• Title/Summary/Keyword: Thermosetting

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Improvement of adhesion of Polyester Fabric and Knit by Corona Treatment (코로나 처리를 이용한 폴리에스테르 편·직물의 접착력 향상)

  • Lee, Eon Pil;Yoon, Rae Won;Lee, Jae Ho
    • Journal of Adhesion and Interface
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    • v.8 no.3
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    • pp.16-23
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    • 2007
  • Polyester fabrics and knits were corona treated with different current intensity (5, 10, 15, 20 A) and feeding speed (5, 10, 15 m/min). We confirmed the surface change of polyester fabrics and knits using scanning electron microscopy (SEM) and X-ray photoelectron spectrometer (XPS). And the change of physical properties through measuring the tensile strength, dry and wet bonding strength. Thermosetting reactive polyurethane hot melt adhesive was used in the adhesion of polyester fabrics and knits. Functional groups were introduced on PET fabrics and knits surface by treating the PET fabrics and knits in air atmosphere with corona discharge, and take placed unevenness, the result adhesion was improved. When consider both dry and wet bonding strength, we think that appropriate conditions in the PET fabrics corona treatment are feeding speed 10 m/min, current intensity 15 A and appropriate conditions in the mesh type PET knits corona treatment are feeding speed 10 m/min, current intensity above 10 A.

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The Effect of the Core-shell Structured Meta-aramid/Epoxy Nanofiber Mats on Interfacial Bonding Strength with an Epoxy Adhesive in Cryogenic Environments (극저온 환경에서 에폭시 접착제의 물성 향상을 위한 나노 보강재의 표면 개질에 관한 연구)

  • Oh, Hyun Ju;Kim, Seong Su
    • Composites Research
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    • v.26 no.2
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    • pp.129-134
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    • 2013
  • The strength of adhesive joints employed in composite structures under cryogenic environments, such as LNG tanks, is affected by thermal residual stress generated from the large temperature difference between the bonding process and the operating temperature. Aramid fibers are noted for their low coefficient of thermal expansion (CTE) and have been used to control the CTE of thermosetting resins. However, aramid composites exhibit poor adhesion between the fibers and the resin because the aramid fibers are chemically inert and contain insufficient functional groups. In this work, electrospun meta-aramid nanofiber-reinforced epoxy adhesive was fabricated to improve the interfacial bonding between the adhesive and the fibers under cryogenic temperatures. The CTE of the nanofiber-reinforced adhesives were measured, and the effect on the adhesion strength was investigated at single-lap joints under cryogenic temperatures. The fracture toughness of the adhesive joints was measured using a Double Cantilever Beam (DCB) test.

A Study on the Dielectric Characteristics of Non-Cross Linked Polyolefin for Distribution Power Cables (배전용 전력 케이블을 위한 비-가교 폴리올레핀 재질의 절연특성 연구)

  • Kim, Junil;Lee, Onyou;Bang, Seungmin;Kang, Jong O;Lee, Hongseok;Jeong, Yeong-Ho;Kang, Hyoungku
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.63 no.4
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    • pp.373-377
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    • 2014
  • A cross linked polyethylene (XLPE) material has been widely used to develop a distribution power cable due to its excellent electrical characteristics and mechanical strength. However, several problems such as environmental disruption, electrical aging, thermosetting property, and impurities which cause degradation also arise. Therefore, a novel dielectric material should be developed to substitute for the XLPE. Several kinds of polyolefin materials to substitute for the conventional dielectric material, XLPE are developed and A cylindrical rod to cylindrical rod electrode system made with stainless steel is used to perform the experiments according to the ASTM D-149 protocol under an AC and Impulse input voltage condition. The experimental results are calculated by the Weibull distribution method and analyzed by an Finite Element Method(FEM). Finally, the dielectric characteristics of the conventional XLPE and novel polyolefin are experimented compared with each other in this study.

