• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.5
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• pp.1228-1234
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• 2015

In this paper, a fuzzy controller using thermoelectric for temperature environmental tester is developed. The new structure of fuzzy controller based temperature environmental tester is proposed and implemented to maintain a stable temperature and improve temperature change speed. In order to evaluate the efficiency, an experiment is setup to compare PID controller with our proposed controller. The experimental results, we proved that our proposed fuzzy controller has better performance than PID controller.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.197-202
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• 2007

In this study, the cooling characteristics of a liquid cooler using thermoelectric module was experimentally investigated. The experiment was conducted for various inner structures of liquid cooler (4 cases), hot fluid flow rates (0.15-0.25 L/min), number of T.E module (2, 4, 6 set), and the cooling water flow rates (200-600 cc/min) for both parallel and counter flow types. Among the results, better cooling performance geometry was selected. And experiment was also carried out to examine further enhancement of cooling performance by inserting coils (pitches: 0.2, 3, 6 mm) into the hot-fluid channel. Present results showed that the short serpentine type(case2) indicated the best cooling performance. In the case of coil pitch of 3 mm, the best cooling performance was shown, more than 10% increase of the inlet and outlet temperature difference, compared with the case of the cooler without coil. Consequently, the inserted coil pitch should be properly selected to improve cooling performance.

• Journal of Fisheries and Marine Sciences Education
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• v.16 no.2
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.