• Bulletin of the Korean Chemical Society
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• 제30권10호
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• pp.2227-2232
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• 2009

Novel polythiol materials of urethane lens series for plastic optical lens were synthesized from polyol materials via thioisouronium of thiourea with c-HCl in refluxing aqueous solution, in which polythiol material was carried out from hydrolysis of thioisouronium by ammonia water. Their structure properties were identified by EA, EI-MS, FT-IR, $^1H\;and\;^{13}C$ NMR spectroscopies and TGA. Their ophthalmic lenses as polythiourethane material were prepared by thermal curing to an injected glass mold using the evenly solutions of diisocyanates series (TDI, XDI, HDI or IPDI) with polythiols. Polythiourethane shows that the strong stretching mode for SH group of polythiol disappeared in FT-IR spectra after thermosetting polymerization. Thermal deformation starting temperature of ophthalmic lenses was determined by TMA. Ophthalmic lenses made from characteristic polythiol and diisocyanate series have transparency, colorless and good impact strength, in which thermal resistance and impact strength of ophthalmic lenses were influenced by diisocyanate series. Physical properties of ophthalmic lens have contrast thermal resistance with impact strength. The property of thermal resistance and impact strength for respective ophthalmic lenses was examined by TMA and drop ball test.

• 접착 및 계면
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• 제8권3호
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• pp.16-23
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• 2007

폴리에스테르 편 직물들을 전류세기 5, 10, 15, 20 A로, 공급속도 5, 10, 15 m/min로 코로나 처리하였다. 이들의 표면변화를 주사전자현미경(SEM)과 X-ray 광전자분석기(XPS)로 확인하였다. 또한 물리적 성질의 변화를 인장강도, 건조 시와 습윤 시의 접착강도를 통하여 측정하였다. 접착에 사용된 접착제는 열경화성 반응형 폴리우레탄 핫 멜트 접착제이다. 대기압에서 코로나 방전처리에 의해 폴리에스테르 편 직물에 관능기들이 도입되어졌고, 표면에 요철이 발생하여 그 결과 접착력은 향상되었다. 건조 시 및 습윤 시의 접착강도를 모두 고려할 때, PET 직물의 코로나 처리에 있어 적절한 조건은 공급 속도 10 m/min, 전류 세기 15 A라 생각되며, mesh형 PET knit는 공급 속도 10 m/min, 10 A 이상의 전류세기라 생각된다.

• Composites Research
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• 제26권2호
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• pp.129-134
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• 2013

극저온 환경에 노출되는 구조체의 접착조인트의 경우 피접착물과 접착물 사이에서 열팽창계수 차이로 인해 계면에서 잔류응력이 발생하게 되는데 이에 의해 접착조인트 내부에 미소균열, 층간분리 등의 형태로 파손이 발생할 우려가 있다. 본 연구에서는 높은 비강성, 낮은 열팽창계수의 특성을 지닌 메타 아라미드 섬유를 에폭시 기지재의 보강재로 사용하였다. 표면처리 공정을 간소화하기 위해 전기방사법의 고분자 혼합법(polymer blend method)으로 코어-쉘 구조의 메타 아라미드/에폭시 나노섬유를 제조하였다. 극저온 환경에서 계면특성이 향상된 코어-쉘 구조의 나노섬유를 보강한 에폭시 접착제의 전단물성을 확인하기 위해 환경챔버를 이용하여 $-150^{\circ}C$의 저온에서 단일 겹치기 실험(single lap joint test)을 진행하였다. 또한, DCB(double cantilever beam) 실험을 통해 파괴인성을 측정하였다. 그 결과, 극저온에서 일반 메타 아라미드 나노섬유에 비해 코어-쉘 구조의 메타 아라미드/에폭시 나노섬유를 보강한 접착제 시편이 우수한 계면특성으로 인해 물성이 크게 향상되었음을 확인하였다.

• 전기학회논문지P
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• 제63권4호
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• pp.373-377
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• 2014

A cross linked polyethylene (XLPE) material has been widely used to develop a distribution power cable due to its excellent electrical characteristics and mechanical strength. However, several problems such as environmental disruption, electrical aging, thermosetting property, and impurities which cause degradation also arise. Therefore, a novel dielectric material should be developed to substitute for the XLPE. Several kinds of polyolefin materials to substitute for the conventional dielectric material, XLPE are developed and A cylindrical rod to cylindrical rod electrode system made with stainless steel is used to perform the experiments according to the ASTM D-149 protocol under an AC and Impulse input voltage condition. The experimental results are calculated by the Weibull distribution method and analyzed by an Finite Element Method(FEM). Finally, the dielectric characteristics of the conventional XLPE and novel polyolefin are experimented compared with each other in this study.

• Macromolecular Research
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• 제11권5호
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• pp.297-302
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• 2003

The imidization and cure reaction of a thermosetting phenylethynyl-terminated amic acid (LaRC PETI-5) in film form have been monitored as a function of temperature by means of a steady-state fluorescence technique using a front-face illumination method. The variation of the fluorescence emission spectra of LaRC PETI-5 can be divided into four temperature regions; Region I: below 15$0^{\circ}C$, Region II: 150-25$0^{\circ}C$, Region III: 250-35$0^{\circ}C$, and Region IV: above 35$0^{\circ}C$. The fluorescence spectra in Region I are largely influenced by residual N-methyl-2pyrrolidinone in the polymer and also slightly by partial imidization of the polymer. There is a combined effect of imidization and solvent removal on the fluorescence behavior in Region II. The spectra in Regions III and IV are due significantly to the cure reaction of LaRC PETI-5 and to a post-cure effect of the polyimide, respectively. This spectroscopic evidence indicating the transformation of the amic acid imide oligomer into the corresponding polyimide via imidization and cure, agrees well with thermal analysis results obtained previously. The intermediate stage of cure in the range of 250-30$0^{\circ}C$ predominantly influences the change of the fluorescence intensity. The later stage above 30$0^{\circ}C$ significantly influences the position of the spectrum. This fluorescence study also supports the mechanism proposed in earlier work that the crosslinking reaction takes place at the reaction sites in the conjugated polyene and the phenylethynyl end group in the polyimide chain.