Effect of Thermal Imidization and Curing on Fluorescence Behavior of a Phenylethynyl-Terminated Poly(amic acid)

  • Cho, Donghwan;Yang, Gyeongmo;Drzal, Lawrence T.
    • Macromolecular Research
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    • v.11 no.5
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    • pp.297-302
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    • 2003
  • The imidization and cure reaction of a thermosetting phenylethynyl-terminated amic acid (LaRC PETI-5) in film form have been monitored as a function of temperature by means of a steady-state fluorescence technique using a front-face illumination method. The variation of the fluorescence emission spectra of LaRC PETI-5 can be divided into four temperature regions; Region I: below 15$0^{\circ}C$, Region II: 150-25$0^{\circ}C$, Region III: 250-35$0^{\circ}C$, and Region IV: above 35$0^{\circ}C$. The fluorescence spectra in Region I are largely influenced by residual N-methyl-2pyrrolidinone in the polymer and also slightly by partial imidization of the polymer. There is a combined effect of imidization and solvent removal on the fluorescence behavior in Region II. The spectra in Regions III and IV are due significantly to the cure reaction of LaRC PETI-5 and to a post-cure effect of the polyimide, respectively. This spectroscopic evidence indicating the transformation of the amic acid imide oligomer into the corresponding polyimide via imidization and cure, agrees well with thermal analysis results obtained previously. The intermediate stage of cure in the range of 250-30$0^{\circ}C$ predominantly influences the change of the fluorescence intensity. The later stage above 30$0^{\circ}C$ significantly influences the position of the spectrum. This fluorescence study also supports the mechanism proposed in earlier work that the crosslinking reaction takes place at the reaction sites in the conjugated polyene and the phenylethynyl end group in the polyimide chain.

Cure Konetics and Mechanism of DGEBA-MDA-Malononitrile System (Malononitrile로 개질된 DGEBA-MDA계의 경화반응 속도론 및 반응 메카니즘)

  • Im, Seong-Su;Jo, Seong-U;Yu, Hui-Yeol;Sim, Mi-Ja;Kim, Sang-Uk
    • Korean Journal of Materials Research
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    • v.3 no.3
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    • pp.215-222
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    • 1993
  • Malononitrile(MN) as a reactive additive was added to Diglycidyl ether of bisphenol A (DGEBA)/Methylene dianiline (MDA) system in order to modify a thermosetting epoxy resin. Cure ki. netics and cure mechanism of this modified system were investigated by using DSC(differential scanning calorimetry) and FT-IR(fourier transform infrared spectrometry). Cure kinetics gave an information that the DGEBA/MDA system modified with MN should cure at over $110^{\circ}C$ after curing at about $80^{\circ}C$ for the complete curing. The activation energy of the first cure was nearly constant and that of the second cure was increased as the MN content was increased. Cure mechanism for the system was investigated with the samples cured every $30^{\circ}C$, from $80^{\circ}C$ to $170^{\circ}C$, for Ihr. It was known that the cure reactions of the epoxy-diamine system were composed of PA -E, SA - E and E-OH reactions. Beside these three reactions, in the DGEBA/MDA/MN system PA-CN and CN-OH reaction was found.

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The Study on Coatings to Improve the Radiative Heat Dissipation of Aluminum Alloy (알루미늄 합금의 복사방열향상을 위한 코팅연구)

  • Seo, Mihui;Kim, Donghyun;Lee, Junghoon;Chung, Wonsub
    • Journal of the Korean institute of surface engineering
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    • v.46 no.5
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    • pp.208-215
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    • 2013
  • The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050. Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiative heat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite plating was made in pyrophosphate copper plating bath. Radiant heat flux($W/m^2$) was measured by self-produced radiant heat measurement device to compare each specimen. The cross section of specimen and chemical bonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coating was higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference in chemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result of experiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LED and measured the LED temperature. As a result, LED temperature of samples were matched previous results and confirmed coated samples were lower about 10 degrees than the aluminum alloy.

Simulation for Injection Molding of Insulation Spacers for Gas-Insulated Switches Using Thermosetting Epoxy Resin (열경화성 에폭시를 이용한 가스 절연 개폐기용 절연 스페이서의 사출 성형 최적화 시뮬레이션)

  • Bae, Jaesung;Lee, Wonchang;Jee, Hongsub;Hong, Byungyou;Lee, Jaehyeong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.34 no.6
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    • pp.426-432
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    • 2021
  • Injection molding is used in many industrial fields such as home appliances, vehicle parts, and electronic device parts because various resins can be molded, leading to mass production of complex shapes. Generally, the empirical prediction method is used to set the initial processing conditions of injection molding. However, this approach requires a lot of cost and its presented solution is not accurate. In this paper, injection molding was simulated through the MoldflowTM in order to manufacture the spacer for gas insulated switch. Through the simulation, the flow of the resin with respect to the diameter of the inlet was analyzed. It was found that the process was possible at a higher resin temperature as the diameter of the inlet increased. In addition, through thermal analysis during injection of the resin, it was confirmed that a stagnation phenomenon occurred at the insert portion during injection molding, and the temperature of the resin was higher than that of the mold. As in this paper, if the spacer is manufactured by optimizing the injection hole and the temperature of the injection process based on simulation, it is expected that the spacer can be manufactured with high productivity.

