• Journal of Korean Association for Spatial Structures
• /
• v.23 no.3
• /
• pp.35-43
• /
• 2023

This study aims to evaluate the structural safety of a structural thermal barrier, installed inside the structure of a building and performed the role of a load-bearing element and an insulation simultaneously, contributing to the realization of net-zero buildings. To ensure the reliability of the analysis model, the analysis results derived from LS-DYNA were compared with the experimental results. Based on the results shown through the flexural experiment, the reliability of the thermal cross-section insulation structure model for slabs was validated. In addition, the effect of the UHPC block on the load support performance and its contribution to vertical deflection was verified.

• Proceedings of the Korean Geotechical Society Conference
• /
• 2010.09a
• /
• pp.263-268
• /
• 2010

Thermal characterization of geomaterials has significant implication on the geothermal energy, disposal of nuclear wastes, geological sequestration of carbon dioxides and recovery of hydrocarbon resources. Heat transfer in multiphase materials is dominated by the thermal conductivity of consisting components, porosity, degree of saturation and overburden pressure, which have been investigated by the empirical correlation at macro-scale. The thermal measurement by Transient Plane Source (TPS) and associated algorithm for interpretation of thermal behavior in geomaterials corroborate the robustness of sensing techniques. The method simultaneously provides thermal conductivity, diffusivity and volumetric heat capacity. The newly introduced thermal network model enables estimating thermal conductivity of geomaterials subjected to the effective stress, which has not been evaluated using previous thermal models. The proposed methods shows the applicability of reliability of TPS technique and thermal network model.

• Proceedings of the KIPE Conference
• /
• 2002.11a
• /
• pp.205-208
• /
• 2002

Thermal design is required with considering thermal stability to verify the reliability of electric power device with using IGBT. Numerical analysis is performed to analyzed the change in thermal resistance with respect to the various thermal density of heating element. Correlations between thermal resistance and heat generation density are established. With using these correlations, performance curve is composed with respect to the change in thermal resistance of cooling conditions for natural convection and forced convection. Thermal fatigue is occurred at the Inside and outside of IGBT by repeated heat load. The crack is occurred between base plate and ceramic substrate for the inside. When the crack length is 4mm, the failure is occurred. Therefore, Thermal design method considering thermal density, thermal fatigue resistance is presented on this study and it is expected to thermal design with considering life prediction.

• Journal of Applied Reliability
• /
• v.14 no.1
• /
• pp.45-51
• /
• 2014

Thermal shock tests at two stress levels were performed to see the life (cycles) of LPF ASSY (low pass filter assembly) at normal stress level. In this case Coffin-Manson relationship is generally used to describe the relationship between the temperature difference and the life, together with the Weibull distribution describing the life at each stress level. So for given data Coffin-Manson is fitted to predict the life at normal stress level. However, different types of models are appropriate for this type of test. Hence, a more appropriate model such as General log-linear model which can also incorporate the duration at the highest and lowest temperatures and acceleration time will be introduced.

• Journal of the Korean Society of Industry Convergence
• /
• v.3 no.1
• /
• pp.69-75
• /
• 2000

Multichip packages are comprised of dissimilar materials which expand at different rates on heating. The differential expansion must be accommodated by the various structural elements of the package. A types of heat exposures occur operation cycles. This study presents a finite element analysis simulation of flip-chip among multichip. The effects of geometries and material properties on the reliability were estimated during the analysis of temperature and thermal stress of flip-chip. From the results, it could be obtained that the more significant parameters to the reliability of flip-chip arc chip power cycle, heat convection and height of solder bump.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2011.05a
• /
• pp.22.2-22.2
• /
• 2011

Reliability and degradation mechanism of conventional phosphor-converted white GaN-based light-emitting diodes (LEDs) were investigated. Under electro-thermal stress condition, the optical output degraded rapidly at the initial stress time accompanied by the change of chromatic properties. This could be attributed to the optical degradation of packaged materials, in particular, the browning of encapsulants and the darkening of reflective packages. At longer stress times, the optical output gradually decreased according to the degree of the reverse leakage currents, namely, the generation ofnonradiative recombination defects. This indicates that the optical degradation of white LEDs are dominated by the darkening of packaged materials and the generation of defects depending on the injection current and ambient temperatures. Using analyses of electroluminescence spectra, optical microscopy, electrical, optical, and thermal properties, optical degradations of white LEDs are discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.07a
• /
• pp.129-130
• /
• 2005

The electrical stress has a major effect on the long-term reliability of the thyristor. Therefore, it is needed to analyze the relationship between reliability and stress. In this paper, we investigate the device failure mechanism which induced by the stress. And also investigate the effect of the thermal stress on the device failure and relationship between electrical and thermal stress. Two-dimensional process simulator ATHENA and device simulator ATLAS are used to analyze the failure mechanism of the device.

• Proceedings of the Korean Reliability Society Conference
• /
• 2005.06a
• /
• pp.303-305
• /
• 2005

Recently, various plastics are used for improvement of reliability and thermal stability of electronic goods. But, it is difficult to choose suitable balance of grade resin to each other product property. Selection of high efficiency resin is becoming inescapable circumstance according to change of reflow temperature of product and development of product following to lead free. Using a inexpensive and reasonable resin, that sustain a uniform performance of product quality. It is make a robust product and increase a company's competitive power. Hereupon, I introduce example that use ESPI methods of thermal deformation analysis of product using in our company product. I try to refer to a structural weak point detection of real time measurement of electronic parts instead of mechanical and chemical measurement of specimen type.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.8
• /
• pp.180-186
• /
• 2002

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8＂)\;to\;\Phi300mm$ (wafer 12＂) and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.2 s.43
• /
• pp.35-40
• /
• 2007

The pull strength and fracture mechanism were investigated to evaluate the reliability and compatibility of Sn-8Zn-3Bi joints, the solder paste on lead and lead-free plating under thermal shock conditions. At the Sn-8Zn-3Bi solder joint, no crack initiation was observed during thermal shock test. After 1000 cycles, the strength of the solder joint decreased not sharply but reduced gradually compared with initial conditions. The decrement of strength was affected by ${\gamma}-Cu_5Zn_8$ IMC growth which caused the IMC fracture on the fracture surface and a change in fracture mode and initial crack point. Clearly, the Sn-8Zn-3Bi solder shows good reliability properties and compatibility with lead-free plated Cu LF under thermal shock temperatures between 248K and 423K.