• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.764-767
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• 2004

This paper present the temperature control of aluminum plate using Peltier element. Peltier effect is heat pumping phenomena by electric energy as one of the thermoelectric effect. So if current is asserted to Peltier element, it absorbs heat from low temperature side and emits to high temperature side. In this experiment, Peltier element is used to control the temperature of small aluminum plate with ON/OFF control scheme and fan ON/OFF. As the result of experiments, it is proper to act fan only while cooling duration and there exist a proper cooling current to drop temperature rapidly. It takes about 100sec to increase to 7$0^{\circ}C$ and drop to 35$^{\circ}C$ of aluminium plate temperature and about 90sec to increase to 7$0^{\circ}C$ and drop to 4$0^{\circ}C$ in ambient temperature 3$0^{\circ}C$ while fan is on only in cooling duration. Future aim is to realize more rapid temperature control and develop SMHA(special metal hydride actuator) by using Peltier element to heating and cooling.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1400-1404
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• 2005

This paper presents the temperature control of aluminum plate by using Peltier element. Peltier effect is heat pumping phenomena by electric energy as one of the thermoelectric effect. So if current is charged to Peltier element, it absorbs heat from low temperature side and emits heat to high temperature side. In this experiment, Peltier element is used to control the temperature of small aluminum plate with current control and operating cooling fan only while cooling duration. Operating cooling fan only while cooling duration is proper to get more rapid heating and cooling duration. As a result of experiment, it takes about 100sec period to repeating temperature between $35^{\circ}C$ and $70^{\circ}C$ and about 80sec from $40^{\circ}C$ to $70^{\circ}C$ in ambient air temperature $25^{\circ}C$ and while operating cooling fan only in cooling duration. Future aim is to apply this temperature control method in actuating SMHA(special metal hydride actuator) which is applicable in Siver project acting in low frequency range by using Peltier element for heating and cooling.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.139-144
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• 2005

A rigorous research is underway in our team, for the design and development of high figure of merits (ZT= 1.5${\sim}$2.0) micro-thermoelectric coolers. This paper discusses the fabrication process that we are using for developing the $Sb_2Te_3-Bi_2Te_3$ micro-thermoelectric cooling modules. It describes how to obtain the mechanical properties of the thin film TEC elements and reports the results of an equation-based multiphysics modeling of the micro-TEC modules. In this study the thermoelectric thin films were deposited on Si substrates using co-sputtering method. The physical mechanical properties of the prepared films were measured by nanoindentation testing method while the thermal and electrical properties required for modeling were obtained from existing literature. A finite element model was developed using an equation-based multiphysics modeling by the commercial finite element code FEMLAB. The model was solved for different operating conditions. The temperature and the stress distributions in the P and N elements of the TEC as well as in the metal connector were obtained. The temperature distributions of the system obtained from simulation results showed good agreement with the analytical results existing in literature. In addition, it was found that the maximum stress in the system occurs at the bonding part of the TEC i.e. between the metal connectors and TE elements of the module.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.12
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• pp.8350-8356
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• 2015

The demand for user convenient devices in automotive applications are fast growing, mainly driven by the customer's requirement for higher efficiency and more features. In important such feature is the cold module for cars, which are convenient luxuries that warm or cool drinks placed in the cup holder by means of a thermoelectric element. In present study, we would like to find out the optimal thickness of the cup holder and mounting position of the thermoelectric element through experiments under various testing conditions and thermal analysis. The resulting thermal distribution of the primary area of thermal analysis was found to be lowest when the thickness was 2.5 mm. The temperature distribution was also lowest when the thermal element was positioned underneath the holder (A-type).