Thermal Properties of Diglycidyl Ether of Terephthalylidene-bis-(4-amino-3-methylphenol) (Diglycidyl ether of terephthalylidene-bis-(4-amino-3-methylphenol)의 열적 성질에 대한 연구)

  • Hyun, Ha-Neul;Choi, Ji-Woo;Cho, Seung-Hyun
    • Composites Research
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    • v.35 no.2
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    • pp.53-60
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    • 2022
  • This study uses Diglycidyl ether of terephthalylidene-bis-(4-amino-3-methylphenol) (DGETAM), an amine hardener 4,4'-diaminodiphenylethane (DDE) and cationic catalyst N-benzylpyrazinium hexafluoroantimonate (BPH) to make epoxy film. For analysis, 1H_NMR and FT-IR were used to verify proper synthesis, and the liquid crystallinity of DGETAM was checked using Differntial Scanning Calorimetry and Polarized Optical Microscopy. Thermal conductivity of the sample was measured using Laser Flash Apparatus. Thermal stability as well as thermal conductivity is important when used as a packaging material. Activated energy is the energy needed to generate a response, which can be used to estimate the energy required to maintain physical properties. It was obtained using the Arrhenius equation based on the data measured by isothermal decomposition using Thermogravimetric Analysis. Measurement of the thermal conductivity of epoxy films showed higher thermal conductivity when DDE was used, and it was found that thermal conductivity had an effect on thermal stability, given that it represented an activation energy similar to a film with BPH upon 5% decomposition.

Properties of Woodceramics Made from MDF (MDF로 제조된 우드세라믹의 성질)

  • Oh, Seung-Won;Byeon, Hee-Seop
    • Journal of the Korean Wood Science and Technology
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    • v.30 no.2
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    • pp.115-120
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    • 2002
  • Woodceramics are new porous carbon materials obtained by burning wood or woody materials impregnated with thermosetting resin in a vacuum furnace. In this paper, the change of dimensions and bending strength of woodceramics which were made from medium density fiberboard have been investigated to examination the possibility of utilization as a woodceramics materials. 1) An increasing rate of dimension in impregnated board increased with increasing resin impregnation rate. And increasing rate of thickness was higher than that of length. 2) When the resin impregnation rate increased, the bending strength of impregnated board had a tendency to increase. 3) The rates of weight loss, length and thickness reduction of woodceramics showed a slight increase with increased burning temperature. 4) The density of woodceramics showed a increase from at 500℃ till at 800℃ with increasing burning temperature but decrease at 1,000℃ 5) When the burning temperature increased, the bending strength of woodceramics had a tendency to increase.

A Study on the Evaluation Method of Lap Shear Strength for Induction Welding of Thermoplastic Composites using Tensile Test (인장 시험을 이용한 열가소성 복합재료 유도용접 전단강도 평가방법에 대한 고찰)

  • Baek, Inseok;Lee, Seoksoon
    • Journal of Aerospace System Engineering
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    • v.16 no.1
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    • pp.12-16
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    • 2022
  • Currently, Induction welding is attracting attention as a non-contact, clean and fast welding process. However, since thermoplastic resins are not affected by electromagnetic fields, induction welding requires a heating element called a susceptor. Researches are being conducted with the aim of achieving high-quality bonding, however, the factor of a heating element is an issue, hence the need to set a standard. Specimen fabrication and testing are conducted according to ASTM D5868. In this study, we propose that the evaluation criteria be judged on the basis of three factors; the condition of the welded joint surface, void content, and lap shear strength. Since the adhesive surface to be welded melts and solidifies as it cools, rapid temperature changes can generate pores. In addition, if the heating is not uniform, it is difficult to expect the desire performance. Using PA6 (CF 30%) thermoplastic, susceptor fabrication, induction welding and performance verification were conducted.