnetic levitation of vehicle; magnetic separation; magnetic energy storage and marine propulsion. A combination method of electrophoresis deposition and zone-melting for preparation of YBaCuO tape is proposed. The submicron particle powder of YBaCuO made by sol-gel method is used in the electrophoresis process. A 40∼50 ${\mu}\textrm{m}$ thickness of YBaCuO film on Ag plate could be deposited in about three minutes. After deposition the film is rolled and heat treated in order to increase the density and the adhesion of the film to the Ag plate. Silver(Ag) and lead oxide(PbO) were added in the YBaCuO powder in order to reduce its melting point. The YBaCuO coating with controlled Ag and PbO contents was preliminarily zone-melted at about $945^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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• pp.351-354
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• 1998

The formation of the $YBa_2Cu_30_{7_\delta}$(Y123) thick films has been investigated by a surface diffusion Imcess between $3BaCu0_2$+2CuO composite coating powder and a $Y_2BaCuO_5$(Y211). This reaction has been studied in the temperature of $930^{\circ}C$ and $940^{\circ}C$ for 2h to 10h in an oxygen atmosphere. The Y211 substrates becomes covered by co-precipitation of Y123 grains and CuO inclusions. X-ray diflractotnctn. revealed that the lager consisted of an orthorhombic crystal structure. The maximum Jc of $400A/\textrm{cm}^2$ is abtained when the specimen was heat-treated at $930^{\circ}C$ for 6h on the Y211 substrate.

• 한국진공학회지
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• 제20권6호
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• pp.436-441
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• 2011

각종 전자 방출원 및 디스플레이 응용 분야에서 뛰어난 가능성을 보이고 있는 탄소나노튜브의 전계 방출 특성을 개선하고 전자방출의 신뢰성을 개선하기 위해 탄소나노튜브의 표면에 수 nm 두께의 금속 코팅을 적용하였다. 탄소나노튜브는 실리콘 기판위에 2 nm 두께의 Invar (52% Fe, 42% Ni, 6% Co alloy) 촉매를 사용하여 $450^{\circ}C$의 온도에서 플라즈마 화학기상 증착법으로 성장시켰다. 성장된 탄소나노튜브의 밀도 제어를 위해 성장 후 질소 플라즈마로 일부를 식각한 후 티타늄(Ti) 금속을 탄소나노튜브 표면에 5~150 nm 두께로 스퍼터링 증착하였다. 5 nm로 티타늄을 탄소나노튜브 표면에 코팅한 경우, 코팅 전에 비해 6 V/${\mu}m$의 전계에서 전류밀도가 4배 이상 증가되었으며, 전계 방출 전류의 요동(fluctuation) 또한 40% 이상 감소됨을 확인할 수 있었다. 이는 티타늄의 일함수가 4.3 eV로 탄소나노튜브의 5 eV에 비해 작을 뿐만 아니라, 탄소나노튜브의 약점으로 지적되는 기판과의 접착성과 접촉저항이 티타늄의 표면 코팅으로 인해 크게 개선된 결과로 판단된다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 춘계학술발표대회 개요집
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• pp.102-104
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• 2003

Laser weldability of aluminized steels of 0.8mm thick has been investigated. Test materials were cut from the commercial steels that were produced at the Coating Mill of POCOS. Test coupons for welding were prepared by using a conventional shearing machine and no additional edge treatment was peformed. Nd:YAG laser welding system was mainly applied to make weld specimens. Test results revealed that almost no spattering was observed even though the welding was peformed with no overlap joint clearance. Bead quality of aluminized steel laser weld was smooth and stable. According to x-ray inspection results, it was proved that the laser welds of aluminized steels were metallurgically defect free.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2013년도 춘계학술대회 논문집
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• pp.109-110
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• 2013

Medium carbon steel was aluminized by hot dipping into molten Al or Al-1%Si baths. After hot-dipping in these baths, a thin Al-rich topcoat and a thick alloy layer rich in $Al_5Fe_2$ formed on the surface. A small a mount of FeAl and $Al_3Fe$ was incorporated in the alloy layer. Silicon from the Al-1%Si bath was uniformly distributed throughout the entire coating. The hot dipping increased the microhardness of the steel by about 8 times. Heating at $700-1000^{\circ}C$ however decreased the microhardness through interdiffusion between the coating and the substrate. The oxidation at $700-1000^{\circ}C$ in air formed a thin protective ${\alpha}-Al_2O_3$ layer, which provided good oxidation resistance. Silicon was oxidized to amorphous silica, exhibiting a glassy oxide surface.

• Elastomers and Composites
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• 제53권3호
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• pp.136-140
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• 2018

In this study, research was conducted into the manufacture of thermally expandable microspheres for automotive underbody coatings and applications in industry. In particular, the relationship between heat resistance and the ratio of crosslinking agents and initiators in the manufacture of the thermally expandable microspheres was investigated. We focused on the results with various cross-linking agents; our aim was to make the walls of the microspheres thicker to solve the problem of reductions in size caused by shrinkage when the microspheres are heated to $T_m$ ($T_{max}$). We observed the sectional thickness and surface of the samples with thicker walls. The thick thermally expandable microspheres showed reduced shrinkage and excellent stability in spite of prolonged exposure to heat.

• E2M - 전기 전자와 첨단 소재
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• 제9권1호
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• pp.59-66
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• 1996

Polyimides containing cyclobutane ring in main chain is known to be thermally stable and able to be developed in organic solvents after photolysis with 254 nm UV light. This type of polyimides can be used as promising positive photoresist in VLSI fabrication process. In the current VLSI process, photoresist films are formed by spin coating. The film thickness is more than several hundred nano meters. It seems that there is room for improvement of film coating process by introducing Langmuir Blodgett technique. Thereby ultra thin film photoresist can be formed, and higher density of integration in VLSI be achieved. In the present work, depositing procedure of LB films of this polyimide was investigated. LB film thickness was measured by ellipsometry to evaluate deposited film status. Chemical imidization procedure was studied to avoid several problems in thermal imidization. The pattern of submicron dimension has successfully formed on LB film of 8nm thick, which found showing good contrast.