• 한국정밀공학회지
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• 제30권9호
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• pp.943-950
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• 2013

This paper describes the thermal contact resistance and its effect on the performance of thermal interface material. An ASTM D 5470 based apparatus is used to measure the thermal interface resistance. Bulk thermal conductivity of different interface material is measured and compared with manufacturers' data. Also, the effect of grease void in the contact surface is investigated using the same apparatus. The flat type thermal interface tester is proposed and compared with conventional one to consider the effect of lateral heat flow. The results show that bulk thermal conductivity alone is not the basis to select the interface material because high bulk thermal conductivity interface material can have high thermal contact resistance, and that the center voiding affects the thermal interface resistance seriously. On the aspect of heat flow direction, thermal impedance of the lateral heat flow shows higher than that of the longitudinal heat flow by sixteen percent.

• Journal of Information Display
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• 제13권1호
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• pp.1-6
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• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

• 대한가정학회지
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• 제37권11호
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• pp.157-165
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• 1999

This study was carried out to examine the effect of clothing materials and multi-layered textiles on thermal resistance value. Cotton, polyester, wool, silk, rayon and acetate were selected for the specimens. Thermal resistance value was tested with 2 kinds of methods(thermo labo II and BK type tester). The results were as follows; 1. The effects of clothing materials for thermal resistance value were decreased by adding layers. 2. When the fabrics are measured with multiple layers, the fabric of the lowest thermal resistance value at single layer was showed the highest increasing tendency for all test methods.

• 한국의류학회지
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• 제13권3호
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• pp.295-303
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• 1989

This study is to measure the thermal resistance of 7 types of Parka of different materials with thermal manikin and to compare their effects on physiological responses & subjective wear sensations. Following are the results obtained from the experiments 1) From the thermal manikin experiment, i) As an outer layer, although not significant, water proof fabric was warmer than water proof-vapor permeable fabric. ii) In case of insulating material, down was better for thermal resistance than polyester wadding of the same thickness. Moreover, as the down was thicker, it had more efficiency in thermal resistance. However, the marginal efficiency of thickness was found to be decreasing. 2) From the male-subject experiments, i) Chest temperature, mean skin temperature & microclimate temperature showed the same results on thermal resistance as those of the thermal manikin experiment. ii) Only during rest periods, there was a significant difference among 5 insulating materials in the sense of microclimate humidity. The almost same conclusion was obtained from the above experiments. Even the outer layer did not significantly affect thermal resistance & subjective wear sensation, insulating materials had a significant influence upon them. But in case of 3.5 cm down, it gave less comfortable than that of the thinner. Therefore the optional one for the best comfort & thermal resistance among 7 combinatins is the outer layer of water proff-vapor permeable & insulating material of 2.1 cm down.

• Journal of Biosystems Engineering
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• 제4권2호
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• pp.53-63
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• 1979

The knowlege of thermal properties of rough rice has become of greate importance to the analysis of heat and mass transfer phenomenon in rice drying and storage process. Some information is available on the thermal properties of rough rice in foreign countries but is not available for these properties in Korea. A fundamental study was made to determine the thermal conductivity and thermal diffusivity of rough rice with line source method and to select current and resistance suitable for these properties from investigating the effect of current and resistance of heating wire on the temperature rise. The result of this study may be summarized as follows ; 1. Even through the power per unit length of heating wires is about the same, the tendency of temperature rise showed a little difference among them , and the suitable range of it for thermal properties was found to be 3.56-5.37w/m. 2. the most desirable resistance and current of heating wire was 18.40 ohm/m, 0.44 amperes among three kinds of heating wires and currents, respectively. because it took 13 minutes or so for the heating wire to reach equilibrium temperature. 3. The thermal conductivity of rough rice was 0.120-0.130 w/m$ ^\circ C$. and thermal diffusivity of it was $5.8210 $\times10^{-8} -9.7529 $\times10^{-8} m^2 /s.$ 4.The thermal conductivity showed a little difference in variation with resistance of heating wire but the variation of current of heating wire at the same resistance did not affect the thermal conductivity , and the thermal diffusivity was not affected by the variation of resistance and current.

• 한국지열·수열에너지학회논문집
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• 제8권4호
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• pp.32-40
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• 2012

Geothermal heat pump(GHP) systems use vertical borehole heat exchangers to transfer heat to and from the surrounding ground via a heat carrier fluid that circulates between the borehole and the heat pump. An Important feature associated with design parameters and system performance is the local thermal resistances between the heat carrier flow channels in the borehole and the surrounding ground. This paper deals with the in-situ experimental determination of the effective thermal properties of the ground. The recorded thermal responses together with the line-source theory are used to determine the thermal conductivity and thermal diffusivity, and the steady-state borehole thermal resistance. In addition, this paper compares the experimental borehole resistance with the results from the different empirical and theoretical relations to evaluate this resistance. Further, the performance simulation of a GHP system with vertical borehole heat exchangers was conducted to analyze the effect of the borehole thermal resistance on the system performance.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2002년도 추계학술대회 논문집
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• pp.205-208
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• 2002

