• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.145-164
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• 2004

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.135-150
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• 2006

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.47-47
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• 2004

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.75-75
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• 2004

• The monthly packaging world
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• s.201
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• pp.82-88
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• 2010

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.04a
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• pp.11-28
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• 2005

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.1
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• pp.27-34
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• 2015

Heating patterns depending on the packaging materials were examined in order to investigate the causes of thermal deformation of packages used for ready-to-eat foods for microwave heating due to the non-uniformity of microwaves. Physical properties including tensile strength, heat-resistance and elongation of four different CPP grades were compared. High retortable CPP had higher sealing strength and heat resistance compared to the conventional CPPs. All CPP samples tested were proved to have melting temperatures around $160^{\circ}C$. However, they were all thermally deformed by microwave heating due to a limited penetration of microwave and non-uniform heating within the spicy sauce of high viscosity contained high salt, especially on the above the filling line and sealing edge of pouches. When the laminated stand-up pouches composed of G-PET/PET/PET/CPP and G-PET/PET/NY/CPP were retorted and microwaved, significant deformations were noticed in both samples after retorting. Besides, pouches contained titanium dioxide showed more intense thermal deformation than the control. When the $10{\mu}m$ aluminium foil was affixed on the pouch, small thermal deformation was observed only in the bottom layer. More studies are required to prevent the thermal deformation of packaging materials used for RTE foods during microwave heating by developing the technologies to increase the thermal stability of CPP layer and the modification of packaging design to modify the microwave access into the package.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.49-55
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• 2016

Nowadays there are magnetic sensors in a wide variety of equipment such as computers, cars, airplanes, medical and industrial instruments. In many of these applications the magnetic sensors offer safe and non-invasive means of detection and are more reliable than other technologies. The electric current in a conductor generates a magnetic field detected by this type of sensor. This work aims to define a package dedicated to an electrical current sensor using a MTJ (Magnetic Tunnel Junction) as a sensing device. Four different proposals of packaging, three variations of the chip on board (CoB) package type and one variation of the thin small outline package (TSOP) were analyzed by COMSOL modeling software by simulating a brad range of current injection. The results obtained from the thermal and magnetic analysis has proven to be very important for package improvements, specially for heat dissipation performance.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.203-207
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• 2002

CSP(Chip Size Packaging) SAW Filter Package에 대해서, 유한요소해석(Finite Element Analysis) 컴퓨터 Simulation 프로그램인 ANSYS를 이용하여 Package의 온도 분포를 해석하였다. 신뢰성(reliability) Test 조건에서 Transient Thermal Simulation을 한 후, 조건을 변화시켜 가면서 Chip 내부 온도가 어떻게 변화하는지 알아보았다. Chip에 1.8 hour 동안 4W의 열원을 주고, 주위는 2$0^{\circ}C$ 자연대류로 놓고 Transient Thermal Simulation한 결과는 약 99$^{\circ}C$로, 허용 가능한 온도인 11$0^{\circ}C$보다 약 11$^{\circ}C$ 낮음을 알 수 있었다. 또한 이는 실험값인 약 95$^{\circ}C$와 유사한 값을 나타내었다.