• 한국정보통신학회논문지
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• 제19권5호
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• pp.1228-1234
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• 2015

본 논문에서는 열전소자를 이용한 온도 환경 시험기에 적용할 수 있는 퍼지제어기를 개발하였다. 온도환경 시험기에 퍼지제어기를 구현하기 위해 마이컴기반의 온도제어시스템을 제작하였다. 안정적인 온도 유지 및 온도 변화 속도를 향상시키기 위하여 퍼지제어기를 내장한 온도환경 시험기를 개발하였다. 제안한 방법의 유용성을 입증하기 위하여, 일반적으로 널리 사용되고 있는 비례-적분-미분 제어기와 비교하였다. 실험결과 제안한 퍼지제어기가 기존의 비례-적분-미분 제어기보다 상승시간, 오버슈트 면에서 좋은 제어성능을 보임을 알 수 있었다.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2007년도 동계학술발표대회 논문집
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• pp.197-202
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• 2007

In this study, the cooling characteristics of a liquid cooler using thermoelectric module was experimentally investigated. The experiment was conducted for various inner structures of liquid cooler (4 cases), hot fluid flow rates (0.15-0.25 L/min), number of T.E module (2, 4, 6 set), and the cooling water flow rates (200-600 cc/min) for both parallel and counter flow types. Among the results, better cooling performance geometry was selected. And experiment was also carried out to examine further enhancement of cooling performance by inserting coils (pitches: 0.2, 3, 6 mm) into the hot-fluid channel. Present results showed that the short serpentine type(case2) indicated the best cooling performance. In the case of coil pitch of 3 mm, the best cooling performance was shown, more than 10% increase of the inlet and outlet temperature difference, compared with the case of the cooler without coil. Consequently, the inserted coil pitch should be properly selected to improve cooling performance.

• 수산해양교육연구
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• 제16권2호
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.