• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.334-337
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• 2002

The Quantum Hall Resistance(QHR) device which consists of GaAs/AlGaAs heterojunction structure is used for the realization of QHR Standard based on QHE. In order to characterize electrical contact resistances and dissipations of the device, it is slowly cooled down for eliminating thermal shock and unwanted noise. Then, the two properties are measured under 1.5 K and 5.15 T. Contact resistances are all within 1.2 Ω and longitudinal resistivities are all within 1 mΩ up to DC 90${\mu}$A. The results mean the device is operated well to realize the QHR Standard. To confirm it, the QHR Standard having the device is compared using a direct current comparator bridge with a 1 Ω resistance standard which the calibrated value is known from QHR standards maintained by other countries. The difference between them is agreed well within measurement uncertainty. It is thus considered that the properties of the device is estimated well and has good performance.

• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.237.2-237.2
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• 2016

A pure hafnium-carbide (HfC) coating layer was deposited onto carbon/carbon (C.C) composites using a vacuum plasma spray system. By adopting a SiC buffer layer, we successfully integrated C.C composites with a $100-{\mu}m-thick$ protective coating layer of HfC. Compared to the conventional chemical vapor deposition process, the HfC coating process by VPS showed increased growth rate, thickness, and hardness. The growth behavior and morphology of HfC coatings were investigated by FE-SEM, EDX, and XRD. From these results, it was shown that the addition of a SiC intermediate layer provided optimal surface conditions during the VPS procedure to enhance adhesion between C.C and HfC (without delamination). The thermal ablation test results shows that the HfC coating layer perfectly protected inner C.C layer from thermal ablation and oxidation. Consequently, we expect that this ultra-high temperature ceramic coating method, and the subsequent microstructure that it creates, can be widely applied to improve the thermal shock and oxidation resistance of materials under ultra-high temperature environments.

• 한국태양에너지학회:학술대회논문집
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• 2011.04a
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• pp.275-281
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• 2011

Solar reforming of methane with $CO_2$ was successfully tested with a direct irradiated absorber on a parabolic dish capable of $5kW_{th}$ solar power. The new type of catalytically activated metallic foam absorber was prepared, and its activity was tested. Ni was applied as the active metal on the gamma - alumina coated Ni metal foam for the preparation of the catalytically-activated metal foam layer. Compared to conventional direct irradiation of the catalytically-activated ceramic foam absorber, this new metallic foam absorber is found to exhibit a superior reaction performance at the relatively low insolation or at low temperatures. In addition, unlike direct irradiation of the catalytically-activated ceramic foam absorber, metallic foam absorber has better thermal resistance, which prevents the emergence of cracks caused by mechanical or thermal shock. The total solar power absorbed reached up to 2.1kW and the maximum $CH_4$ conversion was almost 40%.

• Carbon letters
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• v.4 no.1
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• pp.36-39
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• 2003

Carbon and carbon-based materials are used in nuclear reactors and there has recently been growing interest to develop graphite and carbon based materials for high temperature nuclear and fusion reactors. Efforts are underway to develop high density carbon materials as well as amorphous isotropic carbon for the application in thermal reactors. There has been research on coated nuclear fuel for high temperature reactor and research and development on coated fuels are now focused on fuel particles with high endurance during normal lifetime of the reactor. Since graphite as a moderator as well as structural material in high temperature reactors is one of the most favored choices, it is now felt to develop high density isotropic graphite with suitable coating for safe application of carbon based materials even in oxidizing or water vapor environment. Carboncarbon composite materials compared to conventional graphite materials are now being looked into as the promising materials for the fusion reactor due their ability to have high thermal conductivity and high thermal shock resistance. This paper deals with the application of carbon materials on various nuclear reactors related issues and addresses the current need for focused research on novel carbon materials for future new generation nuclear reactors.

• The Korean Journal of Pharmacology
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• v.31 no.3
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• pp.323-331
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• 1995

