• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.260-268
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• 2015

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{\circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.1
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• pp.25-32
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• 2005

Falling film heat transfer has been widely used in many applications in which heat and mass transfer occur simultaneously, such as evaporative coolers, cooling towers, absorption chillers, etc. In such cases, it is desirable that the falling film spreads widely on the surface forming thin liquid film to enlarge contact surface and to reduce the thermal resistance across the film and/or the flow resistance to the vapor stream over the film. In this work, the surface is treated to have thin porous layer on the surface. With this treatment, the liquid can be spread widely on the surface by the capillary force resulting from the porous structure. In addition to this, the liquid can be held within the porous structure to improve surface wettedness regardless of the surface inclination. The experiment on the evaporative cooling of an inclined surface has been conducted to verify the effectiveness of the surface treatment. It is measured that the evaporative heat transfer increases about $50\%$ by the porous layer treatment as compared with that from orignal bare surfaces.

• Journal of Fisheries and Marine Sciences Education
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• v.10 no.1
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• pp.69-78
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• 1998

Thermal sprayed Cu-Ni alloy coating on the carbon steel was carried out impingement erosion-corrosion test and electrochemical corrosion test in the marine environment. The impingement erosion-corrosion behavior and electrochemical corrosion characteristics of substrate(SS400) and thermal sprayed Cu-Ni coating was investigated, and the corrosion control efficiency of Cu-Ni coating to substrate was estimated quantitatively. Main results obtained are as follows : 1) The weight loss rate of Cu-Ni coating layer by the impingement erosion-corrosion compared with substrate was smaller in high specific resistance solution than in low specific resistance solution. 2) The corrosion potential of Cu-Ni coating layer spray coating in the marine environment became more noble than that of substrate. 3) With the lapse of time, corrosion current density of Cu-Ni coating layer became stable, but that of substrate was increased. 4) As the corrosion control efficiency of Cu-Ni coating layer in the marine environment was over 90%, its anti-corrosion characteristics was excellent.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.157-157
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• 2010

Vertical-structure light-emitting diodes (V-LEDs) by laser lift-off (LLO) have been exploited for high-efficiency GaN-based LEDs of solid-state lightings. In V-LEDs, emitted light from active regions is reflected-up from reflective ohmic contacts on p-GaN. Therefore, silver (Ag) is very suitable for reflective contacts due to its high reflectance (>95%) and surface plasmon coupling to visible light emissions. In addition, low contact resistivity has been obtained from Ag-based ohmic contacts annealed in oxygen ambient. However, annealing in oxygen ambient causes Ag to be oxidized and/or agglomerated, leading to degradation in both electrical and optical properties. Therefore, preventing Ag from oxidation and/or agglomeration is a key aspect for high-performance V-LEDs. In this work, we demonstrate the enhanced thermal stability of Ag-based Ohmic contact to p-GaN by reducing the thermal compressive stress. The thermal compressive stress due to the large difference in CTE between GaN ($5.6{\times}10^{-6}/^{\circ}C$) and Ag ($18.9{\times}10^{-6}/^{\circ}C$) accelerate the diffusion of Ag atoms, leading to Ag agglomeration. Therefore, by increasing the additional residual tensile stress in Ag film, the thermal compressive stress could be reduced, resulting in the enhancement of Ag agglomeration resistance. We employ the thin Ni layer in Ag film to form Ni/Ag mutli-layer structure, because the lattice constant of NiO ($4.176\;{\AA}$ is larger than that of Ag ($4.086\;{\AA}$). High-resolution symmetric and asymmetric X-ray diffraction was used to measure the in-plane strain of Ag films. Due to the expansion of lattice constant by oxidation of Ni into NiO layer, Ag layer in Ni/Ag multi-layer structure was tensilely strained after annealing. Based on experimental results, it could be concluded that the reduction of thermal compressive stress by additional tensile stress in Ag film plays a critical role to enhance the thermal stability of Ag-based Ohmic contact to p-GaN.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.191-191
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• 2009

In this paper, we have confirmed the temperature of LED chip and McPCB with thermal simulation program which is CFDedign V10 for analysis the thermal flow of HP LED package. we have known that the heat from LED chip is transferred through heat slug to copper layer of McPCB. the temperature of LED chip shows 85.11 [$^{\circ}C$], which shows the temperature gap of 7.52 [$^{\circ}C$] against McPCB. the gap of temperature affect reliability of the wire bonding and die attachment. therefore, copper layer of heat slug on the McPCB should designed with the largest dimension.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1210-1213
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• 2005

Micro heat flux sensor is used in various industries to measure heat flux. In this study, a micro heat flux sensor is fabricated using the MEMS (Micro Electro Mechanical Systems) techniques. The fabricated sensor is composed in thermopile for sensor and SU-8 for thermal resistance layer. The new method of fabrication SU-8 is proposed in this study. The sensitivity is $44\;\mu{V/(W/cm^2)}$ at steady state and Reynolds number is 91322.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1364-1369
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• 2004

New method for the design, fabrication, and calibration of micro-machined heat flux sensor has been developed. Two types of micro-machined heat flux sensor having different thicknesses of the thermal-resistance layer are fabricated using the MEMS technique. Photo-resist patterning using a chrome mask, bulk-etching and copper-nickel sputtering using a shadow mask are applied to make heat flux sensors, which are calibrated in the convection-type heat flux calibration facility. The sensitivity of the device varies with thermal-resistance layer, and hence can be used to measure the heat flux in heat-transfer phenomena.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.5
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• pp.366-371
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• 2012

In this paper, fabricated by MEMS uncooled micro-bolometer detector for the study in the infrared sensitivity enhancement. Absorption layer SiOx-Metal series MDTF (metal-dielectric thin film) by high absorption rate and has a high thermal coefficient of resistance, low noise characteristics were implemented. Then MDTF were made in a vacuum deposition method. And MDTF for the analysis of the physical properties of silicon wafers were fabricated, TCR (temperature coefficient of resistance) value was made in order to measure the glass wafer and FT-IR (Fourier Transform Infrared spectroscopy) values were made in order to measure the germanium window. The analyzed results of MDTF -3 [%/K] has more characteristics of the TCR. And 8~12 um wavelength region close to 70% in the absorption characteristic.

• Tribology and Lubricants
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• v.14 no.3
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• pp.1-6
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• 1998

An experimental study was performed to discover the effect of environmental conditions on the rolling resistance behavior of pure silver and lead coated 52100 bearing steel. Pure silver and lead coatings were produced by a thermal evaporation coating method. Experiments using a thrust ball bearing-typed rolling test-rig were performed under vacuum, dry air and controlled humidity conditions. Results showed that agglomeration of particles were suppressed in vacuum environment and resulted in low and stable rolling resistance by shakedown phenomena. Also, humidity related closely to the agglomeration of particles and the rolling resistance after the failure of coated layer.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1998.04a
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• pp.47-54
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• 1998

An experimental study was performed to discover the effect of environmental conditions on the rolling resistance behavior of pure silver and lead coated 52100 bearing steel. Pure silver and lead coating were produced by a thermal evaporation coating method. Experiments using a thrust ball bearing-typed rolling test-rig were performed under vacuum, dry air and controlled humidity conditions. Results showed that agglomeration of particles were prevented in vacuum environment and as it showed low and stable rolling resistance by shakedown phenomena. Also, humidity relates closely to the agglomeration of particles and increased the rolling resistance after the failure of coated layer.