• 한국추진공학회지
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• 제10권4호
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• pp.47-53
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• 2006

본 논문에서는 탄소-페놀 복합재로 제조된 로켓 노즐 내열부품의 고온에서의 거동을 3차원 축대칭 유한요소 모델을 사용하여 해석하였다. 실제 작동 조건을 사용하여 카울 영역의 적층링을 해석한 결과 층각도, 축방향 치수, 경계조건은 적층링 내부의 응력 분포에 큰 영향을 주는 것으로 확인되었다. 특히 링과 링 사이의 접합부분에서 모서리 탈락 현상의 전조 현상인 층간분리가 발생한다. 분리현상 이후에는 층각도 방향 전단응력과 축방향 압축응력에 의해 탈락 현상이 발생하는 것으로 판단된다.

• 한국전산유체공학회지
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• 제18권2호
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• pp.17-25
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• 2013

The process of flow through porous media is of interest a wide range of engineering fields and areas, and the importance of fluid flow with a change in phase arises from the fact that many industrial processes rely on these phenomena for materials process, energy transfer. Especially, the flow phenomena of cryogenic liquid subjected to evaporation is of interest to investigate how the cryogenic liquid behaves in the porous structure. In this study, thermo physical properties, morphological properties of the glass wool with different bulk densities in terms of its temperature-dependence and permeability behaviors under different applying pressure are discussed. Using the experimentally determined properties, characteristics of two main experimental results are investigated. In addition, simulation results are used to realize the cryogenic liquid's flow in porous media, and are compared with experimental results. By using the experimentally determined properties, more reasonable results can be suggested in dealing with porous media flow.

• Steel and Composite Structures
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• 제27권3호
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• pp.311-325
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• 2018

This article presents the bending analysis of FGM rectangular plates resting on non-uniform elastic foundations in thermal environment. Theoretical formulations are based on a recently developed refined shear deformation theory. The displacement field of the present theory is chosen based on nonlinear variations in the in-plane displacements through the thickness of the plate. The present theory satisfies the free transverse shear stress conditions on the top and bottom surfaces of the plate without using shear correction factor. Unlike the conventional trigonometric shear deformation theory, the present refined shear deformation theory contains only four unknowns as against five in case of other shear deformation theories. The material properties of the functionally graded plates are assumed to vary continuously through the thickness, according to a simple power law distribution of the volume fraction of the constituents. The elastic foundation is modeled as non-uniform foundation. The results of the shear deformation theories are compared together. Numerical examples cover the effects of the gradient index, plate aspect ratio, side-to-thickness ratio and elastic foundation parameters on the thermo-mechanical behavior of functionally graded plates. Numerical results show that the present theory can archive accuracy comparable to the existing higher order shear deformation theories that contain more number of unknowns.

• Journal of Power Electronics
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• 제16권5호
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• pp.1843-1850
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• 2016

This study focused on predicting the fatigue life of an insulated gate bipolar transistor (IGBT) power module for electric locomotives. The effects of different wiring technologies, including aluminum wires, copper wires, aluminum ribbons, and copper ribbons, on solder fatigue life were investigated to meet the high power requirement of the IGBT module. The module's temperature distribution and solder fatigue behavior were investigated through coupled electro-thermo-mechanical analysis based on the finite element method. The ribbons attained a chip junction temperature that was 30℃ lower than that attained with conventional round wires. The ribbons also exhibited a lower plastic strain in comparison with the wires. However, the difference in plastic strain and junction temperature among the different ribbon materials was relatively small. The ribbons also exhibited different crack propagation behaviors relative to the wires. For the wires, the cracks initiated at the outmost edge of the solder, whereas for the ribbons, the cracks grew in the solder layer beneath the ribbons. Comparison of fatigue failure areas indicated that ribbon bonding technology could substantially enhance the fatigue life of IGBT modules and be a potential candidate for high power modules.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.60-60
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• 2009

본 연구는 보론이 첨가된 저합금강 용접 열영향부에서의 보론 편석 거동 연구를 위해 보론이 10ppm 첨가된 저합금강을 이용하여 다양한 용접 입열량 및 외부 응력에 따른 용접부 CGHAZ의 보론 편석거동을 분석하였다. 이를 위해 Gleeble 시스템을 이용하여 다양한 입열량에 따른 CGHAZ를 열 및 열-응력 사이클을 통하여 재현하였다. 재현된 시편의 미세조직은 OM을 통하여 분석하고, 보론의 편석거동을 SIMS와 PTA 분석법을 통하여 분석하였다. 그 결과 입열량에 따른 보론의 편석 거동은 최초 입열량이 증가함에 따라 보론의 편석이 증가하다가 다시 감소하였는데 이는 비평형 편석 후 고온에서 유지시간이 길어짐에 따라 back diffusion 발생에 따른 영향으로 판단된다. 또한 외부 응력에 의한 보론 편석 거동 분석 결과, 용접 열 사이클 중 작용하는 외부 응력에 의해 결정립계 편석 감소하였는데 이는 외부 응력에 의한 오스테나이트 결정립 크기 감소에 따른 결정립계 증가의 영향으로 판단된다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.231-234
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• 2005

