• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.6 s.261
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• pp.718-724
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• 2007

Some of gas turbine model of 7F-Class has constructed and is operating with units domestically. Non-destructive testing (NDT) is one of the methods being used to inspect damage $1^{st}$ stage bucket and review damage trends. We also analyze damage configuration and microstructure according to material and compare with pape of electric power research institute (EPRI). The damaged mode could be determined by leveraging failure analysis. Especially, configuration uprate of bucket is not only to prevent damage during operation but also avoid domestic manufacturing by the competitors. Modifications were mainly concentrated on surfaces such as cooling hole and bucket tips. Analyzing of bucket damage, the earlier model of 7F-Class used with one cycle with equivalent operation hour (EOH), has various cracking of the bucket surface. Bucket damage of new model is centered on tip area (54%) as analyzed by EPRI research. We conclude that improving bucket configuration would increase repair rate on the bucket tip.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.06a
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• pp.3-8
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• 2006

The integrity of laser welded structures is decided with fracture strength and fatigue strength. This study presents fracture behavior considering residual stress in the laser welding. Experiments are conducted and analyses are performed to explore the influence of residual stress on fracture behavior of bead-on laser welded compact specimen. Fracture experiments are performed using ASTM 1820. The performed analyses included thermo-elasto-plastic analyses for residual stress and subsequent J-integral calculation. A modified J integral is calculated in the presence of residual stresses. The J-integral is path-independent for combination of residual stress field and stress due to mechanical loading. The results indicates that the tensile residual stress near crack front bring the low fracture load while the compressive residual stress bring the high fracture load compared to no residual stress specimen. These results quantitatively understand the influence of residual stress on fracture behavior.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.10
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• pp.1185-1191
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• 2014

Gas turbine blades that have complex geometry of the cooling holes and cooling passages are usually subjected to cyclic and sustained thermal loads due to changes in the operating characteristic in combined power plants; these results in non-uniform temperature and stress distributions according to time to gas turbine blades. Those operation conditions cause creep or thermo-mechanical fatigue damage and reduce the lifetime of gas turbine blades. Thus, an accurate analysis of the stresses caused by various loading conditions is required to ensure the integrity and to ensure an accurate life assessment of the components of a gas turbine. It is well known that computational analysis such as cross-linking process including CFD, heat transfer and stress analysis is used as an alternative to demonstration test. In this paper, temperatures and stresses of gas turbine blade were calculated with fluid-structural analysis integrating fluid-thermal-solid analysis methodologies by considering actual operation conditions. Based on analysis results, additionally, the total lifetime was obtained using creep and thermo-mechanical damage model.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.39 no.10
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• pp.952-958
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• 2011

On-board IR calibration device has been developed for calibration of spaceborne image sensor. It is composed of a blackbody to provide two different radiance temperatures, tilt mirror with a function of stow and deploy to view the blackbody during the calibration and on-board calibration control unit to control the function of the blackbody and tilt mirror. In this paper, to guarantee the structural safety of the unit, the structural and thermal analysis including a thermo-elastic analysis for verifying structural safety on the soldered part of chips have been performed. In addition, safety margin of the chips on the PCB obtained from the conventional analytical method has been compared to the results from the FEM analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.361-361
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• 2009

KEPCO High Temperature Superconducting (HTS) cable system rated with $3\Phi$, 22.9kV, 1250A was laid in 2006, and the long term test is in progress. The HTS cable system with the cooling system has been operated below cryogenic temperature. That environment exposes the system to the thermo-mechanical stress due to the significant temperature difference, and the cooling system has moving parts for the forced circulation of the coolant. Therefore the HTS cable system experiences thermal fatigue and moving part such as liquid nitrogen pump need a regular replacement every 5000 hours Building the assessment criterion, the maintenance procedure was established and regular preventive maintenance was done; improvement of the termination structure and the replacement of the bearing of liquid nitrogen pump. Following the proper process, the reliability assessment test including He leakage detection and the stability of flow rate was performed. This paper describes the process and result of the first regular maintenance of KEPCO HTS cable system

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.7
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• pp.60-66
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• 2020

In order to improve fatigue life of transmission gear carburizing is normally used. Carburizing is a very good process to achieve low cost and high performance. The machined gears are heated up to carburizing temperature and then cooled rapidly in an oil bath to produce high surface hardness. The gears may undergo excessive thermal distortion during heating and rapid cooling. In order to predict the distortion during heating and rapid cooling, a coupled thermo-mechanical simulation is needed. In the current research, the simulation of heating and cooling was performed. The results show that the thermal distortion and the residual stresses are well predicted by the coupled simulation. In addition, induction heating and rapid cooling simulation is carried out to predict the thermal distortion. The amount of distortion is compared. It is shown that induction heating is very effective to reduce thermal distortion.