Thermal design is required with considering thermal stability to verify the reliability of electric power device with using IGBT. Numerical analysis is performed to analyzed the change in thermal resistance with respect to the various thermal density of heating element. Correlations between thermal resistance and heat generation density are established. With using these correlations, performance curve is composed with respect to the change in thermal resistance of cooling conditions for natural convection and forced convection. Thermal fatigue is occurred at the Inside and outside of IGBT by repeated heat load. The crack is occurred between base plate and ceramic substrate for the inside. When the crack length is 4mm, the failure is occurred. Therefore, Thermal design method considering thermal density, thermal fatigue resistance is presented on this study and it is expected to thermal design with considering life prediction.

• 한국재료학회지
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• 제24권10호
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• pp.526-531
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• 2014

Thermal shock resistance property has recently been considered to be one of the most important basic properties, in the same way that the transverse-rupture property is important for sintered hard materials such as ceramics, cemented carbides, and cermets. Attempts were made to evaluate the thermal shock resistance property of 10 vol% TaC added Ti(C,N)-Ni cermets using the infrared radiation heating method. The method uses a thin circular disk that is heated by infrared rays in the central area with a constant heat flux. The technique makes it possible to evaluate the thermal shock strength (Tss) and thermal shock fracture toughness (Tsf) directly from the electric powder charge and the time of fracture, despite the fact that Tss and Tsf consist of the thermal properties of the material tested. Tsf can be measured for a specimen with an edge notch, while Tss cannot be measured for specimens without such a notch. It was thought, however, that Tsf might depend on the radius of curvature of the edge notch. Using the Tsf data, Tss was calculated using a consideration of the stress concentration. The thermal shock resistance property of 10 vol% TaC added Ti(C,N)-Ni cermet increased with increases in the content of nitrogen and Ni. As a result, it was considered that Tss could be applied to an evaluation of the thermal shock resistance of cermets.

• 한국의류산업학회지
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• 제1권3호
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• pp.264-274
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• 1999

최근에 사용되고 있는 남성용 정장 중, 여름용 30종, 겨울용 30종 등 총 60종을 시료로 하여 이들의 온열특성 중 보온성(무풍시=0.2 m/sec 이하, 풍속시=1.2 m/sec)과 이와 관련된 물성, 즉 공기투과도, 무게, 두께 등을 측정 및 분석하여 앙상블 및 가먼트의 보온성을 예측하는 회귀식을 개발하였다. 그 결과로는 일반적인 남성용 정장의 물성으로 두께 및 무게는 겨울용이 높았으며, 여름용과 겨울용을 확실히 구별할 수 있는 인지는 공기투과도였는데 여름용의 공기투과도는 겨울용보다 약 3~6배 정도 높았다. 남성용정장의 온열특성을 보면 겨울용 정장의 보온성이 여름용보다 높았고, 풍속이 있을 때 앙상블의 보온성은 최대 30% 정도 감소하는 경향을 나타내었다. 또한, 정장상하의 물성을 독립변수로 하여 가먼트 및 앙상블의 보온성을 추정하는 회귀식을 개발하였는데, 회귀식분석결과, 정장앙상블의 보온성에 영향을 주는 인자는 두께, 무게, 및 사이즈로 나타났다.

• 한국산학기술학회논문지
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• 제19권10호
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• pp.128-135
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• 2018

현재 지열 열펌프 시스템에 수직밀폐형 지중열교환기가 가장 많이 적용되고 있으며, 수직밀폐형 지중열교환기의 성능에 영향을 미치는 주요 인자로는 지중 열전도율(k)과 보어홀 전열저항($R_b$)이 있다. 본 연구에서는 현장에서 측정된 열응답시험 데이터를 이용하여 보어홀 전열저항을 계산하였으며 지중열교환기 개별 설계인자들(순환수유량, 파이프 수, 그라우팅재)이 보어홀 전열저항에 미치는 영향을 분석하였다. 또한 도출된 그라우팅 열저항은 문헌에 제시된 다양한 상관식과 비교 분석하였다. 시험데이터를 통해 본 시험에서의 지중열교환기 보어홀 전열저항은 0.1303 W/m.K로 나타났으며, 보어홀 전열저항에서 그라우트 열저항이 66.6 %, 파이프 열저항이 31.5 %, 순환수 대류열저항이 1.9 %를 차지하여 그라우트가 보어홀 열전달에 가장 큰 영향을 미치는 인자임을 확인하였다. 또한 각 설계인자의 설계변수가 보어홀 전열저항에 미치는 영향을 분석한 결과 실리카샌드를 혼합하여 그라우트 열전도율를 높이는 방법이 파이프 수 증가나 순환수 유량증가보다 열전달 증진에 더 효과적임을 알 수 있었다.