The high temperature deformation behavior of AZ 31 Mg alloy was investigated by designing a back propagation neural network that uses a gradient descent-learning algorithm. A neural network modeling is an intelligent technique that can solve non-linear and complex problems by learning from the samples. Therefore, some experimental data have been firstly obtained from continuous compression tests performed on a thermo-mechanical simulator over a range of temperatures $(250-500^{\circ}C)$ with strain rates of $0.0001-100s^{-1}$ and true strains of 0.1 to 0.6. The inputs for neural network model are strain, strain rate, and temperature and the output is flow stress. It was found that the trained model could well predict the flow stress for some experimental data that have not been used in the training. Workability of a material can be evaluated by means of power dissipation map with respect to strain, strain rate and temperature. Power dissipation map was constructed using the flow stress predicted from the neural network model at finer Intervals of strain, strain rates and subsequently processing maps were developed for hot working processes for AZ 31 Mg alloy. The safe domains of hot working of AZ 31 Mg alloy were identified and validated through microstructural investigations.

• 한국태양에너지학회 논문집
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• 제34권1호
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• pp.48-57
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• 2014

The transient and synchronization behaviors of a TA (thermo acoustic) laser pair were investigated experimentally for various crossing angles and different separation distances between the laser openings. Sound waves generated by the lasers were measured and analyzed at or near the focusing point by means of microphones, SPL meters, and a commercial software called Signal-Express. The two TA lasers were acoustically coupled through the air mass between their openings, and the only mode-locking operation that could be achieved was the one that was nearly $180^{\circ}C$ out of phase. The time to achieve synchronization was found to be dependent upon the initial mistuning of the frequencies and the crossing angle between the laser axes. The synchronization process could also be accelerated by turning on the laser with the lower power input first.

• Steel and Composite Structures
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• 제50권6호
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• pp.609-625
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• 2024

This paper presents an in-depth analysis of the nonlinear vibration of microbeams, with a particular emphasis on their application in sports monitoring systems. The research utilizes classical beam theory, modified couple stress theory, and von-Kármán nonlinear parameters to explore the behavior of microbeams. These microbeams are characterized by a non-uniform geometry, with materials that continuously change along the beam radius and a thickness that varies along the beam length. The main contribution lies in its exploration of the stability of smart sensors in sports structures, particularly those with non-uniform geometries. The research findings indicate that these non-uniform microbeams, when used in smart systems made of functionally graded temperature-dependent materials, can operate effectively in thermal environments. The smart system developed in this study demonstrates significant potential for use in sports applications, particularly in monitoring and gathering information. The insights gained from this research contribute to the understanding of the performance and optimization of microbeams in sports applications, particularly in the context of non-uniform geometries. This research, therefore, provides a foundation for the development of advanced, reliable, and efficient monitoring systems in sports applications.

• 한국전산구조공학회논문집
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• 제21권1호
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• pp.35-42
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• 2008

원자력발전소에서는 열교환 파이프에서 발생하는 열피로 균열을 비파괴 탐상장비를 이용하여 조기에 발견하는 것이 안전을 위해 매우 필요하며, 따라서 이를 모사한 인공균열시편 제작에 많은 노력을 기울이고 있다. 그러나 이러한 균열은 일반 기계가공으로 제작하는 것이 불가능하여 실제 조건과 유사한 열 반복하중 하에서 제작될 수밖에 없는데, 이를 위해 많은 시간이 소요된다. 본 연구에서는 크랙성장 시뮬레이션 기법을 이용하여 이러한 균열 제작시간을 단축하기 위한 최적의 열하중 조건을 찾고자 하였다. 이를 위해 임의조건에서 시뮬레이션 및 열피로균열 발생 기초실험을 수행하여 균열 초기수명과 진전수명을 검증하였고, 이를 바탕으로 다양한 가열 및 냉각시간을 시뮬레이션 함으로써 제작시간을 최소화하는 열하중 조건을 구하였다. 시뮬레이션에서는 응력해석을 위해 상용 소프트웨어 ANSYS를 초기균열수명 계산을 위해 수치계산용 소프트웨어 ZENCRACK을 이용하여 코딩을 균열진전수명 평가를 위해 ZENCRACK 소프트웨어를 이용하였다. 그 결과 1mm 균열 제작에 소요되는 시간은 초기의 418시간에서 319시간으로 24% 단축되는 것으로 예측되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.