Simulation for Injection Molding of Insulation Spacers for Gas-Insulated Switches Using Thermosetting Epoxy Resin |
Bae, Jaesung
(Department of Electrical and Computer Engineering, Sungkyunkwan University)
Lee, Wonchang (Department of Electrical and Computer Engineering, Sungkyunkwan University) Jee, Hongsub (Department of Electrical and Computer Engineering, Sungkyunkwan University) Hong, Byungyou (Department of Electrical and Computer Engineering, Sungkyunkwan University) Lee, Jaehyeong (Department of Electrical and Computer Engineering, Sungkyunkwan University) |
1 | J. C. Park and Y. K. Seong, J. Korean Soc. Manuf. Process Eng., 9, 21 (2010). [DOI: https://www.koreascience.or.kr/article/JAKO201007750339637.page] |
2 | H. S. Park and T. T. Nguyen, J. Comput. Des. Eng., 1, 256 (2014). [DOI: https://doi.org/10.7315/JCDE.2014.025] DOI |
3 | W. R. Kim, J. Photopolym. Sci. Technol., 20, 30 (2009). [DOI: http://pds16.egloos.com/pds/201004/14/01/Injection_molding_trend.pdf] |
4 | M. C. Quintana and P. Frontini, J. Reinf. Plast. Compos., 39, 219 (2019). [DOI: https://doi.org/10.1177/0731684419883941] DOI |
5 | G. D. Kim, J. Korean Soc. Precis. Eng., 24, 131 (2007). [DOI: https://www.koreascience.or.kr/article/JAKO200727500001526.page] |
6 | S. Kitayama, R. Onuki, and K. Yamazaki, Int. J. Adv. Manuf. Technol., 72, 827 (2014). [DOI: https://doi.org/10.1007/s00170-014-5697-7] DOI |
7 | H. S. Kim, J. S. Son, and Y. T. Im, J. Mater. Process. Technol., 140, 110 (2003). [DOI: https://doi.org/10.1016/S0924-0136(03)00700-3] DOI |
8 | S. Y. Eom, S. B. Seo, and K. Y. Lee, Polymer (Korea), 37, 240 (2013). [DOI: https://doi.org/10.7317/pk.2013.37.2.240] DOI |
9 | L. J. Lee, J. M. Ottino, W. E. Ranz, and C. W. Macosko, Polym. Eng. Sci., 20, 868 (1980). [DOI: https://doi.org/10.1002/pen.760201306] DOI |
10 | K. H. Han, D. S. Choi, H. S. Kim, and Y. T. Im, Trans. Korean Soc. Mech. Eng. A, 25, 1575 (2001). [DOI: https://doi.org/10.22634/KSME-A.2001.25.10.1575] DOI |
11 | J. S. Kim, J. D. Kim, O. R. Kim, and C. O. Kwon, J. Korean Acad.- Ind. Coop. Soc., 9, 1119 (2008). [DOI: https://doi.org/10.5762/KAIS.2008.9.5.1119] DOI |
12 | Y. E. Yoo, Y. H. Seo, T. J. Je, and D. S. Choi, Korean Society for Precision Engineering, 22, 23 (2005). [DOI: https://www.koreascience.or.kr/article/JAKO200514714087006.page] |
13 | K. Y. Park and J. C. Park, J. Korean Soc. Manuf. Process Eng., 10, 85 (2011). [DOI: https://www.koreascience.or.kr/article/JAKO201108163172983.page] |
14 | J. H. Mo, H. S. Hong, and M. Y. Lyu, Korean Soc. Technol. Plast., 10, 211 (2003). [DOI: https://scienceon.kisti.re.kr/srch/selectPOR SrchArticle.do?cn=NPAP08076264&dbt=NPAP] |
15 | Y. Zhao, T. Mattner, and D. Drummer, Int. J. Adv. Manuf. Technol., 105, 1723 (2019). [DOI: https://doi.org/10.1007/s00170-019-04306-9] DOI |
16 | S. H. Kim, J. Korean Contents Assoc., 12, 119 (2012). [DOI: https://doi.org/10.5392/JKCA.2012.12.12.119] DOI |
17 | M. Moayyedian, K. Abhary, and R. Marian, Int. J. Adv. Manuf. Technol., 91, 3977 (2017). [DOI: https://doi.org/10.1007/s00170-017-0055-1] DOI |
18 | J. M. Castro and C. W. Macosko, AIChE J., 28, 250 (1982). [DOI: https://doi.org/10.1002/aic.690280213] DOI |
19 | H. P. Park, B. S. Cha, J. W. Lee, Y. B. Ko, S. G. Kim, T. S. Jung, D. H. Kim, and B. O. Rhee, J. Korean Soc. Manuf. Technol. Eng., 23, 206 (2014). [DOI: https://doi.org/10.7735/ksmte.2014.23.2.206] DOI |
20 | S. H. Park, J. Korean Soc. Manuf. Technol. Eng., 28, 56 (2019). [DOI: https://doi.org/10.7735/ksmte.2019.28.1.56] DOI |
21 | D. V. Rosato and M. G. Rosato, Injection Molding Handbook (Springer Science+Business Media, LLC, 2000) p. 776. |