• Advances in aircraft and spacecraft science
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• v.5 no.6
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• pp.633-652
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• 2018

The present paper focuses on the development of a model for simulating the thermoelectric behavior of CNTs/CFRP Organic Matrix Composite (OMC) laminates for aeronautical applications. The model is developed within the framework of the thermodynamics of irreversible processes and implemented into commercial ABAQUS Finite Element software and validated by comparison with experimental thermoelectric tests on two types of composites materials, namely Type A with Carbon Nanotubes (CNT) and Type B without CNT. A simplified model, neglecting heat conduction, is also developed for simplifying the identification process. The model is then applied for FEM numerical simulation of the thermoelectric response of aircraft panel structures subjected to electrical loads, in order to discuss the potential danger coming from electrical solicitations. The structural simulations are performed on quasi-isotropic stacking sequences (QI) $[45/-45/90/0]_s$ using composite materials of type A and type B and compared with those obtained on plates made of metallic material (aluminum). For both tested cases-transit of electric current of intermediate intensity (9A) and electrical loading on panels made of composite material-higher heating intensity is observed in composites materials with respect to the corresponding metallic ones.

• Proceedings of the Korean Magnestics Society Conference
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• 2013.05a
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• pp.19-20
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• 2013

Thermoelectic properties of the typical thermoelectric host materials, the tellurides and selenides, are known to be noticeably changed by their volume change due to the strain [1]. In the bismuth telluride ($Bi_2Te_3$) crystal, a substitution of rare-earth element by replacing one of the Bi atoms may cause the change of the lattice parameters while remaining the rhombohedral structure of the host material. Using the first-principles approach by the precise full potential linearized augmented plane wave (FLAPW) method [2], we investigated the Ce substitution effect on the thermoelectric transport coefficients for the bismuth telluride, employing Boltzmann's equation in a constant relaxation-time approach fed with the FLAPW wave-functions within the rigid band approximation. Depending on the real process of re-arrangement of atoms in the cell to reach the equilibrium state, $CeBiTe_3$ was found to manifest a metal or a narrow bandgap semiconductor. This feature along with the strong correlation effect originated by the 4f states of Ce affect significantly on the thermoelectric properties. We showed that the position of the strongly localized f-states in energy scale (Fig. 1, f-states are shaded) was found to alter critically the transport properties in this material suggesting an opportunity to improve the thermoelectric efficiency by tuning the external strain which may changing the location of the f-sates.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.8
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• pp.764-771
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• 2005

A theoretical investigation for optimization of conduction-cooled Peltier current leads is undertaken. A Pottier current lead (PCL) is composed of a thermoelectric element (TE), a metallic lead and a high Tc superconductor (HTS) lead in the order of decreasing thermoelectric tempera ture. Mathematical expression for the minimum heat flow per unit current crossing the TE metal interface and that flowing from the metal lead to the joint of the metal and the HTS leads are obtained. It is shown that the temperature at the TE-metal interface possesses a unique optimal value that minimizes the heat flow to the joint and that this optimal value depends on the material properties of the 73 and the metallic lead but not the joint temperature nor electric current. It is also shown that there exists a unique optimal value for the joint temperature between the metal and the HTS leads that minimizes the sum of the power dissipated by ohmic heating in current leads and the refrigerator power consumed to cool the lead, for a given length of the HTS.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1081-1082
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• 2011

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.79-80
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• 2006

From a viewpoint of heat stress at high temperatures and contact thermal resistance, it is confirmed that the optimal structure is the skeleton structure using Cu substrate on the cooling side, which has excellent heat conductivity and the optimal installation method is to adopt a carbon sheet and a mica sheet to the high temperature side, where Si grease is applied to the low temperature side, under pressurized condition. The power of the developed modules indicated 0.5W in an $FeSi_2$ module and 3.8 W with a SiGe module at 823K, respectively.

• Vacuum Magazine
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• v.1 no.4
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• pp.21-24
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• 2014

Thermolectric devices could convert temperature gradient into electricity (Seebeck effect) and electric power into temperature gradient across the themoelectric element (Peltier effect). $Bi_2Te_3$ has been widely used as thermoelectric material for more than 40 years, due to the superior thermoelctric characteristics. However, Bi and Te materials are predicted to face supply shortage, giving strong necessity for the development of new thermoelctric materials. Based on the theoretical prediction, nanostructure are expected to give dramatic enhnacement of thermoelectirc characteristics by controlling phonon propagation. Thus, silicon, which had been considered as improper material for thermoelectricity, is now being considered as strong cadidate material for thermoelectricity. This review will focus on the nanotechnology applied research activities in silicon as thermoelectric materials.