• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.17-28
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• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.

• Transactions of Materials Processing
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• v.14 no.4 s.76
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• pp.384-391
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• 2005

The nickel-based alloy Nimonic 80A possesses the excellent strength, and the resistance against corrosion, creep and oxidation at high temperature. Its products are used in aerospace engineering, marine engineering and power generation, etc. Control of forging parameters such as strain, strain rate, temperature and holding time is important because change of the microstructure in hot working affects the mechanical properties. Change of the microstructure evolves by recovery, recrystallization and grain growth phenomena. The dynamic recrystallization evolution has been studied in the temperature range of $950\~1250^{\circ}C$ and strain rate range of $0.05\~5s^{-1}$ using hot compression tests. The metadynamic recrystallization and grain growth evolution has been studied in the temperature range of $950\~1250^{\circ}C$ and strain rate range $0.05,\;5s^{-1}$, holding time range of 5, 10, 100, 600 sec using hot compression tests. Modeling equations are proposed to represent the flow curve, recrystallized grain size, recrystallized fraction and grain growth phenomena by various tests. Parameters in modeling equations are expressed as a function of the Zener-Hollomon parameter. The modeling equation for grain growth is expressed as a function of the initial grain size and holding time. The modeling equations developed were combined with thermo-viscoplastic finite element modeling to predict the microstructure change evolution during hot forging process. The grain size predicted from FE simulation results is compared with results obtained in field product.

• Journal of Advanced Marine Engineering and Technology
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• v.29 no.8
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• pp.938-945
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• 2005

The microstructure evolution in hot forging process is composed of dynamic recrystallization during deformation as well as grain growth during dwell time. Therefore, the control of forging parameters such as strain, strain rate. temperature and holding time is important because the microstructure change in hot working affects the mechanical properties. Modeling equations are developed to represent the flow curve. grain size. recrystallized volume fraction and grain growth phenomena by various tests. The developed modeling equations were combined with thermo-viscoplastic finite element modeling to predict the microstructure change evolution during hot forging process. The large exhaust valve spindle (head diameter of 512mm) was simulated by closed die forging with hydraulic press and cooled in air after forging. The preform was heated to each 1080 and 1150$^{\circ}C$. Numerical calculation was performed by DEFORM-2D. a commercial finite element code. Heat transfer can be coupled with the deformation analysis in a non-isothermal deformation analysis. In order to obtain the fine and homogeneous microstructure and good mechanical properties in forging. the FEM would become a useful tool in the simulation of the microstructure development. In forging, appropriate temperature, strain and strain rate and rapid cooling are required to obtain the fine grain microstructure The optimal forging temperature and effective strain range of Nimonic 80A for large exhaust valve spindle are about 1080$\∼$l120$^{\circ}C$ and 150$\∼$200$\%$.