Monocyte/macrophage infiltration is the well known initial features associated with the development of glomerular disease including non-immune mediated nephropathy. Tumor necrosis factor ${\alpha}(TNF{\alpha})$, a cytokine produced primarily by monocyte/macrophage, exhibits similar effects as observed at the initial stages and during the progression of glomerular injury. Because the mesangial cells are target cells for glomerular injury, the present study examined the effect of $TNF{\alpha}$ on glomerular mesangial cell membrane lipid peroxidation as an index of cytotoxicity attributing to $TNF{\alpha}$. Primary culture of rat mesangial cell was established by incubation of glomeruli isolated from male Sprague-Dawley rat kidneys utilizing a standard sieving method. The levels of lipid peroxides in the mesangial cells were quantitated by malondialdehyde- thiobarbituric acid adduct formation. During an 8 hour incubation at $37^{\circ}C$, $TNF{\alpha}$ at 10 to 10,000 units/ml increased the levels of lipid peroxides dose dependently. Western blot analysis demonstrated that a short thermal stress induced heat shock response and the synthesis of heat shock protein 70(hsp70) in this mesangial cells. Further, this induction of hsp 70 prevented increase of lipid peroxides in the mesangial cells exposed to $TNF{\alpha}$. These data suggest that $TNF{\alpha}-induced$ lipid peroxidation in the mesangial cells may have pathophysiological relevance to glomerular injury and prior induction of heat shock response may play a role in the cellular resistance against $TNF{\alpha}-induced$ glomerular injury.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

• Journal of the Korean Ceramic Society
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• v.32 no.2
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• pp.171-182
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• 1995

Five eucryptite and ten spodumene compositional powders were syntehsized from three sillimanite group, two kaolin group, and five pyrophyllite group silicate minerals. Those powders were isotatically pressed and fired at 1200~135$0^{\circ}C$ for 2 hrs, and then the sintered bodies were characterized. Silicate minerals with molar ratio of Al2O3 to SiO2 correspond to those of eucryptite and spodumene are kaolin and pyrophyllite group silicate minerals, respectively. Sintering characteristics of eucryptite from kaolin group and spodumene from pyrophyllite group mineral were superior to those from other silicate minerals. Eucryptite sintered bodies with 95~97% relative densities and densified microstructures can be obtained using Hadong pink kaolin as starting materials by sintering over broad temperature zone(1250~135$0^{\circ}C$). The eucryptite sintered bodies which were fired at 130$0^{\circ}C$ for 2hrs, from Hadong pink kaolin had within 3.0wt% microstructural compositional variations compaired with stoichiometric compound, and had good negative thermal expansiion property with -3.55$\times$10-6/$^{\circ}C$ thermal expansion coefficient. Spodumene sintered bodies which were prepared from pyrophyllite group silicate minerals, had dense microstructures and high densities by densification through liquid phase sintering with enlarged temperature range. The specimens which were fired at 130$0^{\circ}C$ for 2 hrs from Gusipyrophillite, had dense microstructure with crystallines mainly, and low thermal expansion property with 0.62$\times$10-6/$^{\circ}C$ thermal expansion coefficient. The porous texture and residual glass phase in LAS system ceramics which were prepared from silicate minerals, tend to increase the thermal expansion properties of sintered bodies to positive direction.

• Journal of the Korean Ceramic Society
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• v.38 no.11
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• pp.987-992
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• 2001

A refractory grade low-cost silicon nitride powder was chemically analyzed, purified, and gas pressure sintered with the sintering additives. As-received powder contained a significant amount of free-Si, 0.72 wt% of Fe, 0.5 wt% of al and 0.31 wt% of Ca. Oxygen and carbon contents of the powder were 3.3 wt% and 0.4 wt%, respectively, and it consisted of 96% of $\beta$-phase and 4% of $\alpha$-phase. After lowering the Fe content and nitriding treatment, the powder was sintered with 6 wt% yttria and 2 wt% alumina for 1 h between 1823 K and 2123 K in order to examine the sintering behavior. Fully dense samples were obtained by sintering at 2123k for 2h. For comparison, a commercially available high-grade powder was also sintered at the same time. The low-cost powder showed much slower densification rate than the high-grade powder. Fully dense sample prepared from the low-cost powder contained a number of coarse grains with a low aspect ratio, and its hardness, fracture toughness, flexural strength and thermal shock resistance were not as good as those of the sample prepared with the high-grade powder.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.41-48
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• 1999

Silica is the most popular materials as a filler of EMC for microelectronic packaging. However, because of its low thermal conductivity, the use of silica is restricted to parts requiring high thermal dissipation. The superior fluidity of EMC can be achieved with a combination of filler size distribution. In this study, physical properties of EMC filled with the crystalline silica(13$\mu\textrm{m}$) which have high fluidity and low cost and the AlN(2 $\mu\textrm{m}$) which have high thermal conductivity and low coefficient of thermal expansion were evaluated by changing the AlN/silica ratios. As a result of the evaluation of physical properties of EMC, the optimum mixing ratio of AlN/crystalline silica was 0.3/0.7. In this condition, binary mixture(AlN/crystalline silica) filled EMC showed superior properties, i.e., in the thermal conductivity, CTE, dielectric constant, flexural strength, and thermal shock resistance without reduction of fluidity.