• 한국재료학회지
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• 제3권3호
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• pp.215-222
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• 1993

에폭시 수지를 개질하기 위하여 반응성 첨가제 Malononitrild(MN)을 Diglycidy1 ether fo vispenol A (CGEBA)/Methylene dianiline(MDA)계를 첨가하여 이 계의 경화 반응속도론과 경화반응메카니즘을 시차주사 열분석(DSC)과 적외선 흡수 분광법을 통해 관찰하였다. 경화반응속도론으로부터 MN으로 개질된 DGEBA/MDA는 완전히 경화를 이루기 위하여 $80^{\circ}C$로 부터 $170^{\circ}C$까지 $30^{\circ}C$간격으로 경화시킨 시료로 반응메카니즘을 고찰한 결과 PA(primary amine)-E(epoxide)그리고 E(epoxide)-OH(hydroxy1 group)반응 이외에 PA(primary amine)-CN(nitrile)과 CN(nitrile)-OH(hydroxy1 group)반응이 일어남을 알았다.

• 한국표면공학회지
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• 제46권5호
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• pp.208-215
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• 2013

The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050. Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiative heat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite plating was made in pyrophosphate copper plating bath. Radiant heat flux($W/m^2$) was measured by self-produced radiant heat measurement device to compare each specimen. The cross section of specimen and chemical bonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coating was higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference in chemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result of experiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LED and measured the LED temperature. As a result, LED temperature of samples were matched previous results and confirmed coated samples were lower about 10 degrees than the aluminum alloy.

• 한국전기전자재료학회논문지
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• 제34권6호
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• pp.426-432
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• 2021

Injection molding is used in many industrial fields such as home appliances, vehicle parts, and electronic device parts because various resins can be molded, leading to mass production of complex shapes. Generally, the empirical prediction method is used to set the initial processing conditions of injection molding. However, this approach requires a lot of cost and its presented solution is not accurate. In this paper, injection molding was simulated through the Moldflow^TM in order to manufacture the spacer for gas insulated switch. Through the simulation, the flow of the resin with respect to the diameter of the inlet was analyzed. It was found that the process was possible at a higher resin temperature as the diameter of the inlet increased. In addition, through thermal analysis during injection of the resin, it was confirmed that a stagnation phenomenon occurred at the insert portion during injection molding, and the temperature of the resin was higher than that of the mold. As in this paper, if the spacer is manufactured by optimizing the injection hole and the temperature of the injection process based on simulation, it is expected that the spacer can be manufactured with high productivity.

• Composites Research
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• 제35권2호
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• pp.53-60
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• 2022

본 연구에서 액정성 에폭시인 Diglycidyl ether of terephthalylidene-bis-(4-amino-3-methylphenol) (DGETAM)을 사용해 경화제로는 아민계 경화제인 4,4'-diaminodiphenylethane (DDE)와 양이온 개시제인 N-benzylpyrazinium hexafluoroantimonate (BPH)를 사용하여 필름의 형태로 샘플을 제작하였다. 합성의 확인을 위하여 ¹H-NMR과 FT-IR을 사용하였고, DSC와 POM을 이용하여 DGETAM의 액정성을 확인하고, LFA를 사용하여 샘플의 열전도도를 측정하였다. 활성화 에너지는 TGA를 사용하여 등온 열분해를 진행해 측정한 데이터를 토대로 Arrhenius 식을 사용하여 구하였다. 에폭시 필름의 열전도도를 측정한 결과 DDE를 사용하였을 때, 더 높은 열전도도를 나타내었고, 5% 분해시 BPH를 사용한 필름과 유사한 활성화 에너지를 나타내는 것으로 보아, 열전도도가 열적 안정성에 영향을 미치는 것을 확인할 수 있었다.

• Journal of the Korean Wood Science and Technology
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• 제30권2호
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• pp.115-120
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• 2002

MDF를 페놀수지에 함침한 후 500, 650, 800, 1,000℃에서 소성하여 우드세라믹을 제조한 후 함침재 및 우드세라믹의 치수 변화와 휨강도를 측정하였다. 수지 함침율이 증가할수록 함침재의 치수 증가율 및 휨강도는 증가하였다. 소성온도에 따른 중량, 길이 및 두께감소율은 각각 소성온도 500℃일 때 59.9%, 19.4%, 26.3%이었으며, 소성온도 1,000℃일 때 65.3%, 22.5%, 31.6%로 소성온도가 증가함에 따라 증가하였으며, 휨강도 또한 함침율 40%일 때 소성온도 500℃에서 50.3 kgf/cm³, 800℃에서 0.79 g/cm³로 증가하였으나, 1,000℃에서는 0.75 g/cm³로 약간 감소하였다. 이상의 결과로 함침재 및 우드세라믹의 성질은 수지 함침율 및 소성온도의 영향을 받음을 알 수 있었다.